BU7253F-E2 Equivalent & Substitute Parts

Part Overview

The BU7253F-E2 is a dual-channel CMOS comparator manufactured by Rohm Semiconductor in an 8-SOP surface mount package. This active component operates across a wide supply voltage range of 1.8V to 5.5V (single supply) or ±0.9V to ±2.75V (dual supply), with open-drain output configuration suitable for logic-level interfacing. The device is currently in active production status with 1954 units in stock. Equivalent and substitute parts are identified when design requirements necessitate alternative sourcing, package compatibility, or enhanced performance specifications within the same functional category.

Substiute Parts

BU7253F-E2

Rohm SemiconductorIn Stock: 2052BU7253F-E2 Datasheet

Current PartRFQ

MAX44269EWL+T

Analog Devices Inc./Maxim IntegratedIn Stock: 4305MAX44269EWL+T Datasheet

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TS332IDT

STMicroelectronicsIn Stock: 54621TS332IDT Datasheet

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TS332IYDT

STMicroelectronicsIn Stock: 7856TS332IYDT Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the BU7253F-E2 is determined by the following critical parameters: dual-channel configuration, open-drain output topology, CMOS technology, surface mount packaging, and supply voltage compatibility within the 1.8V to 5.5V range. All identified substitute parts maintain these core functional requirements.

The substitute parts are grouped into two categories based on package form factor:

Group 1 - Package Compatible (8-SOIC): TS332IDT and TS332IYDT maintain identical 8-SOIC package geometry (0.154", 3.90mm width), enabling direct PCB layout compatibility with the BU7253F-E2. Both are manufactured by STMicroelectronics and classified as general-purpose comparators with open-drain outputs.

Group 2 - Package Alternative (9-WLP): MAX44269EWL+T provides functional equivalence with a different package form factor (9-WFBGA, WLBGA 1.29x1.29mm), manufactured by Analog Devices Inc./Maxim Integrated. This option requires PCB layout redesign but offers reduced board space footprint.

Parameter Comparison

Engineering Selection Recommendations

All substitute parts maintain active production status and ROHS3 compliance, ensuring long-term availability and regulatory alignment with the BU7253F-E2.

For direct PCB layout compatibility: TS332IDT and TS332IYDT are preferred substitutes when existing board designs require no modification. Both devices share 8-SOIC packaging and open-drain output configuration. TS332IYDT includes AEC-Q100 automotive qualification, suitable for applications requiring automotive-grade reliability. The STMicroelectronics TS332 series demonstrates superior input offset voltage performance (5mV versus 11.5mV) and lower quiescent current (26µA versus 65µA), providing enhanced precision and reduced power consumption in equivalent form factors.

For space-constrained applications: MAX44269EWL+T offers the lowest quiescent current specification (1µA) and smallest package footprint (9-WLP 1.29x1.29mm). This substitute requires PCB layout redesign but delivers significant board area reduction. Supply voltage compatibility spans 1.8V to 5.5V, matching the BU7253F-E2 range.

For extended temperature operation: TS332IDT and TS332IYDT support operating temperatures to 125°C, exceeding the BU7253F-E2 specification of 85°C maximum. This extended range accommodates high-temperature industrial and automotive environments.

Frequently Asked Questions (FAQ)

Q: Can TS332IDT be used as a direct replacement for BU7253F-E2 on existing PCBs?

A: TS332IDT shares the 8-SOIC package family but with different physical dimensions (0.154" width versus 0.173" width). Verify PCB footprint compatibility before substitution. Both devices maintain open-drain output and dual-channel configuration.

Q: What is the key difference between TS332IDT and TS332IYDT?

A: TS332IYDT includes AEC-Q100 automotive qualification and carries automotive-grade HTSUS classification (8542.33.0001 versus 8542.39.0001). Electrical specifications are identical. Select TS332IYDT for automotive applications requiring qualification documentation.

Q: Is MAX44269EWL+T suitable for high-speed applications?

A: MAX44269EWL+T propagation delay specification is not provided in available documentation. For applications requiring confirmed propagation delay performance, TS332IDT or TS332IYDT with 720ns typical delay are recommended.

Q: What are the supply voltage compatibility constraints?

A: BU7253F-E2 operates at 1.8V to 5.5V single supply. TS332IDT and TS332IYDT operate at 1.6V to 5V, creating a lower bound constraint at 1.8V. MAX44269EWL+T matches the full 1.8V to 5.5V range. Verify application supply voltage falls within all substitute part specifications.

Q: Does package size affect circuit performance?

A: Package selection does not alter electrical performance characteristics. 8-SOIC and 9-WLP packages maintain equivalent functional behavior. Package choice is determined by PCB layout constraints, thermal management requirements, and board space availability.

Q: Are all substitute parts RoHS compliant?

A: All listed substitute parts maintain ROHS3 compliance status, matching the BU7253F-E2 regulatory requirement. MSL ratings are uniform at Level 1 (Unlimited) across all options.