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BQ2201PNG4 Equivalent & Substitute Parts
Part Overview
The BQ2201PNG4 is a nonvolatile SRAM controller manufactured by Texas Instruments, designed for memory management applications requiring integrated circuit control. This component is classified as obsolete, which necessitates identification of suitable substitute parts for ongoing design requirements and production continuity. The part is packaged in an 8-DIP through-hole configuration and operates within a 4.5V to 5.5V supply voltage range.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Base Product Number | BQ2201 |
| Controller Type | Nonvolatile SRAM |
| Voltage - Supply | 4.5V ~ 5.5V |
| Operating Temperature | 0°C ~ 70°C |
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300", 7.62mm) |
| RoHS Status | ROHS3 Compliant |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution of the BQ2201PNG4 is determined by the following critical parameters:
- Base product number (BQ2201) ensures functional equivalence at the controller level
- Supply voltage range (4.5V ~ 5.5V) must be maintained for circuit compatibility
- Controller type (Nonvolatile SRAM) defines the functional category
- RoHS3 compliance and REACH unaffected status ensure regulatory alignment
- Packaging format determines board integration method
The BQ2201SN-N qualifies as a manufacturer-recommended substitute based on identical base product number, matching voltage specifications, equivalent controller functionality, and consistent compliance certifications. The primary difference is the transition from through-hole (DIP) to surface-mount (SOIC) packaging, which requires PCB redesign considerations.
Parameter Comparison
| Parameter | BQ2201PNG4 (Main Part) | BQ2201SN-N (Substitute) |
|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments |
| Base Product Number | BQ2201 | BQ2201 |
| Controller Type | Nonvolatile SRAM | Nonvolatile SRAM |
| Voltage - Supply | 4.5V ~ 5.5V | 4.5V ~ 5.5V |
| Operating Temperature | 0°C ~ 70°C | -40°C ~ 85°C |
| Mounting Type | Through Hole | Surface Mount |
| Package / Case | 8-DIP (0.300", 7.62mm) | 8-SOIC (0.154", 3.90mm Width) |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Product Status | Obsolete | Active |
Engineering Selection Recommendations
The BQ2201SN-N is the manufacturer-recommended substitute for the obsolete BQ2201PNG4. Both parts maintain identical supply voltage specifications (4.5V ~ 5.5V) and equivalent nonvolatile SRAM controller functionality. The substitute part carries active product status, ensuring long-term availability and supply chain continuity.
Both parts are ROHS3 compliant and REACH unaffected, meeting current regulatory requirements. The BQ2201SN-N offers an extended operating temperature range (-40°C ~ 85°C) compared to the original part (0°C ~ 70°C), providing greater thermal flexibility for diverse application environments.
The primary design consideration is the packaging transition from through-hole DIP to surface-mount SOIC format. This change requires PCB layout modification but does not affect electrical functionality or pin configuration compatibility.
Frequently Asked Questions (FAQ)
Q: Can the BQ2201SN-N directly replace the BQ2201PNG4 without circuit modifications?
A: Electrical functionality is fully compatible. Pin configuration and voltage specifications are identical. However, the packaging format differs (DIP versus SOIC), requiring PCB redesign for physical integration.
Q: What is the primary reason for substitution?
A: The BQ2201PNG4 is classified as obsolete. The BQ2201SN-N is the active equivalent from the same manufacturer, ensuring continued availability and supply chain reliability.
Q: Are there compliance differences between the two parts?
A: Both parts are ROHS3 compliant and REACH unaffected. No compliance barriers exist for substitution.
Q: Does the operating temperature range difference affect compatibility?
A: The BQ2201SN-N supports a wider operating temperature range (-40°C ~ 85°C) compared to the original part (0°C ~ 70°C). This provides enhanced thermal capability and does not restrict compatibility in applications within the original temperature specification.
Q: What packaging considerations apply to this substitution?
A: The original part uses 8-DIP through-hole packaging (0.300", 7.62mm). The substitute uses 8-SOIC surface-mount packaging (0.154", 3.90mm Width). PCB footprint and assembly process modifications are required.
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