BUV27 Equivalent & Substitute Parts

Part Overview

The BUV27 is an NPN bipolar junction transistor manufactured by STMicroelectronics, rated for 120 V collector-emitter breakdown voltage and 12 A maximum collector current in a TO-220-3 through-hole package. This device is classified as obsolete, necessitating identification of equivalent substitute components for ongoing design requirements and production continuity. The BUV27 delivers 85 W maximum power dissipation and operates at junction temperatures up to 175°C.

Substiute Parts

BUV27

STMicroelectronicsIn Stock: 1334BUV27 Datasheet

Current PartRFQ

BUL743

STMicroelectronicsIn Stock: 1962BUL743 Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the obsolete BUV27 is determined by the following critical electrical and mechanical parameters:

Mandatory Matching Criteria:

• Transistor Type: NPN configuration
• Package / Case: TO-220-3 through-hole form factor
• Current - Collector (Ic) (Max): 12 A minimum
• Mounting Type: Through Hole

Allowable Parameter Variations:

• Voltage - Collector Emitter Breakdown (Max): Substitute must equal or exceed 120 V
• Power - Max: Substitute must equal or exceed 85 W
• Operating Temperature (TJ): Substitute must support minimum 175°C operation
• RoHS and REACH Compliance: Substitute must maintain equivalent regulatory status

The BUL743 satisfies all mandatory matching criteria and exceeds allowable parameter variations, qualifying as a direct substitute for the BUV27.

Parameter Comparison

Engineering Selection Recommendations

The BUL743 is the qualified substitute for the obsolete BUV27 based on the following factors:

Electrical Compatibility: The BUL743 maintains identical maximum collector current (12 A) and identical saturation voltage (1.5 V) characteristics. The BUL743 provides higher voltage rating (500 V versus 120 V), which ensures operation in all applications where the BUV27 was specified. The increased power rating (100 W versus 85 W) provides additional thermal margin.

Mechanical Compatibility: Both devices utilize identical TO-220-3 through-hole packaging, enabling direct PCB footprint compatibility without layout modifications.

Regulatory Compliance: The BUL743 maintains ROHS3 compliance and REACH unaffected status, matching the BUV27 regulatory profile.

Product Availability: The BUL743 holds active product status with 1900 units in stock, ensuring supply chain continuity for the obsolete BUV27.

Thermal Consideration: The BUL743 specifies 150°C maximum junction temperature, which is lower than the BUV27 specification of 175°C. Applications operating near the 175°C limit require thermal analysis to confirm BUL743 suitability.

Frequently Asked Questions (FAQ)

Q: Can the BUL743 directly replace the BUV27 in existing designs?

A: The BUL743 provides direct replacement in applications where the BUV27 operates below 150°C junction temperature. The identical TO-220-3 package, matching 12 A collector current, and equivalent saturation voltage enable pin-for-pin substitution. Applications requiring operation above 150°C require thermal redesign or alternative component selection.

Q: What is the primary difference between the BUV27 and BUL743?

A: The BUL743 features a significantly higher collector-emitter breakdown voltage (500 V versus 120 V) and increased power dissipation capability (100 W versus 85 W). The BUL743 specifies a lower maximum junction temperature (150°C versus 175°C). These differences position the BUL743 for higher-voltage applications while requiring thermal management in high-temperature environments.

Q: Are there packaging differences between these devices?

A: Both the BUV27 and BUL743 utilize TO-220-3 through-hole packaging. No package conversion or PCB layout modification is required for substitution.

Q: What compliance certifications apply to the BUL743?

A: The BUL743 maintains ROHS3 compliance and REACH unaffected status, matching the regulatory requirements of the BUV27.

Q: Is the BUL743 suitable for all BUV27 applications?

A: The BUL743 is suitable for applications where junction temperature remains below 150°C. Applications designed for the BUV27's 175°C maximum junction temperature require thermal analysis to confirm BUL743 compatibility. The higher voltage rating of the BUL743 does not restrict its use in lower-voltage applications.