BZD17C200P RFG Equivalent & Substitute Parts

Part Overview

The BZD17C200P RFG is a Zener diode manufactured by Taiwan Semiconductor Corporation, rated for 200 V nominal Zener voltage with 800 mW maximum power dissipation. This component is designed for surface mount applications in the Sub SMA package configuration (DO-219AB). The device is currently in active production status with 906 pieces available in inventory.

Substitute parts are identified when equivalent electrical performance and mechanical compatibility are maintained across critical parameters including Zener voltage rating, power dissipation capability, package type, and operating temperature range. Substitution becomes necessary when the primary part experiences supply constraints, extended lead times, or when design requirements permit selection from multiple qualified sources.

Substiute Parts

BZD17C200P RFG

Taiwan Semiconductor CorporationIn Stock: 978BZD17C200P RFG Datasheet

Current PartRFQ

BZD27C200P-HE3-08

Vishay General Semiconductor - Diodes DivisionIn Stock: 30908BZD27C200P-HE3-08 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the BZD17C200P RFG is determined by strict equivalence across the following critical parameters:

Electrical Equivalence Requirements:

• Zener voltage rating: 200 V nominal
• Maximum power dissipation: 800 mW
• Reverse leakage current: 1 µA @ 150 V
• Forward voltage: 1.2 V @ 200 mA

Mechanical Compatibility Requirements:

• Package type: DO-219AB (Sub SMA / SMF)
• Mounting configuration: Surface Mount
• Environmental compliance: ROHS3 Compliant, REACH Unaffected

Operational Requirements:

• Operating temperature range must encompass or exceed -55°C to 175°C

The BZD27C200P-HE3-08 manufactured by Vishay General Semiconductor meets all electrical and mechanical equivalence criteria. This substitute maintains identical Zener voltage, power rating, reverse leakage characteristics, and forward voltage specifications. Both components utilize the DO-219AB package for surface mount assembly. The substitute part extends the lower operating temperature limit to -65°C, providing enhanced cold-temperature performance while maintaining the upper temperature limit at 175°C.

Parameter Comparison

Engineering Selection Recommendations

Primary Part Selection (BZD17C200P RFG): The BZD17C200P RFG remains the specified component when supply availability is confirmed and design requirements do not necessitate extended low-temperature performance. This part is actively manufactured and maintains full ROHS3 compliance with unlimited moisture sensitivity rating.

Substitute Part Selection (BZD27C200P-HE3-08): The BZD27C200P-HE3-08 is selected when the primary part experiences supply constraints or when applications require operation at temperatures below -55°C. This substitute is manufactured by Vishay General Semiconductor and carries AEC-Q101 automotive qualification, indicating enhanced reliability screening. The substitute maintains all critical electrical parameters and package compatibility while providing superior impedance characteristics (500 Ohms maximum versus 750 Ohms) and extended low-temperature operation to -65°C.

Both parts maintain active production status, ROHS3 compliance, and REACH unaffected designation. Selection between these parts is based on availability, supply chain requirements, and specific application temperature demands rather than functional performance differences.

Frequently Asked Questions (FAQ)

Q: Can the BZD27C200P-HE3-08 be used as a direct replacement for the BZD17C200P RFG?

A: Yes. Both components share identical Zener voltage (200 V), power rating (800 mW), reverse leakage current (1 µA @ 150 V), forward voltage (1.2 V @ 200 mA), and package configuration (DO-219AB surface mount). The substitute part is electrically and mechanically compatible for direct substitution in existing designs.

Q: What is the difference in impedance between these parts?

A: The BZD17C200P RFG specifies maximum impedance of 750 Ohms, while the BZD27C200P-HE3-08 specifies 500 Ohms maximum. The lower impedance of the substitute part provides improved dynamic response characteristics and is not a limiting factor for substitution.

Q: Are there temperature range differences between these parts?

A: Yes. The BZD17C200P RFG operates from -55°C to 175°C, while the BZD27C200P-HE3-08 extends the lower limit to -65°C. Both maintain the same upper temperature limit of 175°C. The substitute part accommodates applications requiring enhanced cold-temperature performance.

Q: Do both parts meet the same compliance standards?

A: Both parts are ROHS3 compliant, REACH unaffected, and carry unlimited moisture sensitivity rating (MSL 1). The substitute part additionally carries AEC-Q101 automotive qualification, indicating enhanced reliability screening protocols.

Q: What is the packaging difference between these parts?

A: Both parts use the DO-219AB package for surface mount assembly. The main part is supplied as Sub SMA, while the substitute is supplied in Tape & Reel (TR) format. The physical package dimensions and land pattern remain identical for PCB assembly compatibility.

Q: Which part should be selected for new designs?

A: Either part is acceptable for new designs. Selection is based on supply availability, cost considerations, and specific application requirements. If extended low-temperature operation below -55°C is required, the BZD27C200P-HE3-08 is the appropriate choice. For standard applications within the -55°C to 175°C range, either part provides equivalent performance.