BYW73-TAP Equivalent & Substitute Parts

Part Overview

The BYW73-TAP is an avalanche diode manufactured by Vishay General Semiconductor - Diodes Division, rated for 300V DC reverse voltage and 3A average rectified current. This through-hole component features fast recovery characteristics with a reverse recovery time of 200 ns and operates across a junction temperature range of -55°C to 175°C. The device is packaged in SOD-64 axial configuration and maintains Active product status with full RoHS3 compliance and REACH unaffected designation.

Substitute components become necessary when the primary part experiences extended lead times, inventory constraints, or when design flexibility permits alternative packaging configurations while maintaining electrical performance within specified parameters.

Substiute Parts

BYW73-TAP

Vishay General Semiconductor - Diodes DivisionIn Stock: 947BYW73-TAP Datasheet

Current PartRFQ

EGP30F

Fairchild SemiconductorIn Stock: 3665EGP30F Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the BYW73-TAP is determined by the following critical electrical and mechanical parameters:

Mandatory Matching Parameters:

• Voltage - DC Reverse (Vr) (Max): 300 V minimum
• Current - Average Rectified (Io): 3 A minimum
• Mounting Type: Through Hole
• Speed Classification: Fast Recovery ≤ 500ns, > 200mA (Io)
• Current - Reverse Leakage @ Vr: 5 µA @ 300 V maximum

Acceptable Variation Parameters:

• Voltage - Forward (Vf) (Max) @ If: Within circuit design tolerance
• Reverse Recovery Time (trr): Faster recovery times acceptable
• Package / Case: Alternative axial through-hole configurations permitted
• Operating Temperature - Junction: Extended ranges acceptable

The EGP30F qualifies as a substitute based on matching all mandatory electrical parameters while offering improved reverse recovery time (50 ns versus 200 ns) and alternative packaging in DO-201AD axial configuration.

Parameter Comparison

Engineering Selection Recommendations

BYW73-TAP Selection Criteria:

• Primary choice when SOD-64 package footprint is specified in design documentation
• Required when operating junction temperatures exceed 150°C
• Preferred for Vishay component standardization within existing designs
• Suitable when forward voltage drop of 1.1 V @ 3 A is critical to circuit performance

EGP30F Selection Criteria:

• Acceptable substitute when DO-201AD axial package accommodates PCB layout requirements
• Preferred when faster reverse recovery time (50 ns) provides circuit performance benefits
• Suitable when operating junction temperatures remain within -65 to 150°C range
• Applicable when forward voltage drop of 1.25 V @ 3 A is within circuit design tolerance
• Recommended when inventory availability or lead time constraints favor Fairchild Semiconductor sourcing

Both components maintain Active product status, full RoHS3 compliance, and REACH unaffected designation. Selection between these parts depends on package compatibility, thermal operating range requirements, and forward voltage drop specifications within the target application.

Frequently Asked Questions (FAQ)

Q: Can EGP30F directly replace BYW73-TAP in existing designs?

A: Electrical substitution is valid when circuit design accommodates the DO-201AD package footprint and the forward voltage drop increase from 1.1 V to 1.25 V @ 3 A. Physical board layout modifications may be required due to different axial package dimensions between SOD-64 and DO-201AD configurations.

Q: What is the significance of the reverse recovery time difference?

A: The EGP30F exhibits 50 ns reverse recovery time compared to BYW73-TAP's 200 ns. This faster recovery reduces switching losses and electromagnetic interference in high-frequency applications. Both devices meet the Fast Recovery classification requirement of ≤ 500ns for currents > 200mA.

Q: Are there thermal operating range limitations when substituting?

A: The BYW73-TAP operates to 175°C junction temperature, while EGP30F maximum is 150°C. Applications requiring sustained operation above 150°C junction temperature must use BYW73-TAP. The EGP30F minimum operating temperature of -65°C extends below BYW73-TAP's -55°C specification.

Q: How do forward voltage drops affect circuit design?

A: The 0.15 V difference in forward voltage drop (1.1 V versus 1.25 V @ 3 A) impacts power dissipation and voltage regulation. In 3 A applications, this represents 0.45 W additional dissipation with EGP30F. Circuit designs must verify this increase remains within thermal and performance specifications.

Q: What packaging considerations apply to substitution?

A: BYW73-TAP uses SOD-64 axial package while EGP30F uses DO-201AD axial package. Both are through-hole axial configurations with different physical dimensions. PCB layout verification is required to confirm lead spacing and component height compatibility with existing board designs.

Q: Do both parts maintain equivalent compliance certifications?

A: Both BYW73-TAP and EGP30F are Active products with RoHS3 compliance and REACH unaffected status. ECCN and HTSUS classifications are identical (EAR99 and 8541.10.0080 respectively), supporting equivalent regulatory and export compliance.