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BTS113AE3064NKSA1 Equivalent & Substitute Parts
Part Overview
The BTS113AE3064NKSA1 is an N-Channel MOSFET manufactured by Infineon Technologies, rated for 60V drain-to-source voltage with 11.5A continuous drain current at 25°C. This device is packaged in a Through Hole TO-220AB configuration and is part of the TEMPFET® series. The part is currently classified as obsolete, necessitating identification of active equivalent and substitute components that maintain functional compatibility within the specified electrical and mechanical parameters.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| FET Type | N-Channel | — |
| Drain to Source Voltage (Vdss) | 60 | V |
| Current - Continuous Drain (Id) @ 25°C | 11.5 | A (Tc) |
| Rds On (Max) @ Id, Vgs | 170 | mOhm @ 5.8A, 4.5V |
| Vgs(th) (Max) @ Id | 2.5 | V @ 1mA |
| Power Dissipation (Max) | 40 | W (Tc) |
| Operating Temperature Range | -55 to 150 | °C (TJ) |
| Mounting Type | Through Hole | — |
| Package / Case | TO-220-3 | — |
| RoHS Status | RoHS non-compliant | — |
Substitute Part Grouping Explanation
Substitution of the BTS113AE3064NKSA1 is determined by the following critical parameters:
Electrical Compatibility Criteria:
- Drain to Source Voltage (Vdss) must equal or exceed 60V
- Continuous drain current (Id) must meet or exceed 11.5A at 25°C
- Gate threshold voltage (Vgs(th)) and gate voltage range (Vgs) must be compatible with the application circuit
- On-state resistance (Rds On) affects power dissipation and thermal performance
- Power dissipation capability must support the application requirements
Mechanical Compatibility Criteria:
- Package type determines physical fit and thermal characteristics
- Mounting type (Through Hole vs. Surface Mount) affects PCB layout and assembly process
- Pin configuration must match the application circuit
Compliance Considerations:
- Product status (Active vs. Obsolete) affects long-term availability
- RoHS compliance status for regulatory requirements
The substitute parts listed below are grouped into two categories based on mounting type: Surface Mount (D2PAK) alternatives and Through Hole (TO-220AB) alternatives. Surface Mount alternatives require PCB layout modification but offer improved thermal performance. Through Hole alternatives maintain the original mounting type.
Parameter Comparison
| Parameter | BTS113AE3064NKSA1 | IRFZ14SPBF | IRFZ14STRLPBF | IRFZ24PBF | IRLZ14SPBF | IRLZ14STRLPBF | IRLZ14STRRPBF |
|---|---|---|---|---|---|---|---|
| Manufacturer | Infineon | Vishay Siliconix | Vishay Siliconix | Vishay Siliconix | Vishay Siliconix | Vishay Siliconix | Vishay Siliconix |
| FET Type | N-Channel | N-Channel | N-Channel | N-Channel | N-Channel | N-Channel | N-Channel |
| Vdss | 60V | 60V | 60V | 60V | 60V | 60V | 60V |
| Id @ 25°C | 11.5A (Tc) | 10A (Tc) | 10A (Tc) | 17A (Tc) | 10A (Tc) | 10A (Tc) | 10A (Tc) |
| Rds On (Max) | 170 mOhm @ 5.8A, 4.5V | 200 mOhm @ 6A, 10V | 200 mOhm @ 6A, 10V | 100 mOhm @ 10A, 10V | 200 mOhm @ 6A, 5V | 200 mOhm @ 6A, 5V | 200 mOhm @ 6A, 5V |
| Vgs(th) (Max) @ Id | 2.5V @ 1mA | 4V @ 250µA | 4V @ 250µA | 4V @ 250µA | 2V @ 250µA | 2V @ 250µA | 2V @ 250µA |
| Vgs (Max) | ±10V | ±20V | ±20V | ±20V | ±10V | ±10V | ±10V |
| Power Dissipation (Max) | 40W (Tc) | 43W (Tc) | 43W (Tc) | 60W (Tc) | 43W (Tc) | 43W (Tc) | 43W (Tc) |
| Operating Temperature | -55 to 150°C (TJ) | -55 to 175°C (TJ) | -55 to 175°C (TJ) | -55 to 175°C (TJ) | -55 to 175°C (TJ) | -55 to 175°C (TJ) | -55 to 175°C (TJ) |
| Mounting Type | Through Hole | Surface Mount | Surface Mount | Through Hole | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | TO-220-3 | TO-263-3, D2PAK | TO-263-3, D2PAK | TO-220-3 | TO-263-3, D2PAK | TO-263-3, D2PAK | TO-263-3, D2PAK |
| Product Status | Obsolete | Active | Active | Active | Active | Active | Active |
| RoHS Status | RoHS non-compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Engineering Selection Recommendations
Through Hole TO-220AB Alternatives (Direct Package Match):
The IRFZ24PBF is the primary through-hole substitute. It maintains the TO-220-3 package configuration, enabling direct PCB mounting without layout modification. The IRFZ24PBF exceeds the BTS113AE3064NKSA1 in continuous drain current (17A vs. 11.5A) and power dissipation (60W vs. 40W), providing design margin for thermal performance. The device is ROHS3 compliant and carries active product status, ensuring long-term availability. Operating temperature range extends to 175°C, exceeding the original part's 150°C maximum.
Surface Mount D2PAK Alternatives (Package Change Required):
Four surface-mount alternatives are available in the D2PAK (TO-263) package: IRFZ14SPBF, IRFZ14STRLPBF, IRLZ14SPBF, IRLZ14STRLPBF, and IRLZ14STRRPBF. These devices are suitable for applications where PCB layout can accommodate surface-mount technology.
The IRFZ14 series (IRFZ14SPBF and IRFZ14STRLPBF) operates with a 10V gate drive voltage and exhibits a gate threshold voltage of 4V. These parts are ROHS3 compliant with active product status.
The IRLZ14 series (IRLZ14SPBF, IRLZ14STRLPBF, and IRLZ14STRRPBF) operates with 4V to 5V gate drive voltage and exhibits a lower gate threshold voltage of 2V, providing closer electrical compatibility with the original BTS113AE3064NKSA1 (Vgs(th) = 2.5V). These parts are ROHS3 compliant with active product status.
All surface-mount alternatives provide 43W power dissipation at Tc, slightly exceeding the original 40W specification. Continuous drain current is rated at 10A, below the original 11.5A specification; applications requiring the full 11.5A current must use the IRFZ24PBF through-hole alternative.
Compliance Considerations:
All substitute parts are ROHS3 compliant, addressing regulatory requirements that may not apply to the original RoHS non-compliant BTS113AE3064NKSA1. All substitutes carry active product status, ensuring continued availability and supply chain stability.
Frequently Asked Questions (FAQ)
Q: Can the IRFZ14SPBF or IRLZ14SPBF directly replace the BTS113AE3064NKSA1 without PCB modification?
A: No. The IRFZ14SPBF and IRLZ14SPBF are surface-mount devices in D2PAK (TO-263) package, while the BTS113AE3064NKSA1 is a through-hole device in TO-220AB package. PCB layout modification is required to accommodate the different package footprint and mounting method.
Q: What is the difference between IRFZ14SPBF and IRLZ14SPBF?
A: Both devices are 60V, 10A N-Channel MOSFETs in D2PAK package with active product status. The primary difference is gate threshold voltage: IRFZ14SPBF has Vgs(th) = 4V @ 250µA with 10V gate drive, while IRLZ14SPBF has Vgs(th) = 2V @ 250µA with 4V to 5V gate drive. The IRLZ14SPBF provides closer electrical compatibility with the original BTS113AE3064NKSA1 (Vgs(th) = 2.5V @ 1mA).
Q: Why is the IRFZ24PBF recommended for through-hole applications?
A: The IRFZ24PBF maintains the TO-220AB through-hole package of the original BTS113AE3064NKSA1, eliminating PCB layout modification. It exceeds the original specifications in continuous drain current (17A vs. 11.5A) and power dissipation (60W vs. 40W), providing design margin. The device is ROHS3 compliant with active product status.
Q: Can I use a surface-mount substitute if my application requires 11.5A continuous drain current?
A: No. All surface-mount alternatives (IRFZ14 and IRLZ14 series) are rated for 10A continuous drain current, which is below the 11.5A requirement. The IRFZ24PBF through-hole alternative is rated for 17A and is the appropriate choice for applications requiring 11.5A or higher continuous current.
Q: What is the difference between IRFZ14STRLPBF and IRLZ14STRLPBF?
A: Both devices are 60V, 10A N-Channel MOSFETs in D2PAK package supplied in Tape & Reel (TR) packaging with active product status. The primary difference is gate threshold voltage: IRFZ14STRLPBF has Vgs(th) = 4V @ 250µA with 10V gate drive, while IRLZ14STRLPBF has Vgs(th) = 2V @ 250µA with 4V to 5V gate drive. Tape & Reel packaging is suitable for automated assembly processes.
Q: Are all substitute parts RoHS compliant?
A: Yes. All listed substitute parts are ROHS3 compliant. The original BTS113AE3064NKSA1 is RoHS non-compliant. If RoHS compliance is required for your application, any of the listed substitutes satisfy this requirement.
Q: What is the operating temperature range difference between the original part and substitutes?
A: The BTS113AE3064NKSA1 operates from -55°C to 150°C (TJ). All substitute parts operate from -55°C to 175°C (TJ), providing an extended upper temperature limit of 25°C. This extended range provides additional thermal margin for high-temperature applications.
Q: Can I use IRLZ14STRRPBF instead of IRLZ14STRLPBF?
A: Yes. Both devices are electrically identical 60V, 10A N-Channel MOSFETs in D2PAK package with Vgs(th) = 2V and 4V to 5V gate drive. The difference is in tape reel configuration (STRRPBF vs. STRLPBF), which affects automated assembly compatibility. Consult your assembly equipment specifications to determine the appropriate reel configuration.
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