BYW73-TR Equivalent & Substitute Parts

Part Overview

The BYW73-TR is an avalanche diode rated for 300 V DC reverse voltage and 3 A average rectified current, manufactured by Vishay General Semiconductor - Diodes Division. This through-hole component features fast recovery characteristics with a reverse recovery time of 200 ns and operates across a junction temperature range of -55°C to 175°C. The device is packaged in SOD-64 axial configuration and is ROHS3 compliant with MSL 1 rating.

Equivalent and substitute parts are identified when components share identical or compatible electrical ratings and mechanical specifications, enabling direct replacement in circuit applications without functional degradation.

Substiute Parts

BYW73-TR
Vishay General Semiconductor - Diodes DivisionIn Stock: 1117BYW73-TR Datasheet
BYW73-TR
Current Part
EGP30F
Fairchild SemiconductorIn Stock: 3665EGP30F Datasheet
EGP30F
MFR Recommended

Key Parameters

Parameter Value
Voltage - DC Reverse (Vr) (Max) 300 V
Current - Average Rectified (Io) 3 A
Voltage - Forward (Vf) (Max) @ If 1.1 V @ 3 A
Reverse Recovery Time (trr) 200 ns
Current - Reverse Leakage @ Vr 5 µA @ 300 V
Speed Classification Fast Recovery ≤ 500 ns, > 200 mA (Io)
Mounting Type Through Hole
Operating Temperature - Junction -55°C ~ 175°C
Package / Case SOD-64, Axial

Substitute Part Grouping Explanation

Substitution of the BYW73-TR is determined by equivalence in the following critical parameters:

Electrical Compatibility Requirements:

  • Voltage - DC Reverse (Vr) (Max): 300 V minimum
  • Current - Average Rectified (Io): 3 A minimum
  • Speed Classification: Fast Recovery ≤ 500 ns, > 200 mA (Io)
  • Current - Reverse Leakage @ Vr: 5 µA @ 300 V maximum

Mechanical Compatibility Requirements:

  • Mounting Type: Through Hole
  • Package Configuration: Axial lead geometry

The EGP30F from Fairchild Semiconductor meets all electrical requirements with identical voltage and current ratings, matching fast recovery speed classification and reverse leakage specifications. While packaged in DO-201AD rather than SOD-64, both are axial through-hole configurations with compatible lead spacing for standard PCB footprints.

Parameter Comparison

Parameter BYW73-TR (Vishay) EGP30F (Fairchild)
Voltage - DC Reverse (Vr) (Max) 300 V 300 V
Current - Average Rectified (Io) 3 A 3 A
Voltage - Forward (Vf) (Max) @ If 1.1 V @ 3 A 1.25 V @ 3 A
Speed Classification Fast Recovery ≤ 500 ns, > 200 mA (Io) Fast Recovery ≤ 500 ns, > 200 mA (Io)
Reverse Recovery Time (trr) 200 ns 50 ns
Current - Reverse Leakage @ Vr 5 µA @ 300 V 5 µA @ 300 V
Mounting Type Through Hole Through Hole
Package / Case SOD-64, Axial DO-201AD, Axial
Operating Temperature - Junction -55°C ~ 175°C -65°C ~ 150°C
Product Status Active Active

Engineering Selection Recommendations

Both the BYW73-TR and EGP30F are active products with equivalent electrical performance for 300 V, 3 A rectification applications. The BYW73-TR operates across a wider junction temperature range (-55°C to 175°C) compared to the EGP30F (-65°C to 150°C), making the BYW73-TR suitable for higher-temperature environments.

The EGP30F exhibits superior reverse recovery time (50 ns versus 200 ns), resulting in lower switching losses in high-frequency applications. Forward voltage drop is slightly higher on the EGP30F (1.25 V versus 1.1 V at 3 A), which may increase power dissipation in continuous conduction scenarios.

Both components are ROHS3 compliant and carry EAR99 ECCN classification. Package differences (SOD-64 versus DO-201AD) require verification of PCB footprint compatibility, though both are standard axial through-hole configurations.

Frequently Asked Questions (FAQ)

Q: Can the EGP30F directly replace the BYW73-TR in all applications?

A: Electrical substitution is valid for applications within the overlapping operating temperature range (-55°C to 150°C). Applications requiring junction temperatures above 150°C require the BYW73-TR. PCB footprint compatibility must be verified due to package differences between SOD-64 and DO-201AD.

Q: What is the significance of the reverse recovery time difference?

A: The EGP30F has a reverse recovery time of 50 ns compared to the BYW73-TR's 200 ns. This results in lower switching losses and reduced electromagnetic interference in high-frequency switching applications. For low-frequency rectification, this difference has minimal impact.

Q: Are there compliance or certification differences between these parts?

A: Both components are ROHS3 compliant, REACH unaffected, and carry EAR99 ECCN classification. No compliance barriers exist for substitution.

Q: How do forward voltage drops compare?

A: The BYW73-TR has a maximum forward voltage of 1.1 V at 3 A, while the EGP30F is rated at 1.25 V at 3 A. In continuous conduction applications, the BYW73-TR dissipates less power. The 0.15 V difference is significant in low-voltage, high-current designs.

Q: What packaging considerations apply to substitution?

A: The BYW73-TR uses SOD-64 axial packaging while the EGP30F uses DO-201AD axial packaging. Both are through-hole components with axial lead geometry. Physical dimensions and lead spacing must be verified against PCB footprint specifications before substitution.

Q: Which part should be selected for new designs?

A: Selection depends on application requirements. For maximum temperature range capability, select BYW73-TR. For applications prioritizing low switching losses and reverse recovery performance, select EGP30F. Both are active products with established supply chains.

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