BYG10MHE3_A/I Equivalent & Substitute Parts

Part Overview

The BYG10MHE3_A/I is an avalanche diode manufactured by Vishay General Semiconductor - Diodes Division, rated for 1000 V DC reverse voltage and 1.5 A average rectified current. This surface mount rectifier diode in DO-214AC (SMA) package is designed for applications requiring avalanche breakdown protection and standard recovery characteristics. The part is active in production status and carries automotive-grade qualification under AEC-Q101 standard. Substitute parts are identified based on identical electrical performance parameters and compatible packaging configurations, enabling component selection flexibility across different supply channels and packaging formats.

Substiute Parts

BYG10MHE3_A/I
Vishay General Semiconductor - Diodes DivisionIn Stock: 891BYG10MHE3_A/I Datasheet
BYG10MHE3_A/I
Current Part
BYG10M-E3/TR
Vishay General Semiconductor - Diodes DivisionIn Stock: 77517BYG10M-E3/TR Datasheet
BYG10M-E3/TR
Parametric Equivalent
BYG10M-E3/TR3
Vishay General Semiconductor - Diodes DivisionIn Stock: 7916BYG10M-E3/TR3 Datasheet
BYG10M-E3/TR3
Parametric Equivalent

Key Parameters

Parameter Value Unit
Voltage - DC Reverse (Vr) (Max) 1000 V
Current - Average Rectified (Io) 1.5 A
Voltage - Forward (Vf) (Max) @ If 1.15 @ 1.5 V @ A
Reverse Recovery Time (trr) 4 µs
Current - Reverse Leakage @ Vr 1 µA @ 1000 V
Speed Standard Recovery >500ns, > 200mA (Io) -
Technology Avalanche -
Package / Case DO-214AC, SMA -
Mounting Type Surface Mount -
Operating Temperature - Junction -55 to 150 °C

Substitute Part Grouping Explanation

Substitute parts for the BYG10MHE3_A/I are identified as parametric equivalents sharing identical electrical and mechanical specifications. The substitution logic is based on the following criteria:

Electrical Parameters (Must Match):

  • Voltage - DC Reverse (Vr) (Max): 1000 V
  • Current - Average Rectified (Io): 1.5 A
  • Voltage - Forward (Vf) (Max) @ If: 1.15 V @ 1.5 A
  • Reverse Recovery Time (trr): 4 µs
  • Current - Reverse Leakage @ Vr: 1 µA @ 1000 V
  • Technology: Avalanche
  • Speed: Standard Recovery >500ns, > 200mA (Io)

Mechanical Parameters (Must Match):

  • Package / Case: DO-214AC, SMA
  • Mounting Type: Surface Mount
  • Operating Temperature - Junction: -55°C to 150°C

Compliance Parameters (Must Match):

  • RoHS Status: ROHS3 Compliant
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • REACH Status: REACH Unaffected

The primary difference among substitute parts lies in packaging format (Tape & Reel versus Cut Tape & Digi-Reel®), which affects supply chain logistics and component handling but does not alter electrical performance or functional compatibility.

Parameter Comparison

Parameter BYG10MHE3_A/I BYG10M-E3/TR BYG10M-E3/TR3
Manufacturer Vishay General Semiconductor - Diodes Division Vishay General Semiconductor - Diodes Division Vishay General Semiconductor - Diodes Division
Category Diodes, Rectifiers Diodes, Rectifiers Diodes, Rectifiers
Technology Avalanche Avalanche Avalanche
Voltage - DC Reverse (Vr) (Max) 1000 V 1000 V 1000 V
Current - Average Rectified (Io) 1.5 A 1.5 A 1.5 A
Voltage - Forward (Vf) (Max) @ If 1.15 V @ 1.5 A 1.15 V @ 1.5 A 1.15 V @ 1.5 A
Reverse Recovery Time (trr) 4 µs 4 µs 4 µs
Current - Reverse Leakage @ Vr 1 µA @ 1000 V 1 µA @ 1000 V 1 µA @ 1000 V
Speed Standard Recovery >500ns, > 200mA (Io) Standard Recovery >500ns, > 200mA (Io) Standard Recovery >500ns, > 200mA (Io)
Package / Case DO-214AC, SMA DO-214AC, SMA DO-214AC, SMA
Mounting Type Surface Mount Surface Mount Surface Mount
Operating Temperature - Junction -55°C to 150°C -55°C to 150°C -55°C to 150°C
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected
Product Status Active Active Active
Packaging Format Tape & Reel (TR) Cut Tape (CT) & Digi-Reel® Tape & Reel (TR)

Engineering Selection Recommendations

All three parts—BYG10MHE3_A/I, BYG10M-E3/TR, and BYG10M-E3/TR3—are active production components manufactured by Vishay General Semiconductor - Diodes Division with identical electrical specifications and compliance certifications. Selection among these parts is determined by packaging and supply requirements rather than electrical performance.

BYG10MHE3_A/I is supplied in Tape & Reel (TR) format with 805 pieces in stock.

BYG10M-E3/TR is supplied in Cut Tape (CT) & Digi-Reel® format with 77,440 pieces in stock, offering higher availability for applications requiring smaller order quantities or component-level procurement.

BYG10M-E3/TR3 is supplied in Tape & Reel (TR) format with 7,900 pieces in stock.

All parts carry ROHS3 compliance, AEC-Q101 automotive qualification (where applicable), and REACH unaffected status. Moisture sensitivity level MSL 1 indicates unlimited shelf life under standard storage conditions. Selection should be based on assembly process requirements, supply chain logistics, and inventory availability rather than electrical or thermal performance differences.

Frequently Asked Questions (FAQ)

Q: Can BYG10M-E3/TR be used as a direct replacement for BYG10MHE3_A/I?

A: Yes. BYG10M-E3/TR is a parametric equivalent with identical electrical specifications, reverse voltage rating (1000 V), forward current rating (1.5 A), forward voltage drop (1.15 V @ 1.5 A), reverse recovery time (4 µs), and reverse leakage current (1 µA @ 1000 V). Both use the same DO-214AC (SMA) surface mount package and operate across the same temperature range (-55°C to 150°C). The difference is packaging format: BYG10MHE3_A/I uses Tape & Reel (TR) while BYG10M-E3/TR uses Cut Tape (CT) & Digi-Reel®.

Q: What is the difference between Tape & Reel (TR) and Cut Tape (CT) & Digi-Reel® packaging?

A: Tape & Reel (TR) packaging supplies components on continuous tape wound on reels, typically used for high-volume automated assembly. Cut Tape (CT) & Digi-Reel® packaging provides components on cut tape segments or alternative reel formats, suitable for lower-volume orders or component-level procurement. Both formats contain identical components with no electrical performance difference.

Q: Are all three parts suitable for automotive applications?

A: The BYG10MHE3_A/I carries automotive-grade qualification under AEC-Q101 standard. BYG10M-E3/TR and BYG10M-E3/TR3 share identical electrical specifications and compliance status. All parts are ROHS3 compliant and REACH unaffected, meeting automotive supply chain requirements.

Q: What is the reverse recovery time specification, and why is it important?

A: Reverse recovery time (trr) is 4 µs for all three parts. This parameter defines the time required for the diode to switch from forward conduction to reverse blocking state. Standard recovery classification (>500ns, > 200mA) indicates these are general-purpose rectifier diodes suitable for standard switching applications without high-frequency switching requirements.

Q: Can these diodes be used interchangeably in PCB assembly?

A: Yes, all three parts use identical DO-214AC (SMA) surface mount packages with the same footprint and pin configuration. PCB layout and assembly processes require no modification when substituting among these parts. The only consideration is the supply format (Tape & Reel versus Cut Tape & Digi-Reel®), which affects component handling and feeder compatibility in automated assembly equipment.

Q: What does MSL 1 (Unlimited) moisture sensitivity level mean?

A: MSL 1 indicates the lowest moisture sensitivity classification. Components with MSL 1 have unlimited shelf life under standard storage conditions (typically 23°C ± 2°C and 45% to 75% relative humidity) without requiring special moisture-barrier packaging or baking procedures prior to assembly.

Q: Are there any differences in reverse leakage current among the three parts?

A: No. All three parts specify identical reverse leakage current of 1 µA measured at 1000 V reverse bias. This parameter is critical for applications requiring low standby current or high-impedance blocking characteristics.

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