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BSH103,235 N-Channel MOSFET 30V 850mA Equivalent & Substitute Parts
Part Overview
The BSH103,235 is an N-Channel MOSFET manufactured by Nexperia USA Inc., rated for 30V drain-to-source voltage with 850mA continuous drain current in a Surface Mount TO-236AB package. This device is classified as "Not For New Designs," indicating it has reached end-of-life status. The product status necessitates identification of equivalent and substitute components for ongoing maintenance, repair, and legacy system support applications.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| FET Type | N-Channel | — |
| Drain to Source Voltage (Vdss) | 30 | V |
| Continuous Drain Current (Id) @ 25°C | 850 | mA |
| Rds On (Max) @ 500mA, 4.5V | 400 | mOhm |
| Power Dissipation (Max) | 540 | mW |
| Gate Charge (Qg) @ 4.5V | 2.1 | nC |
| Input Capacitance (Ciss) @ 24V | 83 | pF |
| Operating Temperature Range | -55 to 150 | °C |
| Package Type | TO-236AB (SOT-23-3) | — |
| Mounting Type | Surface Mount | — |
Substitute Part Grouping Explanation
Substitution eligibility for the BSH103,235 is determined by the following critical parameters:
Primary Substitution Criteria:
- FET Type: N-Channel topology
- Drain to Source Voltage (Vdss): Minimum 30V rating
- Continuous Drain Current (Id): Minimum 850mA at 25°C
- Package Compatibility: TO-236AB / SOT-23-3 surface mount form factor
- Operating Temperature Range: -55°C to 150°C minimum
- RoHS3 Compliance and MSL Level 1 rating
Secondary Compatibility Factors:
- Rds On characteristics at specified gate voltage
- Gate charge and input capacitance within acceptable operating margins
- Power dissipation capability for thermal management
Substitute parts are classified into two categories: Parametric Equivalents (identical electrical specifications with different packaging options) and Similar Alternatives (functionally compatible with performance variations in specific parameters).
Parameter Comparison
| Parameter | BSH103,235 (Main) | BSH103,215 (Parametric Equivalent) | FDV303N (Similar) | NTR4503NT1G (Similar) | PJA3432_R1_00001 (Similar) |
|---|---|---|---|---|---|
| Manufacturer | Nexperia USA Inc. | Nexperia USA Inc. | onsemi | onsemi | Panjit International Inc. |
| FET Type | N-Channel | N-Channel | N-Channel | N-Channel | N-Channel |
| Vdss (V) | 30 | 30 | 25 | 30 | 30 |
| Id @ 25°C (mA) | 850 | 850 | 680 | 1500 | 1600 |
| Rds On (Max) @ 4.5V (mOhm) | 400 @ 500mA | 400 @ 500mA | 450 @ 500mA | 110 @ 2.5A | 200 @ 1.6A |
| Power Dissipation (Max) (mW) | 540 | 540 | 350 | 420 | 1250 |
| Gate Charge @ 4.5V (nC) | 2.1 | 2.1 | 2.3 | 7 | 1.5 |
| Input Capacitance (pF) | 83 @ 24V | 83 @ 24V | 50 @ 10V | 250 @ 24V | 93 @ 15V |
| Operating Temperature (°C) | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 |
| Package | TO-236AB | TO-236AB | SOT-23-3 | SOT-23-3 | SOT-23 |
| Product Status | Not For New Designs | Not For New Designs | Active | Active | Active |
| RoHS3 Compliance | Yes | Yes | Yes | Yes | Yes |
| MSL Rating | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
BSH103,215 (Parametric Equivalent - Nexperia USA Inc.)
The BSH103,215 provides direct parametric equivalence to the BSH103,235 with identical electrical specifications across all critical parameters: 30V Vdss, 850mA Id, 400mOhm Rds On, and 540mW power dissipation. The primary distinction is packaging format: BSH103,215 is supplied in Cut Tape and Digi-Reel format versus Tape & Reel for the main part. Both devices share identical RoHS3 compliance, MSL Level 1 rating, and operating temperature range. Selection of BSH103,215 is appropriate for direct replacement in applications where packaging format compatibility exists. Both parts carry "Not For New Designs" status, indicating limited long-term availability.
NTR4503NT1G (Similar Alternative - onsemi)
The NTR4503NT1G is an active-status N-Channel MOSFET rated for 30V Vdss with 1.5A continuous drain current, exceeding the BSH103,235 current capability by 76%. This device features superior on-resistance (110mOhm @ 2.5A, 10V) and lower power dissipation (420mW), providing enhanced thermal performance. The higher gate charge (7nC) and input capacitance (250pF) indicate increased switching losses compared to the main part. The NTR4503NT1G is suitable for applications requiring higher current handling or improved efficiency, with the trade-off of increased gate drive requirements. Active product status ensures ongoing availability and support.
PJA3432_R1_00001 (Similar Alternative - Panjit International Inc.)
The PJA3432_R1_00001 is an active-status N-Channel MOSFET rated for 30V Vdss with 1.6A continuous drain current and 1.25W power dissipation, providing the highest thermal capability among substitute options. This device exhibits the lowest gate charge (1.5nC @ 4.5V) and moderate on-resistance (200mOhm @ 1.6A, 4.5V), indicating efficient gate drive characteristics. The PJA3432_R1_00001 is suitable for applications prioritizing thermal headroom and gate drive efficiency. Active product status ensures component availability.
FDV303N (Similar Alternative - onsemi)
The FDV303N is an active-status N-Channel MOSFET rated for 25V Vdss with 680mA continuous drain current, representing a lower-voltage, lower-current alternative. This device exhibits reduced power dissipation (350mW) and lower input capacitance (50pF @ 10V), suitable for applications with relaxed voltage and current requirements. The 25V Vdss rating is below the BSH103,235 specification and limits applicability to circuits with maximum operating voltages below 25V. Selection of FDV303N is appropriate only when circuit design permits reduced voltage margin.
Frequently Asked Questions (FAQ)
Q: Can BSH103,215 be used as a direct replacement for BSH103,235?
A: Yes. The BSH103,215 is a parametric equivalent with identical electrical specifications: 30V Vdss, 850mA Id, 400mOhm Rds On, and 540mW power dissipation. The difference is packaging format (Cut Tape/Digi-Reel versus Tape & Reel). Direct substitution is valid provided the packaging format is compatible with assembly equipment and supply chain requirements.
Q: What are the key differences between the main part and NTR4503NT1G?
A: The NTR4503NT1G provides higher current capability (1.5A versus 850mA) and lower on-resistance (110mOhm versus 400mOhm), resulting in improved thermal performance. However, it exhibits higher gate charge (7nC versus 2.1nC) and input capacitance (250pF versus 83pF), requiring stronger gate drive circuits. The NTR4503NT1G is suitable for applications where current headroom or efficiency improvements justify increased gate drive complexity.
Q: Is FDV303N suitable for all BSH103,235 applications?
A: No. The FDV303N is rated for 25V Vdss, which is 5V below the BSH103,235 specification. This device is suitable only for applications where the maximum operating voltage does not exceed 25V. For circuits designed for 30V operation, FDV303N introduces voltage margin risk and is not recommended.
Q: What is the significance of "Not For New Designs" status?
A: This designation indicates the BSH103,235 has reached end-of-life and is no longer recommended for new product development. Existing inventory remains available for legacy system support and repair. For new designs, active-status alternatives such as NTR4503NT1G or PJA3432_R1_00001 are preferred due to guaranteed long-term availability and manufacturer support.
Q: Are all substitute parts RoHS3 compliant?
A: Yes. All listed substitute parts (BSH103,215, FDV303N, NTR4503NT1G, and PJA3432_R1_00001) are RoHS3 compliant with MSL Level 1 rating, meeting environmental and moisture sensitivity requirements equivalent to the main part.
Q: Which substitute part offers the best thermal performance?
A: The PJA3432_R1_00001 provides the highest power dissipation rating (1.25W) and lowest gate charge (1.5nC), offering superior thermal headroom and gate drive efficiency. This device is optimal for applications requiring maximum thermal margin or operating in elevated ambient temperature environments.
Q: Can substitute parts be mixed within a single assembly?
A: Mixing substitute parts within a single assembly is not recommended. Variations in gate charge, input capacitance, and on-resistance characteristics may result in unequal gate drive distribution and thermal stress in parallel configurations. Consistent part selection across all MOSFET positions in a design is required for reliable operation.
Q: What is the impact of higher gate charge on circuit design?
A: Higher gate charge (such as the 7nC in NTR4503NT1G versus 2.1nC in BSH103,235) requires increased gate drive current or extended switching time. This affects switching frequency capability, power dissipation in the gate driver circuit, and overall system efficiency. Gate drive circuit redesign may be necessary when substituting parts with significantly different gate charge specifications.
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