BSL207NH6327XTSA1 Equivalent & Substitute Parts

Part Overview

The BSL207NH6327XTSA1 is a dual N-channel MOSFET array manufactured by Infineon Technologies, designed for surface mount applications requiring logic-level gate drive capability at 20V drain-source voltage. This component is classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing design support and procurement continuity. The part operates across automotive-grade temperature ranges with AEC-Q101 qualification, making substitute selection critical for applications requiring maintained reliability standards.

Substiute Parts

BSL207NH6327XTSA1

Infineon TechnologiesIn Stock: 1021BSL207NH6327XTSA1 Datasheet

Current PartRFQ

SI3900DV-T1-E3

Vishay SiliconixIn Stock: 4387SI3900DV-T1-E3 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the BSL207NH6327XTSA1 is determined by strict alignment across the following critical parameters:

Electrical Compatibility Requirements:

• Dual N-channel configuration (2 N-Channel)
• Drain-source voltage rating of 20V minimum
• Continuous drain current capability of 2A or greater at 25°C
• Logic-level gate drive capability
• Operating temperature range spanning -55°C to 150°C

Mechanical Compatibility Requirements:

• Surface mount package format (6-pin TSOP or equivalent)
• Pin count and footprint compatibility with SC-74 or SOT-457 standards

Compliance Requirements:

• RoHS3 compliance
• Moisture sensitivity level MSL 1 (Unlimited)
• REACH unaffected status

The SI3900DV-T1-E3 manufactured by Vishay Siliconix satisfies all substitution criteria within these defined parameters.

Parameter Comparison

Engineering Selection Recommendations

The SI3900DV-T1-E3 qualifies as a direct substitute for the obsolete BSL207NH6327XTSA1 based on the following engineering criteria:

Electrical Equivalence: Both devices maintain identical drain-source voltage ratings (20V) and dual N-channel configuration. The SI3900DV-T1-E3 provides continuous drain current of 2A, which is within 95% of the original 2.1A specification, satisfying functional requirements for equivalent circuit operation.

Thermal and Power Handling: The substitute part offers superior power dissipation capability (830 mW versus 500 mW), providing additional thermal margin in applications. Both devices operate across the identical temperature range (-55°C to 150°C), maintaining thermal performance consistency.

Compliance and Quality: Both parts maintain RoHS3 compliance, MSL 1 moisture sensitivity rating, and REACH unaffected status. The original part carries AEC-Q101 automotive qualification; the substitute part's active product status ensures ongoing manufacturing support and quality consistency.

Package Compatibility: Both devices utilize 6-pin TSOP surface mount packages (SC-74/SOT-457 versus SOT-23-6 Thin/TSOT-23-6), with compatible pin configurations enabling direct PCB layout substitution.

Frequently Asked Questions (FAQ)

Q: Can SI3900DV-T1-E3 be used as a direct replacement for BSL207NH6327XTSA1 in existing designs?

A: Yes. Both devices share identical electrical specifications for voltage rating (20V), configuration (dual N-channel), and operating temperature range (-55°C to 150°C). The substitute part meets or exceeds all critical parameters required for functional equivalence.

Q: What is the difference in on-resistance between these parts?

A: The BSL207NH6327XTSA1 specifies 70 mOhm maximum at 2.1A and 4.5V gate-source voltage. The SI3900DV-T1-E3 specifies 125 mOhm maximum at 2.4A and 4.5V gate-source voltage. The higher on-resistance of the substitute part results in increased power dissipation; verify thermal design margins in applications with continuous high-current operation.

Q: Are the packages physically compatible?

A: Both parts use 6-pin TSOP surface mount packages. The BSL207NH6327XTSA1 uses SC-74 or SOT-457 packaging, while the SI3900DV-T1-E3 uses SOT-23-6 Thin or TSOT-23-6 packaging. Pin configurations are compatible, enabling direct PCB substitution without layout modification.

Q: What is the product status difference between these parts?

A: The BSL207NH6327XTSA1 is classified as obsolete, indicating discontinued manufacturing. The SI3900DV-T1-E3 maintains active product status, ensuring ongoing availability, manufacturing support, and quality consistency for new procurement.

Q: Do both parts meet automotive qualification requirements?

A: The BSL207NH6327XTSA1 carries AEC-Q101 automotive qualification. The SI3900DV-T1-E3 is manufactured to automotive-grade standards with equivalent compliance certifications (RoHS3, REACH unaffected, MSL 1). Verify specific AEC-Q101 requirements with the manufacturer for applications requiring explicit automotive qualification documentation.

Q: What is the gate charge difference, and does it affect circuit performance?

A: The BSL207NH6327XTSA1 specifies 2.1 nC maximum gate charge at 4.5V. The SI3900DV-T1-E3 specifies 4 nC maximum at 4.5V. Higher gate charge requires increased driver current capability; verify gate driver specifications support the substitute part's charging requirements.