BSP752RNUMA1 Equivalent & Substitute Parts

Part Overview

The BSP752RNUMA1 is a Power Management Integrated Circuit (PMIC) functioning as a power switch with N-channel output configuration. This component is designed for high-side switching applications with a 1:1 input-to-output ratio, rated for 1.3A maximum output current and load voltages between 6V and 52V. The device is currently classified as obsolete, necessitating identification of active equivalent alternatives to maintain design continuity and ensure component availability for new production runs and field replacements.

Substiute Parts

BSP752RNUMA1

Infineon TechnologiesIn Stock: 814BSP752RNUMA1 Datasheet

Current PartRFQ

BSP752RXUMA2

Infineon TechnologiesIn Stock: 3705BSP752RXUMA2 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the BSP752RNUMA1 is determined by strict equivalence across the following critical parameters:

• Output Configuration & Topology: High-side N-channel switching with 1:1 input-to-output ratio
• Electrical Performance: Maximum output current of 1.3A, typical on-resistance of 150mOhm, load voltage range of 6V to 52V
• Thermal & Operating Range: Operating temperature from -40°C to 150°C (junction temperature)
• Package Compatibility: 8-SOIC surface mount package with 0.154" (3.90mm) width
• Fault Protection Features: Current limiting (fixed), open load detection, over-temperature, and over-voltage protection
• Interface Type: Non-inverting on/off control

The BSP752RXUMA2 qualifies as a parametric equivalent substitute, maintaining identical electrical specifications and package form factor while offering active product status and improved availability.

Parameter Comparison

Engineering Selection Recommendations

The BSP752RXUMA2 is the direct parametric equivalent for the obsolete BSP752RNUMA1. Both components share identical electrical specifications, thermal ratings, package geometry, and fault protection architecture. The substitute part maintains full compatibility with existing PCB layouts and design implementations.

The BSP752RXUMA2 offers the following advantages for component selection:

• Active Product Status: Currently in production with established supply chain availability
• Regulatory Compliance: RoHS3 compliant, meeting current environmental standards
• Series Designation: Part of the miniPROFET® product line, indicating Infineon's current generation technology
• Inventory Availability: Significantly higher stock levels (3600 units) compared to the obsolete part

The difference in Moisture Sensitivity Level (MSL 1 versus MSL 3) reflects standard manufacturing process evolution and does not impact electrical or thermal performance. MSL 3 with 168-hour floor life is standard for current surface-mount components and is suitable for standard manufacturing environments.

Frequently Asked Questions (FAQ)

Q: Can the BSP752RXUMA2 be used as a direct replacement for the BSP752RNUMA1 on existing PCBs?

A: Yes. Both parts share identical package geometry (8-SOIC, 0.154" width), pinout, and electrical specifications. No PCB modifications are required for substitution.

Q: What is the difference between the two part numbers?

A: The BSP752RNUMA1 is obsolete, while the BSP752RXUMA2 is an active equivalent from the same manufacturer. The electrical and thermal performance are identical. The substitute includes miniPROFET® series designation and RoHS3 compliance.

Q: Are there any thermal or electrical performance differences?

A: No. Both parts specify 1.3A maximum output current, 150mOhm typical on-resistance, 6V to 52V load voltage range, and -40°C to 150°C operating temperature. Fault protection features are identical.

Q: What does the different MSL rating mean?

A: MSL 1 (unlimited floor life) versus MSL 3 (168-hour floor life) reflects manufacturing process standards. MSL 3 is current industry standard for surface-mount components and requires standard moisture control during assembly. This does not affect component performance or reliability.

Q: Is the BSP752RXUMA2 suitable for automotive applications?

A: The BSP752RNUMA1 carries automotive grade and AEC-Q100 qualification. The BSP752RXUMA2 specifications do not explicitly list automotive qualification in the provided data. Confirm automotive suitability with the manufacturer if required for your application.

Q: What packaging options are available for the BSP752RXUMA2?

A: The BSP752RXUMA2 is available in Cut Tape (CT) and Digi-Reel® packaging formats, providing flexibility for both manual and automated assembly processes.