BR93G76FVT-3AGE2 Equivalent & Substitute Parts

Part Overview

The BR93G76FVT-3AGE2 is an 8Kbit EEPROM memory IC manufactured by Rohm Semiconductor, featuring Microwire serial interface protocol and operating at 3 MHz clock frequency. This non-volatile memory device is housed in an 8-TSSOP surface mount package and supports a wide supply voltage range of 1.7V to 5.5V with industrial temperature operation from -40°C to 85°C. The part is currently in active product status with 905 units available in stock. Substitute parts become necessary when the primary part reaches end-of-life status, inventory constraints occur, or alternative sourcing is required while maintaining identical electrical and mechanical specifications.

Substiute Parts

BR93G76FVT-3AGE2

Rohm SemiconductorIn Stock: 990BR93G76FVT-3AGE2 Datasheet

Current PartRFQ

BR93G76FVT-3BGE2

Rohm SemiconductorIn Stock: 825BR93G76FVT-3BGE2 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the BR93G76FVT-3AGE2 is determined by strict equivalence across the following critical parameters:

• Memory capacity: 8Kbit
• Memory organization: 512 x 16 configuration
• Serial interface protocol: Microwire
• Operating frequency: 3 MHz
• Supply voltage compatibility: 1.7V ~ 5.5V range
• Temperature rating: -40°C ~ 85°C
• Package specification: 8-TSSOP form factor
• Surface mount compatibility

The BR93G76FVT-3BGE2 meets all substitution criteria as a direct equivalent part. Both devices share identical electrical specifications, memory architecture, interface protocol, and physical packaging. The primary distinction is product lifecycle status, with BR93G76FVT-3AGE2 maintaining active status while BR93G76FVT-3BGE2 is classified as obsolete.

Parameter Comparison

Engineering Selection Recommendations

The BR93G76FVT-3BGE2 functions as a direct electrical and mechanical equivalent to the BR93G76FVT-3AGE2. Both parts maintain identical compliance certifications including ROHS3 compliance and REACH unaffected status. Selection between these parts should be based on product lifecycle considerations and inventory availability. The BR93G76FVT-3AGE2 is preferred for new designs and long-term production due to active product status. The BR93G76FVT-3BGE2 remains suitable for legacy system maintenance and repair applications where existing inventory exists, provided that procurement timelines accommodate potential supply constraints associated with obsolete product classification.

Frequently Asked Questions (FAQ)

Q: Can BR93G76FVT-3BGE2 be used as a direct replacement for BR93G76FVT-3AGE2 in existing designs?

A: Yes. Both parts are electrically and mechanically identical across all specified parameters including memory capacity, interface protocol, operating frequency, voltage range, temperature rating, and 8-TSSOP package configuration. Pin-for-pin compatibility is maintained.

Q: What is the significance of the product status difference between these parts?

A: BR93G76FVT-3AGE2 maintains active product status, indicating ongoing manufacturer support and availability. BR93G76FVT-3BGE2 is classified as obsolete, meaning the manufacturer has discontinued active production. For new designs, the active part is recommended. For maintenance applications, the obsolete part may be sourced from existing inventory channels.

Q: Are there compliance or certification differences between these substitute parts?

A: No. Both parts maintain identical RoHS3 compliance status and REACH unaffected classification. Moisture sensitivity level (MSL) rating of 1 (Unlimited) is equivalent for both parts.

Q: What packaging considerations apply to both parts?

A: Both parts utilize 8-TSSOP surface mount packaging with identical physical dimensions (0.173" width, 4.40mm). PCB layout, reflow profiles, and assembly processes remain unchanged between parts.

Q: Are there any electrical parameter variations between these parts?

A: No. Supply voltage range (1.7V ~ 5.5V), operating temperature range (-40°C ~ 85°C), clock frequency (3 MHz), write cycle time (5ms), and all memory specifications are identical.