BMC156 Equivalent & Substitute Parts

Part Overview

The BMC156 is a 6-axis inertial measurement unit combining accelerometer and magnetometer functionality with I2C and SPI output interfaces. Manufactured by Bosch Sensortec, this device is packaged in a 12-VFLGA module suitable for surface mount applications. The product is classified as obsolete, making identification of equivalent substitute parts necessary for ongoing design support, legacy system maintenance, and new component procurement where BMC156 sourcing becomes unavailable.

Substiute Parts

BMC156

Bosch SensortecIn Stock: 35213BMC156 Datasheet

Current PartRFQ

LSM303AHTR

STMicroelectronicsIn Stock: 6380LSM303AHTR Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the BMC156 are identified based on compatibility across the following critical parameters:

• Sensor Type and Functionality: Accelerometer and magnetometer with 6-axis capability
• Output Interface: I2C and SPI communication protocols
• Operating Temperature Range: -40°C ~ 85°C (TA)
• Package Type: 12-VFLGA Module, 12-LGA footprint
• Mounting Configuration: Surface mount technology

The LSM303AHTR from STMicroelectronics qualifies as a direct substitute based on matching sensor functionality, output interface types, operating temperature specification, and package footprint compatibility.

Parameter Comparison

Engineering Selection Recommendations

Active Product Status: The LSM303AHTR is an active product with ongoing manufacturer support and availability, providing continued access to technical documentation and supply chain reliability compared to the obsolete BMC156.

Compliance and Certifications: Both parts carry EAR99 ECCN classification. The LSM303AHTR provides additional compliance certifications including RoHS3 compliance and REACH unaffected status, supporting regulatory requirements for new designs.

Moisture Sensitivity Consideration: The BMC156 specifies MSL 1 (unlimited moisture sensitivity protection), while the LSM303AHTR specifies MSL 3 (168 hours). This difference affects handling and storage protocols but does not impact electrical or mechanical compatibility.

Package Footprint: Minor dimensional variation exists between the 12-LGA packages (BMC156: 2.2x2.2 versus LSM303AHTR: 2x2). Board-level routing and component placement require verification to ensure PCB layout compatibility.

Frequently Asked Questions (FAQ)

Q: Can the LSM303AHTR replace the BMC156 in existing designs? A: Yes, electrical interface and functional parameters are compatible. PCB layout verification is required due to minor package dimension differences between the 12-LGA variants.

Q: What is the primary reason for substitution? A: The BMC156 is classified as obsolete, making the LSM303AHTR necessary for new procurement and design support where BMC156 inventory is depleted.

Q: Are the I2C and SPI interfaces functionally equivalent? A: Both parts provide I2C and SPI output types with identical operating temperature ranges, supporting direct protocol-level compatibility.

Q: Does the additional temperature sensor in the LSM303AHTR affect compatibility? A: The integrated temperature sensor provides additional functionality without impacting compatibility with existing firmware. Integration is optional based on application requirements.

Q: What is the impact of different MSL ratings? A: MSL 1 versus MSL 3 affects handling, storage, and bake-out procedures but does not impact electrical performance or interchangeability once deployed.

Q: Are there any supply chain considerations? A: The LSM303AHTR has reported inventory of 6363 pieces, supporting production volumes. Verify supplier availability before transitioning from BMC156 procurement.