BZD17C200P RVG Equivalent & Substitute Parts

Part Overview

The BZD17C200P RVG is an active-status Zener diode manufactured by Taiwan Semiconductor Corporation, rated for 200 V nominal Zener voltage with 800 mW maximum power dissipation. This component is packaged in Sub SMA (DO-219AB) surface mount configuration and is ROHS3 compliant with unlimited moisture sensitivity rating. Substitute parts are identified when equivalent electrical performance parameters are maintained within specified tolerances while accommodating different packaging or power rating requirements in system designs.

Substiute Parts

BZD17C200P RVG

Taiwan Semiconductor CorporationIn Stock: 760BZD17C200P RVG Datasheet

Current PartRFQ

BZD27C200PW

Taiwan Semiconductor CorporationIn Stock: 4329BZD27C200PW Datasheet

MFR RecommendedRFQ

BZD27C200P-HE3-08

Vishay General Semiconductor - Diodes DivisionIn Stock: 30908BZD27C200P-HE3-08 Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the BZD17C200P RVG is determined by the following critical parameters:

Primary Matching Criteria:

• Zener voltage: 200 V nominal
• Reverse leakage current: 1 µA @ 150 V
• Forward voltage: 1.2 V @ 200 mA maximum
• Operating temperature range: -55°C to 175°C minimum
• Surface mount configuration
• RoHS3 compliance

Secondary Compatibility Factors:

• Power dissipation rating (800 mW or higher)
• Impedance specification (750 Ohms or lower)
• Package form factor (DO-219AB or equivalent sub-miniature surface mount)

Two substitute parts meet these criteria with the following distinctions:

BZD27C200PW (Taiwan Semiconductor Corporation): Maintains identical Zener voltage and leakage specifications with improved power rating (1 W) and tighter tolerance (±5%). Package differs to SOD-123W form factor.

BZD27C200P-HE3-08 (Vishay General Semiconductor): Maintains identical Zener voltage, leakage, and forward voltage specifications in matching DO-219AB package. Includes automotive-grade qualification (AEC-Q101) with extended lower temperature rating (-65°C). Impedance specification is lower (500 Ohms).

Parameter Comparison

Engineering Selection Recommendations

BZD27C200PW Selection Criteria: This substitute is appropriate when higher power dissipation capacity (1 W versus 800 mW) is required within the same voltage class. The tighter tolerance specification (±5%) provides improved voltage regulation characteristics. SOD-123W packaging offers reduced footprint compared to DO-219AB. This part maintains identical operating temperature range and RoHS3 compliance. Selection is suitable for applications where package size optimization is prioritized and power budget permits the alternative form factor.

BZD27C200P-HE3-08 Selection Criteria: This substitute provides direct package compatibility (DO-219AB) with the original part while offering automotive-grade qualification (AEC-Q101). The extended lower operating temperature limit (-65°C versus -55°C) accommodates wider environmental specifications. Lower impedance specification (500 Ohms) provides improved voltage regulation performance. This part is appropriate for applications requiring automotive-grade components or extended low-temperature operation while maintaining identical mechanical and thermal interfaces.

Compliance Considerations: All three parts maintain ROHS3 compliance, unlimited moisture sensitivity rating (MSL 1), and REACH unaffected status. All parts are classified under identical HTSUS and ECCN codes.

Frequently Asked Questions (FAQ)

Q: Can BZD27C200PW be used as a direct replacement for BZD17C200P RVG?

A: BZD27C200PW is electrically compatible with identical Zener voltage (200 V) and reverse leakage specifications. However, the package differs from DO-219AB (Sub SMA) to SOD-123W form factor. PCB layout modifications are required. The substitute offers improved power rating (1 W) and tighter tolerance (±5%). Compatibility depends on available PCB footprint space and thermal management requirements.

Q: What are the advantages of BZD27C200P-HE3-08 over the original part?

A: BZD27C200P-HE3-08 maintains identical DO-219AB packaging, eliminating layout redesign requirements. The part includes automotive-grade qualification (AEC-Q101) and extended lower temperature operation (-65°C). Impedance specification is lower (500 Ohms versus 750 Ohms), providing superior voltage regulation. These characteristics make this substitute suitable for automotive applications or systems requiring enhanced environmental performance.

Q: Are there thermal management differences between these parts?

A: All three parts share identical maximum power dissipation thermal characteristics within their respective ratings. BZD17C200P RVG and BZD27C200P-HE3-08 are both rated 800 mW. BZD27C200PW provides 1 W capacity. Thermal interface and PCB copper area requirements depend on actual power dissipation in the application, not the part rating alone.

Q: Which substitute is recommended for space-constrained designs?

A: BZD27C200PW in SOD-123W packaging provides the smallest footprint among the three options. This package form factor is appropriate when PCB real estate is limited. Verify that the alternative package dimensions are compatible with existing circuit board layout and assembly equipment specifications.

Q: Do all substitutes maintain the same voltage tolerance?

A: BZD17C200P RVG specifies ±6% tolerance. BZD27C200PW specifies ±5% tolerance, providing tighter voltage regulation. BZD27C200P-HE3-08 does not specify tolerance in the provided data. For applications requiring specific tolerance bands, verify tolerance specifications against system requirements before selection.

Q: Are there inventory or lead time considerations?

A: BZD27C200P-HE3-08 maintains the highest inventory level (30,870 pcs). BZD27C200PW has 4,275 pcs available. BZD17C200P RVG has 731 pcs in stock. Inventory levels may influence procurement timelines for high-volume production requirements.