BSP250,135 P-Channel MOSFET 30V 3A SOT-223 Equivalent & Substitute Parts

Part Overview

The BSP250,135 is a P-Channel metal oxide semiconductor field-effect transistor (MOSFET) manufactured by Nexperia USA Inc., rated for 30V drain-to-source voltage and 3A continuous drain current in a surface mount SOT-223 package. This device is designated as "Not For New Designs," indicating it has been superseded in the manufacturer's product line. Identification of equivalent and substitute parts is necessary for ongoing production support, maintenance applications, and design continuity where this component is already deployed.

Substiute Parts

BSP250,135
Nexperia USA Inc.In Stock: 116279BSP250,135 Datasheet
BSP250,135
Current Part
BSP250,115
Nexperia USA Inc.In Stock: 25167BSP250,115 Datasheet
BSP250,115
Parametric Equivalent
FDT458P
onsemiIn Stock: 27019FDT458P Datasheet
FDT458P
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NDT452AP
onsemiIn Stock: 40711NDT452AP Datasheet
NDT452AP
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NDT456P
onsemiIn Stock: 23226NDT456P Datasheet
NDT456P
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NTF5P03T3G
onsemiIn Stock: 15440NTF5P03T3G Datasheet
NTF5P03T3G
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ZXMP3A16GTA
Diodes IncorporatedIn Stock: 24479ZXMP3A16GTA Datasheet
ZXMP3A16GTA
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ZXMP4A16GTA
Diodes IncorporatedIn Stock: 15401ZXMP4A16GTA Datasheet
ZXMP4A16GTA
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Key Parameters

Parameter Value Unit
FET Type P-Channel
Drain to Source Voltage (Vdss) 30 V
Continuous Drain Current (Id) @ 25°C 3 A
On-Resistance (Rds On) @ 1A, 10V 250 mOhm
Gate Threshold Voltage (Vgs(th)) @ 1mA 2.8 V
Gate Charge (Qg) @ 10V 25 nC
Input Capacitance (Ciss) @ 20V 250 pF
Power Dissipation (Max) 1.65 W
Operating Temperature (TJ) 150 °C
Mounting Type Surface Mount
Package SOT-223 (TO-261-4, TO-261AA)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the BSP250,135 MOSFET is determined by the following critical electrical and mechanical parameters:

Primary Substitution Criteria:

  • FET Type: P-Channel topology
  • Drain-to-Source Voltage (Vdss): Minimum 30V rating
  • Continuous Drain Current (Id): Minimum 3A at 25°C
  • Package Type: SOT-223 surface mount form factor
  • Pin Configuration: Compatible TO-261-4 or TO-261AA footprint

Secondary Compatibility Parameters:

  • On-Resistance (Rds On): Lower values indicate improved performance; values up to 250 mOhm at rated conditions are acceptable
  • Gate Threshold Voltage (Vgs(th)): Range 2.8V to 3V maintains gate drive compatibility
  • Maximum Gate Voltage (Vgs): ±20V specification must be maintained
  • Power Dissipation: Minimum 1.65W at ambient temperature
  • Operating Temperature: Maximum 150°C junction temperature

Substitute parts are grouped into two categories: Parametric Equivalents (identical electrical specifications from the same manufacturer) and Similar Alternatives (functionally compatible parts from other manufacturers with equal or superior electrical performance within the same package family).

Parameter Comparison

Parameter BSP250,135 BSP250,115 FDT458P NDT452AP NDT456P NTF5P03T3G ZXMP3A16GTA ZXMP4A16GTA
Manufacturer Nexperia Nexperia onsemi onsemi onsemi onsemi Diodes Inc. Diodes Inc.
FET Type P-Channel P-Channel P-Channel P-Channel P-Channel P-Channel P-Channel P-Channel
Vdss (V) 30 30 30 30 30 30 30 40
Id @ 25°C (A) 3 3 3.4 5 7.5 3.7 5.4 6.4
Rds On @ 10V (mOhm) 250 @ 1A 250 @ 1A 130 @ 3.4A 65 @ 5A 30 @ 7.5A 100 @ 5.2A 45 @ 4.2A 60 @ 3.8A
Vgs(th) (V) 2.8 @ 1mA 2.8 @ 1mA 3 @ 250µA 2.8 @ 250µA 3 @ 250µA 3 @ 250µA 1 @ 250µA 1 @ 250µA
Qg @ 10V (nC) 25 25 3.5 30 67 38 29.6 26.1
Ciss @ Vds (pF) 250 @ 20V 250 @ 20V 205 @ 15V 690 @ 15V 1440 @ 15V 950 @ 25V 1022 @ 15V 1007 @ 20V
Power Dissipation (W) 1.65 1.65 3 3 3 1.56 2 2
Operating Temp (°C) 150 150 -55 to 150 -65 to 150 -65 to 150 -55 to 150 -55 to 150 -55 to 150
Package SOT-223 SOT-223 SOT-223-4 SOT-223-4 SOT-223-4 SOT-223 SOT-223-3 SOT-223-3
Product Status Not For New Designs Not For New Designs Active Active Active Active Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

Parametric Equivalent (Direct Replacement):

The BSP250,115 from Nexperia USA Inc. is a parametric equivalent to the BSP250,135. Both devices share identical electrical specifications, including 30V Vdss, 3A continuous drain current, 250 mOhm on-resistance, and 1.65W power dissipation. Both are designated "Not For New Designs" and carry ROHS3 compliance with MSL 1 rating. This part provides direct functional substitution with no circuit redesign required.

Active Product Alternatives (Recommended for New Designs):

For applications requiring an active product status, the following alternatives are suitable:

onsemi FDT458P provides equivalent 30V/3.4A performance with improved on-resistance (130 mOhm) and lower gate charge (3.5 nC). Active product status and extended operating temperature range (-55°C to 150°C) support long-term availability.

onsemi NDT452AP offers higher current capability (5A) at 30V with significantly reduced on-resistance (65 mOhm @ 5A, 10V), enabling lower power dissipation in high-current applications. Extended temperature range (-65°C to 150°C) and active status ensure supply continuity.

onsemi NTF5P03T3G delivers 3.7A at 30V with 100 mOhm on-resistance and active product status. Power dissipation of 1.56W closely matches the BSP250,135, making it suitable for direct substitution in thermally constrained designs.

Diodes Incorporated ZXMP3A16GTA provides 5.4A at 30V with 45 mOhm on-resistance and active status. Superior current handling and lower on-resistance reduce thermal load in switching applications.

Diodes Incorporated ZXMP4A16GTA offers the highest voltage rating (40V) and current capability (6.4A) with 60 mOhm on-resistance. This part is suitable for applications requiring voltage margin above 30V or higher current capacity, with active product status ensuring long-term availability.

All substitute parts maintain SOT-223 package compatibility, ±20V gate voltage specification, ROHS3 compliance, and MSL 1 moisture sensitivity rating. Selection among alternatives depends on specific application requirements for current capacity, on-resistance, thermal performance, and long-term supply assurance.

Frequently Asked Questions (FAQ)

Q: Can the BSP250,115 be used as a direct replacement for the BSP250,135?

A: Yes. The BSP250,115 is a parametric equivalent with identical electrical specifications, package type, and pin configuration. No circuit modifications are required for substitution.

Q: Why are there multiple substitute parts with different current ratings?

A: The BSP250,135 is rated for 3A continuous drain current. Substitute parts with higher current ratings (NDT452AP at 5A, NDT456P at 7.5A, ZXMP3A16GTA at 5.4A, ZXMP4A16GTA at 6.4A) provide functional compatibility with improved current handling capability. These parts are suitable for applications where the original 3A specification is adequate but higher current margin is beneficial. Parts with lower current ratings are not listed as substitutes.

Q: What is the significance of the "Not For New Designs" status?

A: This designation indicates the manufacturer has discontinued active development and recommends against use in new product designs. However, these parts remain available for existing production and maintenance applications. For new designs, active product alternatives such as FDT458P, NDT452AP, NTF5P03T3G, ZXMP3A16GTA, or ZXMP4A16GTA are recommended to ensure long-term supply availability.

Q: Are all substitute parts available in the same SOT-223 package?

A: All substitute parts are available in SOT-223 surface mount packages with compatible TO-261-4 or TO-261AA footprints. Minor package variant designations (SOT-223, SOT-223-3, SOT-223-4) reflect manufacturer nomenclature but maintain electrical and mechanical compatibility for PCB assembly.

Q: How do on-resistance differences affect circuit performance?

A: On-resistance (Rds On) determines conduction losses and heat generation. The BSP250,135 specifies 250 mOhm at 1A and 10V gate voltage. Substitute parts with lower on-resistance values (FDT458P at 130 mOhm, NDT452AP at 65 mOhm, NTF5P03T3G at 100 mOhm, ZXMP3A16GTA at 45 mOhm, ZXMP4A16GTA at 60 mOhm) reduce power dissipation and thermal load. Selection depends on application current levels and thermal budget requirements.

Q: What is the importance of gate charge (Qg) in substitution?

A: Gate charge affects switching speed and gate drive circuit requirements. The BSP250,135 specifies 25 nC at 10V. Substitute parts with lower gate charge (FDT458P at 3.5 nC, ZXMP4A16GTA at 26.1 nC) enable faster switching transitions. Higher gate charge values (NDT456P at 67 nC, NTF5P03T3G at 38 nC, ZXMP3A16GTA at 29.6 nC) require proportionally longer switching times but remain compatible with standard gate drive circuits.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All listed substitute parts carry ROHS3 compliance certification and MSL 1 (Unlimited) moisture sensitivity rating, matching the environmental and regulatory specifications of the BSP250,135.

Q: Can the ZXMP4A16GTA be used in place of the BSP250,135 despite its 40V rating?

A: Yes. The ZXMP4A16GTA is rated for 40V Vdss, which exceeds the 30V requirement of the BSP250,135. Higher voltage rating provides design margin and does not create incompatibility. The part is suitable for applications where the original 30V specification is adequate. Gate voltage, current capacity, and package compatibility are maintained.

Q: What is the difference between cut tape and tape & reel packaging?

A: Tape & Reel (TR) packaging is supplied on continuous carrier tape for automated assembly equipment. Cut Tape (CT) and Digi-Reel packaging are supplied in smaller quantities on cut segments or alternative reel formats. Both formats contain identical components; packaging format selection depends on production volume and assembly equipment compatibility.

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