BSW-115-04-S-D Equivalent & Substitute Parts

Part Overview

The BSW-115-04-S-D is a 30-position rectangular receptacle connector manufactured by Samtec Inc., designed for board-to-board applications with 0.100" (2.54mm) pitch spacing. This connector features a breakaway design with bottom mount through-hole termination and gold-plated mating contacts. The part is currently active in production with 1,002 units in stock. Substitute parts are identified when equivalent electrical and mechanical parameters align with the core specifications, enabling direct replacement in applications where the original part becomes unavailable or when alternative packaging or compliance requirements necessitate component substitution.

Key Parameters

Parameter	Value
Connector Type	Receptacle, Breakaway
Number of Positions	30
Pitch - Mating	0.100" (2.54mm)
Number of Rows	2
Row Spacing - Mating	0.100" (2.54mm)
Mounting Type	Through Hole, Bottom Mount
Contact Type	Female Socket
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Termination	Solder
Operating Temperature	-55°C ~ 125°C
Material Flammability Rating	UL94 V-0
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the BSW-115-04-S-D is determined by strict alignment of the following core parameters:

Number of positions: 30
Pitch spacing: 0.100" (2.54mm)
Number of rows: 2
Row spacing: 0.100" (2.54mm)
Contact type: Female socket
Mounting method: Through hole
Termination: Solder
Contact finish (mating): Gold
Contact finish thickness (mating): 30.0µin (0.76µm)

The identified substitute part 1-534267-2 (TE Connectivity AMP Connectors) meets all critical electrical and mechanical parameters. Variations in connector entry style (breakaway vs. bottom/top entry), insulation height, contact post length, and post finish do not prevent functional substitution in board-to-board applications where the mating interface and solder termination requirements are identical.

Parameter Comparison

Parameter	BSW-115-04-S-D (Samtec)	1-534267-2 (TE Connectivity)
Manufacturer	Samtec Inc.	TE Connectivity AMP Connectors
Series	BSW	AMPMODU Mod IV
Number of Positions	30	30
Pitch - Mating	0.100" (2.54mm)	0.100" (2.54mm)
Number of Rows	2	2
Row Spacing - Mating	0.100" (2.54mm)	0.100" (2.54mm)
Connector Type	Receptacle, Breakaway	Receptacle, Bottom or Top Entry
Mounting Type	Through Hole, Bottom Mount	Through Hole
Contact Type	Female Socket	Female Socket
Termination	Solder	Solder
Contact Finish - Mating	Gold	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)	30.0µin (0.76µm)
Insulation Color	Black	Black
Insulation Height	0.350" (8.89mm)	0.265" (6.73mm)
Contact Length - Post	0.165" (4.19mm)	0.125" (3.18mm)
Contact Finish - Post	Tin	Tin-Lead
Operating Temperature	-55°C ~ 125°C	Not specified
Insulation Material	Polyethylene Terephthalate (PET), Glass Filled	Polyester, Glass Filled
Contact Material	Phosphor Bronze	Phosphor Bronze
Product Status	Active	Active
RoHS Status	ROHS3 Compliant	RoHS non-compliant
Packaging	Bulk	Tube
ECCN	EAR99	EAR99
HTSUS	8536.69.4040	8536.69.4040

Engineering Selection Recommendations

The BSW-115-04-S-D remains the primary selection for applications requiring ROHS3 compliance and UL94 V-0 flammability certification. The part is active in production with adequate inventory availability.

The 1-534267-2 substitute provides functional equivalence for the core mating interface and solder termination requirements. Selection of this substitute is appropriate when:

RoHS3 compliance is not a regulatory requirement
The application does not mandate UL94 V-0 material certification
PCB layout accommodates the reduced insulation height (0.265" vs. 0.350") and shorter contact post length (0.125" vs. 0.165")
Tin-lead post finish is acceptable for the application

Both parts share identical electrical characteristics at the mating interface, identical pitch spacing, identical row configuration, and identical gold contact finish thickness. Both are classified as EAR99 and share the same HTSUS code.

Frequently Asked Questions (FAQ)

Q: Can the 1-534267-2 be used as a direct drop-in replacement for the BSW-115-04-S-D?

A: Functional substitution is possible for the mating interface and solder termination. However, the 1-534267-2 has a shorter insulation height (0.265" vs. 0.350") and shorter contact post length (0.125" vs. 0.165"). PCB layout and clearance requirements must be verified before substitution.

Q: What are the key differences between these two connectors?

A: The primary differences are: connector entry style (breakaway vs. bottom/top entry), insulation height, contact post length, contact post finish (tin vs. tin-lead), insulation material composition (PET vs. polyester), and RoHS compliance status. The mating pitch, row spacing, contact type, and gold finish thickness are identical.

Q: Does the RoHS compliance difference affect substitution?

A: RoHS compliance is a regulatory and supply chain consideration, not an electrical or mechanical one. The 1-534267-2 is RoHS non-compliant. Substitution is only appropriate when RoHS3 compliance is not required by the application or end-use regulations.

Q: Are the packaging formats interchangeable?

A: The BSW-115-04-S-D is supplied in bulk packaging, while the 1-534267-2 is supplied in tube packaging. Packaging format does not affect connector function but may impact inventory management and handling procedures.

Q: What is the impact of different contact post finishes?

A: The BSW-115-04-S-D uses tin post finish, while the 1-534267-2 uses tin-lead post finish. Both are solder-compatible terminations. The tin-lead finish on the 1-534267-2 has greater thickness (150.0µin vs. unspecified for the BSW part). Post finish does not affect mating interface performance.

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