BU1850MUV-E2 Equivalent & Substitute Parts

Part Overview

The BU1850MUV-E2 is an 8-channel I/O expander from Rohm Semiconductor designed for I2C communication at 400 kHz. This interface IC operates across a supply voltage range of 1.65V to 3.6V and features open-drain output configuration with power-on reset (POR) functionality. The device is packaged in a 16-VFQFN with exposed pad for surface mount applications.

The BU1850MUV-E2 carries a "Not For New Designs" product status, indicating that Rohm Semiconductor has discontinued active development for this part. This status necessitates identifying functionally equivalent alternatives that maintain compatibility with existing system requirements while offering active product support and continued availability.

Substiute Parts

BU1850MUV-E2
Rohm SemiconductorIn Stock: 20379BU1850MUV-E2 Datasheet
BU1850MUV-E2
Current Part
FXL6408UMX
onsemiIn Stock: 2234FXL6408UMX Datasheet
FXL6408UMX
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IS31IO7325-GRLS4-TR
ISSI, Integrated Silicon Solution IncIn Stock: 782IS31IO7325-GRLS4-TR Datasheet
IS31IO7325-GRLS4-TR
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TCA9534APWR
Texas InstrumentsIn Stock: 2376TCA9534APWR Datasheet
TCA9534APWR
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XRA1200IG16TR-F
MaxLinear, Inc.In Stock: 6050XRA1200IG16TR-F Datasheet
XRA1200IG16TR-F
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Key Parameters

Parameter BU1850MUV-E2 Specification
Manufacturer Rohm Semiconductor
Number of I/O Channels 8
Interface Protocol I2C
Clock Frequency 400 kHz
Supply Voltage Range 1.65V ~ 3.6V
Operating Temperature Range -30°C ~ 85°C
Output Type Open Drain
Interrupt Output Yes
Features POR (Power-On Reset)
Package Type 16-VFQFN Exposed Pad
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the BU1850MUV-E2 is determined by the following core parameters:

  • 8-channel I/O configuration: All substitute parts must provide exactly 8 I/O channels
  • I2C interface at 400 kHz: Primary communication protocol and clock frequency must match
  • Interrupt output capability: Required for system-level event signaling
  • Open-drain output type: Electrical output configuration must be compatible
  • Power-on reset feature: POR functionality must be present
  • Surface mount packaging: Physical form factor must support PCB integration
  • RoHS3 compliance: Environmental and regulatory requirement

The substitute parts identified below meet these core functional and electrical requirements. Variations in supply voltage range, operating temperature, package dimensions, and additional interface protocols (such as SMBus or Serial) represent acceptable differences that do not compromise the primary I/O expansion function.

Parameter Comparison

Parameter BU1850MUV-E2 FXL6408UMX IS31IO7325-GRLS4-TR TCA9534APWR XRA1200IG16TR-F
Manufacturer Rohm Semiconductor onsemi ISSI Texas Instruments MaxLinear, Inc.
Number of I/O 8 8 8 8 8
Interface I2C I2C I2C, Serial I2C I2C, SMBus
Clock Frequency 400 kHz 400 kHz 400 kHz 400 kHz 400 kHz
Supply Voltage 1.65V ~ 3.6V 1.65V ~ 4V 2.4V ~ 5.5V 1.65V ~ 5.5V 1.65V ~ 3.6V
Operating Temperature -30°C ~ 85°C -40°C ~ 85°C -40°C ~ 125°C -40°C ~ 85°C -40°C ~ 85°C
Output Type Open Drain Open Drain Open Drain Push-Pull Open Drain
Interrupt Output Yes Yes Yes Yes Yes
Features POR POR POR
Package / Case 16-VFQFN Exposed Pad 16-UFQFN 24-SOIC 16-TSSOP 16-TSSOP
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant RoHS Compliant
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited) 3 (168 Hours) 1 (Unlimited) 1 (Unlimited)
Product Status Not For New Designs Active Active Active Active

Engineering Selection Recommendations

FXL6408UMX (onsemi) provides the closest electrical and functional match to the BU1850MUV-E2. Both devices share identical I/O count, interface protocol, clock frequency, and output type. The FXL6408UMX extends the supply voltage range to 4V and operating temperature to -40°C, offering broader environmental compatibility. Active product status ensures continued manufacturer support and component availability. The 16-UFQFN package is mechanically similar to the original VFQFN, requiring minimal PCB layout modifications.

XRA1200IG16TR-F (MaxLinear, Inc.) maintains identical supply voltage and I/O specifications as the BU1850MUV-E2 while offering active product status. The addition of SMBus protocol compatibility provides enhanced system integration flexibility. Open-drain output configuration and interrupt capability are preserved. The 16-TSSOP package requires PCB footprint adjustment but is widely supported in manufacturing environments.

TCA9534APWR (Texas Instruments) offers the widest supply voltage range (1.65V ~ 5.5V) and represents a mature, widely-deployed alternative. The primary distinction is push-pull output configuration rather than open-drain, which may require circuit-level evaluation depending on system pull-up requirements. Active product status and extensive design documentation support rapid integration.

IS31IO7325-GRLS4-TR (ISSI) provides extended operating temperature range (-40°C ~ 125°C) suitable for industrial applications. The addition of serial interface capability and higher current sourcing/sinking (10mA, 20mA) enable expanded functionality. The 24-SOIC package represents a larger footprint requiring significant PCB redesign. Moisture sensitivity level 3 requires controlled storage conditions.

Frequently Asked Questions (FAQ)

Q: Can the TCA9534APWR replace the BU1850MUV-E2 directly without circuit modifications?

A: The TCA9534APWR is functionally compatible for I/O expansion applications. The primary difference is output type: TCA9534APWR uses push-pull configuration while BU1850MUV-E2 uses open-drain. If the original design includes external pull-up resistors on I/O lines, the push-pull output may cause contention. Verify pull-up resistor presence and remove if necessary before substitution.

Q: What is the impact of package differences between substitute parts?

A: Package differences require PCB footprint redesign. FXL6408UMX (16-UFQFN) and XRA1200IG16TR-F (16-TSSOP) are mechanically similar to the original 16-VFQFN and require minimal layout changes. IS31IO7325-GRLS4-TR (24-SOIC) requires significant PCB modification due to increased pin count and package size. Consult PCB layout guidelines for each package type before design implementation.

Q: Are all substitute parts RoHS compliant?

A: FXL6408UMX, IS31IO7325-GRLS4-TR, and TCA9534APWR are ROHS3 compliant. XRA1200IG16TR-F is RoHS compliant. Both certifications meet current environmental regulations. Verify specific RoHS revision requirements for your application and supply chain.

Q: Which substitute part is recommended for low-temperature applications below -30°C?

A: FXL6408UMX, TCA9534APWR, and XRA1200IG16TR-F all support -40°C minimum operating temperature, extending the lower temperature range by 10°C compared to the original BU1850MUV-E2. IS31IO7325-GRLS4-TR also supports -40°C minimum. Select based on other system requirements and package constraints.

Q: Does the addition of SMBus protocol in XRA1200IG16TR-F affect I2C compatibility?

A: SMBus is a subset protocol compatible with I2C at the electrical and timing levels. The XRA1200IG16TR-F operates at 400 kHz I2C frequency and maintains full backward compatibility with standard I2C systems. SMBus capability provides additional flexibility without compromising existing I2C implementations.

Q: What is the significance of moisture sensitivity level differences?

A: BU1850MUV-E2, FXL6408UMX, TCA9534APWR, and XRA1200IG16TR-F all have MSL 1 (Unlimited), requiring no special moisture control during storage or handling. IS31IO7325-GRLS4-TR has MSL 3 (168 Hours), requiring controlled humidity storage and limiting shelf life after package opening. MSL 1 parts are preferred for supply chain flexibility and reduced handling costs.

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