BU7253SF-E2 Equivalent & Substitute Parts

Part Overview

The BU7253SF-E2 is a dual-channel CMOS comparator manufactured by Rohm Semiconductor, featuring open-drain output configuration in an 8-SOP surface mount package. This device operates across a wide supply voltage range of 1.8V to 5.5V (single supply) or ±0.9V to ±2.75V (dual supply), making it suitable for low-voltage and general-purpose analog signal comparison applications. The part is currently active in production with full RoHS3 compliance and unlimited moisture sensitivity rating. Equivalent and substitute parts are identified based on matching functional topology, output type, package compatibility, and electrical performance within acceptable parameter tolerances.

Substiute Parts

BU7253SF-E2

Rohm SemiconductorIn Stock: 743BU7253SF-E2 Datasheet

Current PartRFQ

ADCMP392ARZ

Analog Devices Inc.In Stock: 1509ADCMP392ARZ Datasheet

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ADCMP392ARZ-RL7

Analog Devices Inc.In Stock: 1222ADCMP392ARZ-RL7 Datasheet

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ADCMP395ARMZ

Analog Devices Inc.In Stock: 974ADCMP395ARMZ Datasheet

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TS332IQ2T

STMicroelectronicsIn Stock: 18871TS332IQ2T Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the BU7253SF-E2 is determined by the following critical parameters:

Primary Matching Criteria:

• Number of Elements: 2 channels
• Output Type: Open-Drain configuration
• Voltage Supply Range: Minimum 1.8V operation capability
• Package Type: 8-pin surface mount (8-SOIC, 8-SOP, or 8-DFN)
• Mounting Type: Surface Mount

Secondary Compatibility Parameters:

• Input Offset Voltage: Maximum 11.5mV
• Quiescent Current: Maximum 65µA
• CMRR/PSRR: Minimum 74dB
• Propagation Delay: Maximum 750ns
• Operating Temperature: Minimum -40°C to 105°C coverage
• RoHS3 Compliance and MSL Level 1 rating

Substitute parts must maintain open-drain output topology and support the full 1.8V minimum supply voltage. Package footprint differences (8-SOIC vs. 8-DFN) are acceptable provided pin-to-pin compatibility is verified for the specific application circuit.

Parameter Comparison

Engineering Selection Recommendations

ADCMP395ARMZ (Analog Devices Inc.) This part provides the closest electrical match with open-drain output topology and superior input offset voltage specification (2.5mV vs. 11.5mV). The 10-MSOP package requires PCB layout modification from the original 8-SOIC footprint. All parts maintain RoHS3 compliance and MSL Level 1 rating. Operating temperature range extends to 125°C, exceeding the BU7253SF-E2 specification.

TS332IQ2T (STMicroelectronics) This substitute offers open-drain output with the fastest propagation delay (720ns, matching the BU7253SF-E2 at 750ns typical). The 8-DFN package provides a compact footprint alternative to 8-SOIC. Supply voltage range extends to 1.6V minimum, supporting lower-voltage applications. Output current capability is significantly higher (93mA @ 5V), suitable for applications requiring increased drive capability.

ADCMP392ARZ and ADCMP392ARZ-RL7 (Analog Devices Inc.) These parts feature rail-to-rail output topology rather than open-drain, representing a functional deviation from the BU7253SF-E2. The 8-SOIC package footprint is compatible with minor dimensional differences (3.90mm vs. 4.40mm width). Minimum supply voltage is 2.3V, limiting use in applications requiring 1.8V operation. These options are suitable only when rail-to-rail output characteristics are acceptable for the circuit design.

Frequently Asked Questions (FAQ)

Q: Can ADCMP392ARZ replace BU7253SF-E2 directly? A: ADCMP392ARZ features rail-to-rail output instead of open-drain. Direct substitution is possible only if the circuit design accommodates rail-to-rail output behavior. The minimum supply voltage is 2.3V, which excludes 1.8V applications. Pin-to-pin compatibility exists for 8-SOIC packages, but electrical behavior differs significantly.

Q: What is the key difference between TS332IQ2T and the original BU7253SF-E2? A: TS332IQ2T uses an 8-DFN package instead of 8-SOIC, requiring PCB footprint redesign. Both maintain open-drain output topology and support 1.8V minimum operation. TS332IQ2T offers faster propagation delay (720ns) and higher output current (93mA @ 5V), making it suitable for applications requiring increased drive capability or faster response times.

Q: Is ADCMP395ARMZ compatible with the BU7253SF-E2 circuit? A: ADCMP395ARMZ maintains open-drain output and RoHS3 compliance. The 10-MSOP package differs from the original 8-SOIC, requiring PCB layout modification. Electrical specifications are superior, with lower input offset voltage (2.5mV) and extended operating temperature range (-40°C to 125°C). Pin count increases from 8 to 10, necessitating circuit verification.

Q: What supply voltage range must a substitute part support? A: The BU7253SF-E2 operates from 1.8V minimum. Substitute parts must support at least 1.8V single-supply operation or equivalent dual-supply range (±0.9V). ADCMP392ARZ and ADCMP392ARZ-RL7 have a 2.3V minimum, limiting their use in 1.8V applications. TS332IQ2T and ADCMP395ARMZ both support 1.6V and 2.3V minimums respectively, providing broader compatibility.

Q: Are all substitute parts RoHS3 compliant? A: Yes. All listed substitute parts (ADCMP392ARZ, ADCMP392ARZ-RL7, ADCMP395ARMZ, and TS332IQ2T) maintain RoHS3 compliance and MSL Level 1 (Unlimited) moisture sensitivity rating, matching the original BU7253SF-E2 environmental specifications.

Q: What is the difference between ADCMP392ARZ and ADCMP392ARZ-RL7? A: Both parts are electrically identical with matching specifications. The primary difference is packaging: ADCMP392ARZ is supplied in Tube packaging, while ADCMP392ARZ-RL7 is supplied in Tape & Reel (TR) format. Selection depends on procurement and assembly requirements.