BSO613SPV MOSFET P-Channel 60V 3.44A Equivalent & Substitute Parts

Part Overview

The BSO613SPV is a P-Channel MOSFET manufactured by Infineon Technologies, designed for surface mount applications in the 8-SOIC package. This device operates at 60V drain-to-source voltage with a continuous drain current of 3.44A at 25°C and maximum power dissipation of 2.5W. The BSO613SPV is classified as obsolete, making identification of equivalent and substitute parts essential for ongoing design support and production continuity. Substitute parts must maintain electrical compatibility across voltage ratings, current handling, thermal characteristics, and mechanical packaging to ensure direct replacement capability.

Key Parameters

Parameter	Value	Unit
FET Type	P-Channel	—
Drain to Source Voltage (Vdss)	60	V
Continuous Drain Current (Id) @ 25°C	3.44	A
Rds On (Max) @ Id, Vgs	130	mOhm @ 3.44A, 10V
Gate Threshold Voltage (Vgs(th)) @ Id	4	V @ 1mA
Gate Charge (Qg) @ Vgs	30	nC @ 10V
Input Capacitance (Ciss) @ Vds	875	pF @ 25V
Power Dissipation (Max)	2.5	W (Ta)
Operating Temperature Range	-55 to 150	°C (TJ)
Package / Case	8-SOIC (0.154", 3.90mm Width)	—
Mounting Type	Surface Mount	—

Substitute Part Grouping Explanation

Substitution of the BSO613SPV is determined by strict equivalence across the following critical parameters:

Electrical Compatibility Requirements:

Drain-to-Source Voltage (Vdss): Must equal or exceed 60V
Continuous Drain Current (Id): Must meet or exceed 3.44A at 25°C
On-State Resistance (Rds On): Must not exceed 130 mOhm at specified Id and Vgs conditions
Gate Threshold Voltage (Vgs(th)): Must be compatible with 4V @ 1mA specification
Gate Charge (Qg): Must not exceed 30 nC @ 10V
Input Capacitance (Ciss): Must not exceed 875 pF @ 25V
Power Dissipation: Must support minimum 2.5W (Ta)
Operating Temperature: Must support -55°C to 150°C range

Mechanical Compatibility Requirements:

Package Type: 8-SOIC (0.154", 3.90mm Width) mandatory
Mounting Type: Surface Mount required
Pin Configuration: Must maintain identical pinout

Substitute Parts Identified:

BSO613SPVGXUMA1 (Infineon Technologies) — Parametric Equivalent with Active Product Status
SI9407BDY-T1-GE3 (Vishay Siliconix) — Manufacturer-Recommended Substitute with Enhanced Performance

Parameter Comparison

Parameter	BSO613SPV	BSO613SPVGXUMA1	SI9407BDY-T1-GE3
Manufacturer	Infineon Technologies	Infineon Technologies	Vishay Siliconix
FET Type	P-Channel	P-Channel	P-Channel
Vdss	60V	60V	60V
Id @ 25°C	3.44A (Ta)	3.44A (Ta)	4.7A (Tc)
Rds On (Max)	130 mOhm @ 3.44A, 10V	130 mOhm @ 3.44A, 10V	120 mOhm @ 3.2A, 10V
Vgs(th) (Max)	4V @ 1mA	4V @ 1mA	3V @ 250µA
Gate Charge (Qg)	30 nC @ 10V	30 nC @ 10V	22 nC @ 10V
Ciss (Max)	875 pF @ 25V	875 pF @ 25V	600 pF @ 30V
Power Dissipation (Max)	2.5W (Ta)	2.5W (Ta)	2.4W (Ta), 5W (Tc)
Operating Temperature	-55°C to 150°C (TJ)	-55°C to 150°C (TJ)	-55°C to 150°C (TJ)
Package	8-SOIC (0.154", 3.90mm Width)	8-SOIC (0.154", 3.90mm Width)	8-SOIC (0.154", 3.90mm Width)
Product Status	Obsolete	Active	Active
RoHS Compliance	Non-compliant	ROHS3 Compliant	ROHS3 Compliant

Engineering Selection Recommendations

BSO613SPVGXUMA1 Selection Criteria:

The BSO613SPVGXUMA1 is the direct parametric equivalent to the obsolete BSO613SPV. This part maintains identical electrical specifications across all critical parameters: 60V Vdss, 3.44A continuous drain current, 130 mOhm Rds On, and 2.5W power dissipation. The primary advantage is active product status, ensuring long-term availability and supply chain continuity. This part carries ROHS3 compliance and AEC-Q101 automotive qualification, meeting modern regulatory requirements. Packaging is identical 8-SOIC format. Moisture sensitivity level increases from MSL 1 to MSL 3 (168 hours), requiring appropriate handling during storage and assembly.

SI9407BDY-T1-GE3 Selection Criteria:

The SI9407BDY-T1-GE3 from Vishay Siliconix exceeds the minimum electrical requirements of the BSO613SPV across multiple parameters. Continuous drain current is rated at 4.7A (Tc), providing 36.6% higher current capacity. On-state resistance is reduced to 120 mOhm, improving efficiency by 7.7%. Gate charge is reduced to 22 nC, decreasing switching losses by 26.7%. Input capacitance is reduced to 600 pF, enabling faster switching response. Power dissipation capability reaches 5W (Tc), providing thermal margin. This part is ROHS3 compliant with MSL 1 (unlimited) moisture sensitivity. Selection of this part is appropriate when design margins, thermal performance, or switching speed improvements are beneficial to system performance.

Frequently Asked Questions (FAQ)

Q: Can the BSO613SPVGXUMA1 be used as a direct replacement for the BSO613SPV?

A: Yes. The BSO613SPVGXUMA1 maintains identical electrical specifications across all critical parameters: 60V Vdss, 3.44A Id, 130 mOhm Rds On, 30 nC gate charge, and 2.5W power dissipation. The 8-SOIC package and pinout are identical. The primary difference is product status (active versus obsolete) and RoHS compliance (ROHS3 versus non-compliant). Moisture sensitivity level increases from MSL 1 to MSL 3, requiring appropriate handling protocols.

Q: What are the key differences between BSO613SPVGXUMA1 and SI9407BDY-T1-GE3?

A: Both parts meet or exceed the BSO613SPV electrical requirements and share identical 8-SOIC packaging. The SI9407BDY-T1-GE3 provides enhanced performance: 4.7A continuous drain current (versus 3.44A), 120 mOhm Rds On (versus 130 mOhm), 22 nC gate charge (versus 30 nC), and 600 pF input capacitance (versus 875 pF). The SI9407BDY-T1-GE3 maintains MSL 1 moisture sensitivity, while BSO613SPVGXUMA1 is MSL 3. Both are ROHS3 compliant and support -55°C to 150°C operating range.

Q: Are these parts pin-compatible with the BSO613SPV?

A: Yes. Both substitute parts use the 8-SOIC (0.154", 3.90mm Width) package with identical pinout to the BSO613SPV. Surface mount assembly processes require no modification. PCB footprints designed for the BSO613SPV are directly compatible with both substitute parts.

Q: What is the impact of MSL 3 moisture sensitivity on the BSO613SPVGXUMA1?

A: MSL 3 classification indicates the part absorbs moisture and requires controlled storage conditions. Maximum floor life is 168 hours at 30°C and 60% relative humidity after bag opening. Parts must be baked at 125°C for 24 hours before reflow soldering if floor life is exceeded. MSL 1 parts (SI9407BDY-T1-GE3) have unlimited floor life and do not require baking procedures.

Q: Can the SI9407BDY-T1-GE3 be used in applications where the BSO613SPV was originally specified?

A: Yes. The SI9407BDY-T1-GE3 meets all minimum electrical requirements of the BSO613SPV and provides enhanced performance across multiple parameters. The 8-SOIC package and pinout are identical. Enhanced current capacity (4.7A versus 3.44A), reduced on-state resistance (120 mOhm versus 130 mOhm), and lower gate charge (22 nC versus 30 nC) provide design margin and improved efficiency. No circuit modifications are required.

Q: What compliance certifications apply to each substitute part?

A: BSO613SPVGXUMA1 carries ROHS3 compliance and AEC-Q101 automotive qualification. SI9407BDY-T1-GE3 carries ROHS3 compliance. Both parts are REACH unaffected and classified as EAR99 for export control purposes. The original BSO613SPV is RoHS non-compliant, making both substitutes suitable for modern regulatory environments.

Q: Are there inventory considerations when selecting between these substitute parts?

A: BSO613SPVGXUMA1 has 4,253 pieces in stock. SI9407BDY-T1-GE3 has 35,400 pieces in stock. The SI9407BDY-T1-GE3 offers significantly higher availability, reducing supply chain risk for high-volume production or long-term support requirements.

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