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BQ2000TPN-B5 Equivalent & Substitute Parts
Part Overview
The BQ2000TPN-B5 is a multi-chemistry battery charger IC manufactured by Texas Instruments, designed for charging 1 to 4 cell battery packs with programmable current, timer, and voltage control. The device is classified as Last Time Buy, indicating end-of-life status. Finding equivalent and substitute parts is necessary to ensure continued design support, maintain supply chain reliability, and access active product alternatives with enhanced capabilities.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | BQ2000TPN-B5 |
| Manufacturer | Texas Instruments |
| Category | Power Management (PMIC) |
| Battery Chemistry | Multi-Chemistry |
| Number of Cells | 1 ~ 4 |
| Current - Charging | Constant - Programmable |
| Programmable Features | Current, Timer, Voltage |
| Voltage - Supply (Max) | 6V |
| Operating Temperature | -20°C ~ 70°C (TA) |
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300", 7.62mm) |
| Product Status | Last Time Buy |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitution for the BQ2000TPN-B5 is determined by the following critical parameters:
Parametric Equivalent (Direct Replacement):
- Battery chemistry compatibility: Multi-Chemistry
- Cell count range: 1 ~ 4 cells
- Programmable charging control: Current, Timer, Voltage
- Supply voltage: 6V maximum
- Mounting type: Through Hole
- Package type: 8-DIP
Manufacturer Recommended Substitute (Enhanced Capability):
- Battery chemistry compatibility: Nickel Metal Hydride (subset of multi-chemistry support)
- Cell count range: 1 ~ 6 cells (extended range)
- Programmable charging control: Current, Timer, Voltage
- Supply voltage: 18V maximum (higher capability)
- Mounting type: Surface Mount (different implementation)
- Package type: 8-WFDFN Exposed Pad (different form factor)
The BQ2000PN-B5 serves as a parametric equivalent with identical electrical specifications and through-hole mounting. The BQ25172DSGR represents a manufacturer-recommended upgrade path with extended cell support, higher supply voltage capability, and active product status, though it requires surface mount assembly and different board layout considerations.
Parameter Comparison
| Parameter | BQ2000TPN-B5 | BQ2000PN-B5 | BQ25172DSGR |
|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Texas Instruments |
| Category | Power Management (PMIC) | Power Management (PMIC) | Power Management (PMIC) |
| Battery Chemistry | Multi-Chemistry | Multi-Chemistry | Nickel Metal Hydride |
| Number of Cells | 1 ~ 4 | 1 ~ 4 | 1 ~ 6 |
| Current - Charging | Constant - Programmable | Constant - Programmable | Constant - Programmable |
| Programmable Features | Current, Timer, Voltage | Current, Timer, Voltage | Current, Timer, Voltage |
| Voltage - Supply (Max) | 6V | 6V | 18V |
| Operating Temperature | -20°C ~ 70°C (TA) | -20°C ~ 70°C (TA) | -40°C ~ 125°C (TJ) |
| Mounting Type | Through Hole | Through Hole | Surface Mount |
| Package / Case | 8-DIP (0.300", 7.62mm) | 8-DIP (0.300", 7.62mm) | 8-WFDFN Exposed Pad |
| Product Status | Last Time Buy | Active | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Not applicable |
| Inventory Availability | 1933 Pcs | 2679 Pcs | 39708 Pcs |
Engineering Selection Recommendations
For Direct Replacement (Pin-Compatible, No Layout Changes): Select BQ2000PN-B5 when the original BQ2000TPN-B5 reaches end-of-stock. This part maintains identical electrical specifications, through-hole mounting, and 8-DIP package configuration. Both parts are ROHS3 compliant and support the same battery chemistry and cell count range. The BQ2000PN-B5 carries Active product status with higher inventory availability (2679 Pcs vs. 1933 Pcs).
For Design Upgrade Path (Requires Layout Redesign): Select BQ25172DSGR when transitioning to new designs or when extended capabilities are required. This part is manufacturer-recommended, carries Active product status, and offers significantly higher inventory (39708 Pcs). Extended supply voltage (18V vs. 6V) and cell count support (1~6 vs. 1~4) provide design flexibility. Surface mount implementation requires PCB layout changes and assembly process updates. Operating temperature range extends to -40°C ~ 125°C, supporting broader environmental applications.
Compliance Considerations: BQ2000TPN-B5 and BQ2000PN-B5 are ROHS3 compliant. BQ25172DSGR RoHS status is listed as Not applicable; verify compliance requirements for your application before selection.
Frequently Asked Questions (FAQ)
Q: Can BQ2000PN-B5 replace BQ2000TPN-B5 without PCB modifications? A: Yes. Both parts share identical electrical specifications, through-hole 8-DIP package, and mounting type. No PCB layout changes are required for direct substitution.
Q: What are the key differences between BQ2000TPN-B5 and BQ25172DSGR? A: The primary differences are: (1) Mounting type—BQ2000TPN-B5 is through-hole; BQ25172DSGR is surface mount; (2) Supply voltage—6V vs. 18V maximum; (3) Cell count—1~4 vs. 1~6; (4) Package form factor—8-DIP vs. 8-WFDFN; (5) Product status—Last Time Buy vs. Active. BQ25172DSGR requires PCB redesign but offers extended capabilities and active supply.
Q: Is BQ25172DSGR suitable for applications originally designed for BQ2000TPN-B5? A: Electrical compatibility exists for multi-chemistry charging with programmable current, timer, and voltage control. However, surface mount assembly and different package footprint require PCB layout redesign. Verify that your application's supply voltage and cell count requirements fall within BQ25172DSGR specifications (18V max supply, 1~6 cells).
Q: What is the inventory status for each part? A: BQ2000TPN-B5 (Last Time Buy): 1933 Pcs. BQ2000PN-B5 (Active): 2679 Pcs. BQ25172DSGR (Active): 39708 Pcs. For long-term supply assurance, BQ25172DSGR offers the highest availability.
Q: Are there package compatibility concerns when switching from BQ2000TPN-B5 to BQ25172DSGR? A: Yes. BQ2000TPN-B5 uses 8-DIP (0.300", 7.62mm) through-hole package. BQ25172DSGR uses 8-WFDFN Exposed Pad surface mount package. These are not pin-compatible and require complete PCB footprint redesign, different assembly processes, and updated thermal management considerations.
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