BUF602IDR Buffer Amplifier Equivalent & Substitute Parts

Part Overview

The BUF602IDR is a buffer amplifier integrated circuit manufactured by Texas Instruments, classified as a linear amplifier in the 8-SOIC surface mount package. This device functions as a single-circuit buffer amplifier with a gain bandwidth product of 1 GHz and slew rate of 8000V/µs, designed for signal buffering and impedance matching applications.

The BUF602IDR carries an Obsolete product status. Locating equivalent substitute parts is necessary to maintain design continuity, ensure supply chain reliability, and support ongoing production or maintenance requirements for systems utilizing this component.

Substiute Parts

BUF602IDR
Texas InstrumentsIn Stock: 1328BUF602IDR Datasheet
BUF602IDR
Current Part
BUF602ID
Texas InstrumentsIn Stock: 1248BUF602ID Datasheet
BUF602ID
MFR Recommended

Key Parameters

Parameter Value Unit
Amplifier Type Buffer
Number of Circuits 1
Slew Rate 8000 V/µs
Gain Bandwidth Product 1 GHz
Current - Input Bias 3 µA
Voltage - Input Offset 16 mV
Current - Supply 5.8 mA
Current - Output / Channel 60 mA
Voltage - Supply Span (Min) 2.8 V
Voltage - Supply Span (Max) 12.6 V
Operating Temperature Range -45 to 85 °C
Package / Case 8-SOIC (0.154", 3.90mm Width)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
REACH Status REACH Unaffected

Substitute Part Grouping Explanation

Substitute parts for the BUF602IDR are identified based on strict electrical and mechanical parameter equivalence. The substitution criteria are:

Electrical Parameters (Must Match):

  • Amplifier Type: Buffer
  • Number of Circuits: 1
  • Slew Rate: 8000 V/µs
  • Gain Bandwidth Product: 1 GHz
  • Current - Input Bias: 3 µA
  • Voltage - Input Offset: 16 mV
  • Current - Supply: 5.8 mA
  • Current - Output / Channel: 60 mA
  • Voltage - Supply Span (Min): 2.8 V
  • Voltage - Supply Span (Max): 12.6 V
  • Operating Temperature Range: -45°C to 85°C

Mechanical Parameters (Must Match):

  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Mounting Type: Surface Mount

Compliance Parameters (Must Match):

  • RoHS Status: ROHS3 Compliant
  • REACH Status: REACH Unaffected

The BUF602ID meets all substitution criteria and is identified as the manufacturer-recommended equivalent for the obsolete BUF602IDR.

Parameter Comparison

Parameter BUF602IDR (Main Part) BUF602ID (Substitute) Match Status
Manufacturer Texas Instruments Texas Instruments Identical
Amplifier Type Buffer Buffer Identical
Number of Circuits 1 1 Identical
Slew Rate (V/µs) 8000 8000 Identical
Gain Bandwidth Product (GHz) 1 1 Identical
Current - Input Bias (µA) 3 3 Identical
Voltage - Input Offset (mV) 16 16 Identical
Current - Supply (mA) 5.8 5.8 Identical
Current - Output / Channel (mA) 60 60 Identical
Voltage - Supply Span (Min) (V) 2.8 2.8 Identical
Voltage - Supply Span (Max) (V) 12.6 12.6 Identical
Operating Temperature Range (°C) -45 to 85 -45 to 85 Identical
Package / Case 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width) Identical
Mounting Type Surface Mount Surface Mount Identical
Product Status Obsolete Active Substitute is Active
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
REACH Status REACH Unaffected REACH Unaffected Identical
Packaging Not specified Tube Substitute in Tube packaging
Moisture Sensitivity Level (MSL) 1 (Unlimited) 2 (1 Year) Substitute has higher MSL rating

Engineering Selection Recommendations

The BUF602ID is the direct substitute for the obsolete BUF602IDR. Both devices are manufactured by Texas Instruments and share identical electrical specifications, mechanical packaging, and compliance certifications.

Product Status Consideration: The BUF602IDR is classified as Obsolete, while the BUF602ID maintains Active product status. This status difference indicates that the BUF602ID is the current production equivalent and is recommended for new designs and ongoing supply requirements.

Compliance Alignment: Both parts maintain ROHS3 compliance and REACH Unaffected status, ensuring regulatory compatibility in applications subject to environmental and hazardous substance restrictions.

Packaging Difference: The BUF602IDR packaging specification is not provided in the technical data. The BUF602ID is supplied in Tube packaging. Verify packaging requirements for your specific assembly process.

Moisture Sensitivity: The BUF602IDR specifies MSL 1 (Unlimited), while the BUF602ID specifies MSL 2 (1 Year). This difference requires adherence to moisture control procedures during storage and handling of the BUF602ID, with a maximum shelf life of one year under controlled conditions.

Frequently Asked Questions (FAQ)

Q: Can the BUF602ID directly replace the BUF602IDR in existing designs?

A: Yes. The BUF602ID is electrically and mechanically equivalent to the BUF602IDR. All electrical parameters, including slew rate, gain bandwidth product, supply voltage range, and operating temperature range are identical. The 8-SOIC surface mount package dimensions are identical, enabling direct PCB-level substitution.

Q: What is the significance of the product status difference between BUF602IDR (Obsolete) and BUF602ID (Active)?

A: The Obsolete status of the BUF602IDR indicates that Texas Instruments has discontinued production and support for this specific part number variant. The BUF602ID, classified as Active, is the current production equivalent and is recommended for all new designs and ongoing supply chain requirements.

Q: Are there compliance or regulatory differences between these parts?

A: No. Both the BUF602IDR and BUF602ID maintain identical ROHS3 compliance and REACH Unaffected status. They are suitable for applications subject to environmental and hazardous substance regulations.

Q: What is the difference in Moisture Sensitivity Level (MSL) between these parts?

A: The BUF602IDR specifies MSL 1 (Unlimited), indicating no moisture sensitivity restrictions. The BUF602ID specifies MSL 2 (1 Year), requiring moisture control during storage with a maximum shelf life of one year under controlled humidity conditions. Proper handling and storage procedures must be followed for the BUF602ID to maintain device reliability.

Q: Are the packaging formats different?

A: The BUF602IDR packaging format is not specified in the technical data. The BUF602ID is supplied in Tube packaging. Confirm packaging compatibility with your assembly and handling processes.

Q: What is the base product number for both parts?

A: Both the BUF602IDR and BUF602ID share the base product number BUF602. The suffix designations (IDR and ID) indicate packaging and product status variants of the same core buffer amplifier design.

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