BSL207SP P-Channel MOSFET 20V 6A Equivalent & Substitute Parts

Part Overview

The BSL207SP is a P-Channel MOSFET manufactured by Infineon Technologies, rated for 20V drain-to-source voltage with 6A continuous drain current at 25°C. This device is packaged in a PG-TSOP6-6 (SOT-23-6 Thin) surface mount configuration and is part of the OptiMOS™ series. The BSL207SP is classified as obsolete, making identification of functionally equivalent substitute parts essential for ongoing design support and production continuity. Substitute parts must maintain compatibility across voltage ratings, current handling, thermal characteristics, and package form factors while meeting modern RoHS compliance requirements.

Key Parameters

Parameter	Value	Unit
FET Type	P-Channel	—
Drain-to-Source Voltage (Vdss)	20	V
Continuous Drain Current (Id) @ 25°C	6	A
On-State Resistance (Rds On) @ 6A, 4.5V	41	mOhm
Gate Threshold Voltage (Vgs(th)) @ 40µA	1.2	V
Gate Charge (Qg) @ 4.5V	20	nC
Power Dissipation (Max)	2	W
Operating Temperature Range	-55 to 150	°C
Package Type	SOT-23-6 Thin (TSOT-23-6)	—
Mounting Type	Surface Mount	—
Product Status	Obsolete	—
RoHS Status	Non-compliant	—

Substitute Part Grouping Explanation

Substitute parts for the BSL207SP are selected based on strict electrical and mechanical compatibility criteria. The primary substitution parameters are:

Mandatory Matching Criteria:

Drain-to-Source Voltage (Vdss): 20V (exact match required)
FET Type: P-Channel (exact match required)
Technology: MOSFET (Metal Oxide) (exact match required)
Mounting Type: Surface Mount (exact match required)
Package Family: SOT-23-6 or equivalent 6-pin surface mount packages

Performance Compatibility Criteria:

Continuous Drain Current (Id): Minimum 4.5A (BSL207SP rated at 6A; substitutes rated 4.5A to 5.7A are acceptable for applications not requiring full 6A capacity)
On-State Resistance (Rds On): Lower or equivalent values indicate improved performance
Gate Charge (Qg): Values within ±30% of original support similar switching characteristics
Power Dissipation: Minimum 1.6W (Ta) or higher thermal ratings support thermal management

Compliance Criteria:

RoHS3 Compliance: Required for modern production environments
Operating Temperature: -55°C to 150°C minimum (PMN30XPAX extends to 175°C)
Moisture Sensitivity Level (MSL): Level 1 (Unlimited) for all candidates

Substitute parts are grouped into two categories: onsemi PowerTrench® devices (FDC602P, FDC638APZ, FDC638P, FDC640P) and Nexperia TrenchMOS™ automotive-qualified devices (PMN30XPAX, PMN40UPEAX, PMN42XPEAX). All substitute parts maintain the 20V Vdss rating and surface mount packaging while offering active product status and RoHS3 compliance.

Parameter Comparison

Parameter	BSL207SP (Main)	FDC602P	FDC638APZ	FDC638P	FDC640P	PMN30XPAX	PMN40UPEAX	PMN42XPEAX
Manufacturer	Infineon	onsemi	onsemi	onsemi	onsemi	Nexperia	Nexperia	Nexperia
FET Type	P-Channel	P-Channel	P-Channel	P-Channel	P-Channel	P-Channel	P-Channel	P-Channel
Vdss (V)	20	20	20	20	20	20	20	20
Id @ 25°C (A)	6	5.5	4.5	4.5	4.5	5.2	4.7	5.7
Rds On @ 4.5V (mOhm)	41	35	43	48	53	33	43	46
Vgs(th) (V)	1.2	1.5	1.5	1.5	1.5	1.3	0.95	1.25
Qg @ 4.5V (nC)	20	20	12	14	13	16	23	17.3
Ciss @ 10V (pF)	1007	1456	1000	1160	890	1039	1820	1410
Power Dissipation (W)	2 (Ta)	1.6 (Ta)	1.6 (Ta)	1.6 (Ta)	1.6 (Ta)	0.66 (Ta) / 7.5 (Tc)	0.5 (Ta) / 8.33 (Tc)	0.5 (Ta) / 8.33 (Tc)
Operating Temp (°C)	-55 to 150	-55 to 150	-55 to 150	-55 to 150	-55 to 150	-55 to 175	-55 to 150	-55 to 150
Package	SOT-23-6 Thin	SOT-23-6 Thin	SOT-23-6 Thin	SOT-23-6 Thin	SOT-23-6 Thin	SC-74 / SOT-457	SC-74 / SOT-457	SC-74 / SOT-457
RoHS Status	Non-compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Product Status	Obsolete	Active	Active	Active	Active	Active	Active	Active
Automotive Grade	—	—	—	—	—	AEC-Q101	AEC-Q101	AEC-Q101

Engineering Selection Recommendations

onsemi PowerTrench® Series (FDC602P, FDC638APZ, FDC638P, FDC640P)

These devices provide direct functional substitution with active product status and ROHS3 compliance. FDC602P offers the closest current rating match at 5.5A and delivers superior on-state resistance (35 mOhm) compared to the BSL207SP. FDC638APZ and FDC638P are rated for 4.5A continuous drain current, suitable for applications where full 6A capacity is not required. FDC640P provides the highest inventory availability (172,946 pcs) among onsemi options. All PowerTrench® devices maintain the SOT-23-6 Thin package footprint, enabling direct PCB layout compatibility. These parts are recommended for non-automotive applications requiring standard industrial temperature ranges (-55°C to 150°C).

Nexperia TrenchMOS™ Automotive Series (PMN30XPAX, PMN40UPEAX, PMN42XPEAX)

These devices are AEC-Q101 qualified automotive-grade MOSFETs with extended thermal performance specifications. PMN30XPAX delivers 5.2A continuous current with superior on-state resistance (33 mOhm) and extends operating temperature to 175°C, supporting high-reliability automotive applications. PMN42XPEAX provides the highest current rating at 5.7A with 46 mOhm on-state resistance. PMN40UPEAX offers 4.7A rating with lower gate threshold voltage (950 mV). All Nexperia devices use SC-74/SOT-457 packaging, which differs from the SOT-23-6 Thin footprint; PCB layout modification is required. These parts are recommended for automotive applications, high-temperature environments, or designs requiring AEC-Q101 qualification.

Substitution Priority:

For direct footprint compatibility and industrial applications: FDC602P (best current match) or FDC640P (highest availability).

For automotive or extended temperature applications: PMN30XPAX (best performance) or PMN42XPEAX (highest current).

All substitute parts are RoHS3 compliant and carry active product status, ensuring long-term supply availability and regulatory compliance.

Frequently Asked Questions (FAQ)

Q1: Can FDC602P directly replace BSL207SP without PCB modifications?

Yes. FDC602P maintains the SOT-23-6 Thin package footprint and pinout compatibility with BSL207SP. No PCB layout changes are required. The 5.5A continuous current rating supports applications rated up to 5.5A; applications requiring the full 6A capacity of BSL207SP must be re-evaluated.

Q2: What is the difference between onsemi PowerTrench® and Nexperia TrenchMOS™ packages?

onsemi PowerTrench® devices (FDC602P, FDC638APZ, FDC638P, FDC640P) use SOT-23-6 Thin packaging, maintaining footprint compatibility with BSL207SP. Nexperia TrenchMOS™ devices (PMN30XPAX, PMN40UPEAX, PMN42XPEAX) use SC-74/SOT-457 packaging, which requires PCB layout redesign. SC-74/SOT-457 is a smaller package with different pin spacing.

Q3: Why do some substitute parts have lower current ratings than BSL207SP?

FDC638APZ, FDC638P, and FDC640P are rated for 4.5A continuous drain current, compared to BSL207SP's 6A rating. These devices are suitable for applications with maximum current requirements of 4.5A or lower. Applications requiring sustained 6A operation should use FDC602P (5.5A) or PMN42XPEAX (5.7A).

Q4: Are Nexperia automotive-grade devices required for non-automotive applications?

No. Nexperia PMN30XPAX, PMN40UPEAX, and PMN42XPEAX carry AEC-Q101 automotive qualification, which is not necessary for industrial or consumer applications. onsemi PowerTrench® devices provide equivalent electrical performance for non-automotive use. Automotive qualification adds cost and is only required for automotive system designs.

Q5: What is the thermal performance difference between Ta and Tc power dissipation ratings?

Ta (ambient temperature) ratings assume natural convection cooling in free air. Tc (case temperature) ratings assume active thermal management with a heat sink or controlled thermal interface. Nexperia devices specify both ratings (e.g., 0.66W Ta / 7.5W Tc), indicating significantly improved thermal performance with proper heat sinking. onsemi devices specify Ta ratings only (1.6W). For high-power applications, Nexperia devices with Tc ratings provide superior thermal headroom.

Q6: Can BSL207SP be replaced with a lower-current device in existing designs?

Substitution with lower-current devices (4.5A) is permissible only if circuit analysis confirms maximum sustained drain current does not exceed the substitute part's rating. Peak or transient currents exceeding the rated continuous current may cause device failure. Thermal analysis must also account for reduced power dissipation ratings in lower-current devices.

Q7: Why is RoHS3 compliance important for BSL207SP substitution?

BSL207SP is RoHS non-compliant, reflecting its obsolete status and pre-2006 design. All substitute parts are ROHS3 compliant, meeting current environmental regulations for lead-free manufacturing and restricted substance limits. RoHS3 compliance is mandatory for new production and ensures regulatory acceptance in global markets.

Q8: What is the significance of gate charge (Qg) differences among substitute parts?

Gate charge affects switching speed and driver circuit requirements. BSL207SP specifies 20 nC at 4.5V. FDC638APZ (12 nC) and FDC640P (13 nC) have lower gate charge, enabling faster switching with lower driver power consumption. PMN40UPEAX (23 nC) has higher gate charge, requiring more driver current but potentially offering better noise immunity. For most applications, gate charge differences within ±30% are not critical.

Q9: Is PCB layout redesign required when switching from SOT-23-6 to SC-74/SOT-457 packaging?

Yes. SC-74/SOT-457 has different pin spacing and footprint dimensions compared to SOT-23-6 Thin. PCB layout, trace routing, and thermal management must be redesigned. Footprint libraries must be updated, and design verification testing is required before production release.

Q10: Which substitute part offers the best overall performance match to BSL207SP?

FDC602P provides the closest electrical performance match with 5.5A continuous current, 35 mOhm on-state resistance, and direct SOT-23-6 Thin package compatibility. For applications requiring maximum current capacity and extended temperature range, PMN42XPEAX (5.7A, AEC-Q101, -55°C to 150°C) is the best match, with the trade-off of requiring PCB layout redesign due to SC-74/SOT-457 packaging.

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