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BYT53G-TAP Equivalent & Substitute Parts
Part Overview
The BYT53G-TAP is an avalanche diode manufactured by Vishay General Semiconductor - Diodes Division, rated for 400V DC reverse voltage with 1.9A average rectified current. This through-hole component in SOD-57 axial package is designed for fast recovery applications with a reverse recovery time of 50 nanoseconds. The part is currently active in production with full RoHS3 compliance and unlimited moisture sensitivity rating. Substitute parts are identified when equivalent electrical performance is required due to inventory constraints, application redesign, or sourcing optimization while maintaining functional compatibility within specified parameter ranges.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - DC Reverse (Vr) (Max) | 400 | V |
| Current - Average Rectified (Io) | 1.9 | A |
| Voltage - Forward (Vf) (Max) @ If | 1.1 V @ 1 A | V |
| Reverse Recovery Time (trr) | 50 | ns |
| Current - Reverse Leakage @ Vr | 5 | µA @ 400 V |
| Mounting Type | Through Hole | - |
| Package / Case | SOD-57, Axial | - |
| Operating Temperature - Junction | -55 to 175 | °C |
| Technology | Avalanche | - |
| Product Status | Active | - |
Substitute Part Grouping Explanation
Substitution of the BYT53G-TAP is determined by electrical parameter equivalence within the following critical specifications:
Voltage Rating Compatibility: The substitute part must maintain a DC reverse voltage rating of 400V or greater to ensure safe operation in the same circuit topology.
Current Rating Compatibility: The substitute part must support an average rectified current of 1.9A or greater, ensuring the component can handle the application's current demands without thermal stress.
Recovery Characteristics: Fast recovery performance with reverse recovery time of 50 nanoseconds or less is required to maintain switching speed and minimize switching losses in the target application.
Reverse Leakage Current: Maximum reverse leakage of 5 microamperes at 400V ensures acceptable standby current performance and thermal stability.
Mounting Configuration: Through-hole axial mounting is required for mechanical compatibility with existing PCB layouts and assembly processes.
Temperature Range: Operating junction temperature range must encompass the application's thermal environment. The substitute part's temperature range must be compatible with or exceed the original specification.
The EGP20G meets all substitution criteria through equivalent or superior electrical performance across these parameters.
Parameter Comparison
| Parameter | BYT53G-TAP | EGP20G | Compatibility |
|---|---|---|---|
| Voltage - DC Reverse (Vr) (Max) | 400 V | 400 V | Equivalent |
| Current - Average Rectified (Io) | 1.9 A | 2 A | Substitute Rated Higher |
| Voltage - Forward (Vf) (Max) @ If | 1.1 V @ 1 A | 1.25 V @ 2 A | Comparable |
| Reverse Recovery Time (trr) | 50 ns | 50 ns | Equivalent |
| Current - Reverse Leakage @ Vr | 5 µA @ 400 V | 5 µA @ 400 V | Equivalent |
| Mounting Type | Through Hole | Through Hole | Equivalent |
| Package / Case | SOD-57, Axial | DO-204AC, DO-15, Axial | Different Package |
| Operating Temperature - Junction | -55 to 175 °C | -65 to 150 °C | Partially Overlapping |
| Product Status | Active | Active | Both Active |
Engineering Selection Recommendations
Electrical Equivalence: The EGP20G provides equivalent or superior electrical performance across all critical parameters. The substitute part's 2A current rating exceeds the BYT53G-TAP requirement of 1.9A, providing additional design margin. Reverse voltage, recovery time, and leakage current specifications are identical.
Compliance Status: Both parts maintain RoHS3 compliance and carry EAR99 ECCN classification, ensuring regulatory compatibility for equivalent applications.
Temperature Consideration: The BYT53G-TAP operates to 175°C junction temperature, while the EGP20G maximum is 150°C. Applications requiring operation above 150°C junction temperature require the original BYT53G-TAP specification.
Package Transition: The EGP20G uses DO-15 package versus the BYT53G-TAP SOD-57 package. Both are through-hole axial configurations with similar physical dimensions suitable for standard PCB layouts. PCB footprint verification is required prior to substitution to confirm mechanical compatibility.
Inventory and Sourcing: The EGP20G maintains significantly higher inventory availability (36,600 pieces) compared to BYT53G-TAP (4,660 pieces), supporting supply chain continuity and lead time reduction.
Frequently Asked Questions (FAQ)
Q: Can the EGP20G directly replace the BYT53G-TAP in all applications?
A: The EGP20G provides electrical equivalence for applications operating within -55°C to 150°C junction temperature range. Applications requiring operation above 150°C must retain the BYT53G-TAP. Package differences (DO-15 versus SOD-57) require PCB footprint verification for mechanical compatibility.
Q: What are the key electrical differences between these parts?
A: Both parts share identical 400V reverse voltage rating, 50ns reverse recovery time, and 5µA reverse leakage current. The EGP20G is rated for 2A average rectified current versus 1.9A for the BYT53G-TAP, providing additional current margin. Forward voltage specifications differ due to different measurement conditions (1.25V @ 2A for EGP20G versus 1.1V @ 1A for BYT53G-TAP).
Q: Are there package compatibility concerns?
A: The BYT53G-TAP uses SOD-57 axial package while the EGP20G uses DO-15 axial package. Both are through-hole components with similar form factors. Physical dimensions and lead spacing must be verified against PCB footprint requirements before substitution.
Q: What compliance certifications apply to both parts?
A: Both the BYT53G-TAP and EGP20G are RoHS3 compliant and classified as EAR99 for export control purposes. Both carry HTSUS code 8541.10.0080 for tariff classification.
Q: Which part should be selected for high-temperature applications?
A: The BYT53G-TAP supports junction temperatures to 175°C and is required for applications exceeding 150°C. The EGP20G maximum junction temperature of 150°C limits its use to lower temperature environments.
Q: Is reverse recovery time performance identical between these parts?
A: Yes, both parts specify 50 nanosecond reverse recovery time with fast recovery performance for switching applications exceeding 200mA.
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