BU7262F-E2 Equivalent & Substitute Parts Reference

Part Overview

The BU7262F-E2 from Rohm Semiconductor is a CMOS dual circuit rail-to-rail amplifier in the Linear, Amplifiers category, offered in 8-SOP surface mount packaging. This model features a rail-to-rail output, low input bias current, and operates over a voltage span of 1.8 V to 5.5 V with an active product status and RoHS3/REACH compliance. When exact part availability is critical, identifying fully compatible substitute amplifiers based strictly on electrical, mechanical, and compliance parameters ensures reliable sourcing and design continuity.

Key Parameters

Parameter	Value
Amplifier Type	CMOS
Number of Circuits	2
Output Type	Rail-to-Rail
Slew Rate	1.1V/µs
Gain Bandwidth Product	2 MHz
Current - Input Bias	1 pA
Voltage - Input Offset	1 mV
Current - Supply	550µA
Current - Output / Channel	12 mA
Voltage - Supply Min	1.8 V
Voltage - Supply Max	5.5 V
Operating Temperature	-40°C ~ 85°C
Mounting Type	Surface Mount
Package / Case	8-SOIC (0.173", 4.40mm Width)
RoHS Status	ROHS3 Compliant
REACH Status	REACH Unaffected
MSL	1 (Unlimited)

Substitute Part Grouping Explanation

Substitute and equivalent linear amplifier ICs for BU7262F-E2 are identified based solely on matching the following provided critical parameters: amplifier type, number of circuits, rail-to-rail output capability, electrical performance (slew rate, gain-bandwidth product, input/output currents, input offset voltage), operating voltage range, temperature rating, mounting type, polarity of package outline, RoHS/REACH compliance, and moisture sensitivity level (MSL). Only parts meeting these explicit requirements and supplied in industry-standard 8-SOIC surface mount packages have been included.

Parameter Comparison

Manufacturer Part Number	Manufacturer	Amplifier Type	Number of Circuits	Output Type	Slew Rate (V/µs)	Gain Bandwidth Product (MHz)	Current - Input Bias	Voltage - Input Offset	Current - Supply	Current - Output / Channel	Voltage - Supply Min	Voltage - Supply Max	Operating Temperature (°C)	Mounting Type	Package / Case	RoHS Status	REACH Status	MSL
BU7262F-E2	Rohm Semiconductor	CMOS	2	Rail-to-Rail	1.1	2	1 pA	1 mV	550µA	12 mA	1.8 V	5.5 V	-40 ~ 85	Surface Mount	8-SOIC (0.173", 4.40mm)	ROHS3	Unaffected	1
NCS20062DR2G	onsemi	General Purpose	2	Rail-to-Rail	1.2	3	1 pA	500 µV	140µA (x2 Channels)	19 mA	1.8 V	5.5 V	-40 ~ 125	Surface Mount	8-SOIC (0.154", 3.90mm)	ROHS3	Unaffected	1
LMV358IDT	STMicroelectronics	General Purpose	2	Rail-to-Rail	0.45	1.3	16 nA	100 µV	162µA	160 mA	2.7 V	6 V	-40 ~ 125	Surface Mount	8-SOIC (0.154", 3.90mm)	ROHS3	Unaffected	1
LMV358IYDT	STMicroelectronics	General Purpose	2	Rail-to-Rail	0.45	1.3	16 nA	100 µV	162µA	160 mA	2.7 V	6 V	-40 ~ 125	Surface Mount	8-SOIC (0.154", 3.90mm)	ROHS3	Unaffected	1
NCS20032DR2G	onsemi	General Purpose	2	Rail-to-Rail	8	7	1 pA	500 µV	275µA (x2 Channels)	96 mA	1.7 V	5.5 V	-40 ~ 125	Surface Mount	8-SOIC (0.154", 3.90mm)	ROHS3	Unaffected	1
NCV20032DR2G	onsemi	General Purpose	2	Rail-to-Rail	8	7	1 pA	500 µV	275µA (x2 Channels)	14 mA	1.7 V	5.5 V	-40 ~ 125	Surface Mount	8-SOIC (0.154", 3.90mm)	ROHS3	Unaffected	1
OPA2322AID	Texas Instruments	CMOS	2	Rail-to-Rail	10	20	0.2 pA	500 µV	1.6mA (x2 Channels)	65 mA	1.8 V	5.5 V	-40 ~ 125	Surface Mount	8-SOIC (0.154", 3.90mm)	ROHS3	Unaffected	2
OPA2322AIDR	Texas Instruments	CMOS	2	Rail-to-Rail	10	20	0.2 pA	500 µV	1.6mA (x2 Channels)	65 mA	1.8 V	5.5 V	-40 ~ 125	Surface Mount	8-SOIC (0.154", 3.90mm)	ROHS3	Unaffected	2
TLV342AID	Texas Instruments	CMOS	2	Rail-to-Rail	1	2.3	1 pA	300 µV	75µA (x2 Channels)	115 mA	1.5 V	5.5 V	-40 ~ 125	Surface Mount	8-SOIC (0.154", 3.90mm)	ROHS3	Unaffected	1
TLV342AIDR	Texas Instruments	CMOS	2	Rail-to-Rail	1	2.3	1 pA	300 µV	75µA (x2 Channels)	115 mA	1.5 V	5.5 V	-40 ~ 125	Surface Mount	8-SOIC (0.154", 3.90mm)	ROHS3	Unaffected	1
TLV342ID	Texas Instruments	CMOS	2	Rail-to-Rail	1	2.3	1 pA	300 µV	75µA (x2 Channels)	115 mA	1.5 V	5.5 V	-40 ~ 125	Surface Mount	8-SOIC (0.154", 3.90mm)	ROHS3	Unaffected	1
TLV342IDR	Texas Instruments	CMOS	2	Rail-to-Rail	1	2.3	1 pA	300 µV	75µA (x2 Channels)	115 mA	1.5 V	5.5 V	-40 ~ 125	Surface Mount	8-SOIC (0.154", 3.90mm)	ROHS3	Unaffected	1

Engineering Selection Recommendations

All listed substitute parts are designated active or last time buy by their manufacturers. RoHS3 and REACH compliance are validated for all models. Moisture Sensitivity Level (MSL) is specified, with MSL 1 or 2 ratings. Substitute models utilize industry-standard surface mount 8-SOIC packaging, supporting consistent assembly and inventory policies. The selection criteria include only the explicit technical, mechanical, and compliance parameters provided.

Frequently Asked Questions (FAQ)

What determines substitution compatibility for BU7262F-E2?

Substitution requires a match in amplifier type, rail-to-rail output, dual circuit configuration, voltage supply range (minimum and maximum), electrical performance parameters (slew rate, gain-bandwidth, bias/input/output currents, offset voltage), operating temperature, surface mount type, SOIC package dimensions, and RoHS/REACH/MSL certifications as provided.

Are the substitute amplifiers guaranteed to fit the same footprint?

All listed substitute amplifiers are supplied in 8-SOIC surface mount packages. Variations in package width (between 0.154" and 0.173") are noted in the table; mechanical compatibility should be evaluated strictly based on these provided dimensions.

Do the substitutes meet the same compliance and moisture sensitivity requirements?

Yes, every substitute part explicitly meets RoHS3 and REACH unaffected status, and provides the specified Moisture Sensitivity Level (MSL) in the table.

Can electrical performance differences be inferred from these listings?

All amplifiers listed include their explicit slew rate, gain-bandwidth product, input/output current specifications, and voltage offset values as provided. No extrapolation or inference is made beyond these parameters.

Are substitutes available for all device grades (automotive, industrial, etc.)?

The table specifies grade or qualification status only where provided for each part. Selection should be made based strictly on the supplied qualification detail in the listing.

How should mounting and case differences be addressed?

Mounting type for all models is surface mount, with SOIC packages. Package/case dimensions are stated for each model to allow mechanical compatibility review based only on these explicit measurements.

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