BZD27C30P RUG Equivalent & Substitute Parts

Part Overview

The BZD27C30P RUG is a 30 V, 1 W Zener diode manufactured by Taiwan Semiconductor Corporation in Surface Mount Sub SMA packaging (DO-219AB). This component is classified as Active and is ROHS3 Compliant. Substitute parts are identified when equivalent electrical performance and mechanical compatibility are required for design flexibility, supply chain optimization, or specific application requirements such as automotive qualification.

Substiute Parts

BZD27C30P RUG
Taiwan Semiconductor CorporationIn Stock: 942BZD27C30P RUG Datasheet
BZD27C30P RUG
Current Part
BZD27C30P-E3-08
Vishay General Semiconductor - Diodes DivisionIn Stock: 17237BZD27C30P-E3-08 Datasheet
BZD27C30P-E3-08
Similar
BZD27C30P-HE3-08
Vishay General Semiconductor - Diodes DivisionIn Stock: 30511BZD27C30P-HE3-08 Datasheet
BZD27C30P-HE3-08
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Key Parameters

Parameter Value
Voltage - Zener (Nom) 30 V
Power - Max 1 W
Impedance (Max) 15 Ohms
Current - Reverse Leakage @ Vr 1 µA @ 22 V
Voltage - Forward (Vf) (Max) @ If 1.2 V @ 200 mA
Operating Temperature Range -55°C ~ 175°C (TJ)
Package / Case DO-219AB
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitute parts for the BZD27C30P RUG are identified based on the following critical parameters that determine functional equivalence:

Electrical Equivalence Criteria:

  • Zener voltage: 30 V nominal
  • Impedance (Max): 15 Ohms
  • Current - Reverse Leakage @ Vr: 1 µA @ 22 V
  • Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA

Mechanical & Environmental Compatibility:

  • Package / Case: DO-219AB (Surface Mount)
  • Mounting Type: Surface Mount
  • RoHS Status: ROHS3 Compliant
  • Moisture Sensitivity Level: 1 (Unlimited)

Power Rating Consideration: The substitute parts BZD27C30P-E3-08 and BZD27C30P-HE3-08 operate at 800 mW maximum power, which is lower than the main part's 1 W rating. These substitutes are functionally equivalent for applications where the 800 mW power dissipation is sufficient and do not exceed the thermal design requirements of the circuit.

Parameter Comparison

Parameter BZD27C30P RUG BZD27C30P-E3-08 BZD27C30P-HE3-08
Manufacturer Taiwan Semiconductor Corporation Vishay General Semiconductor - Diodes Division Vishay General Semiconductor - Diodes Division
Voltage - Zener (Nom) 30 V 30 V 30 V
Power - Max 1 W 800 mW 800 mW
Impedance (Max) 15 Ohms 15 Ohms 15 Ohms
Current - Reverse Leakage @ Vr 1 µA @ 22 V 1 µA @ 22 V 1 µA @ 22 V
Voltage - Forward (Vf) (Max) @ If 1.2 V @ 200 mA 1.2 V @ 200 mA 1.2 V @ 200 mA
Operating Temperature Range -55°C ~ 175°C -65°C ~ 175°C -65°C ~ 175°C
Package / Case DO-219AB DO-219AB DO-219AB
Mounting Type Surface Mount Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
Automotive Grade Not specified Not specified AEC-Q101 Qualified

Engineering Selection Recommendations

BZD27C30P-E3-08 (Vishay General Semiconductor - Diodes Division): This substitute maintains electrical equivalence across all critical parameters including zener voltage, impedance, reverse leakage current, and forward voltage characteristics. The 800 mW power rating is suitable for applications where thermal dissipation does not exceed this threshold. Operating temperature range extends to -65°C, providing enhanced low-temperature performance. ROHS3 compliance and MSL 1 rating ensure environmental and moisture compatibility.

BZD27C30P-HE3-08 (Vishay General Semiconductor - Diodes Division): This substitute provides identical electrical and mechanical specifications to BZD27C30P-E3-08 with the addition of AEC-Q101 automotive qualification. Selection of this part is appropriate for automotive applications requiring formal qualification documentation and extended reliability assurance. All electrical parameters, package specifications, and compliance certifications remain equivalent to the primary substitute.

Frequently Asked Questions (FAQ)

Q: Can BZD27C30P-E3-08 or BZD27C30P-HE3-08 be used as direct replacements for BZD27C30P RUG?

A: Both substitute parts are electrically equivalent across all critical parameters: 30 V zener voltage, 15 Ohms maximum impedance, 1 µA reverse leakage current at 22 V, and 1.2 V forward voltage at 200 mA. The 800 mW power rating is lower than the main part's 1 W rating and must be verified against circuit thermal requirements. Package and mounting specifications are identical (DO-219AB, Surface Mount).

Q: What is the difference between BZD27C30P-E3-08 and BZD27C30P-HE3-08?

A: Both parts are manufactured by Vishay General Semiconductor - Diodes Division and share identical electrical and mechanical specifications. BZD27C30P-HE3-08 includes AEC-Q101 automotive qualification, making it suitable for automotive applications requiring formal qualification documentation. Selection depends on application requirements and qualification mandates.

Q: Are there any temperature range differences between the main part and substitutes?

A: The main part BZD27C30P RUG operates from -55°C to 175°C. Both substitute parts extend the lower temperature limit to -65°C, providing enhanced performance in cold environments. The upper temperature limit remains 175°C for all three parts.

Q: What compliance certifications apply to all three parts?

A: All three parts are ROHS3 Compliant, REACH Unaffected, and classified as MSL 1 (Unlimited moisture sensitivity level). BZD27C30P-HE3-08 additionally carries AEC-Q101 automotive qualification.

Q: Can the 800 mW substitute parts handle the same power dissipation as the 1 W main part?

A: The substitute parts are rated for 800 mW maximum power dissipation. Circuit design must ensure that actual power dissipation does not exceed this rating. Applications requiring sustained 1 W dissipation must use the main part or verify that operating conditions remain below 800 mW.

Q: Are the package dimensions identical across all three parts?

A: All three parts use the DO-219AB package for Surface Mount applications. Package dimensions and land pattern specifications are identical, ensuring PCB layout compatibility without modification.

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