BLE113-A-V1C Equivalent & Substitute Parts

Part Overview

The BLE113-A-V1C is a Bluetooth Low Energy transceiver module manufactured by Silicon Labs, designed for surface mount integration in RF applications. This module integrates the CC2541 IC and operates in the 2.4GHz ISM band. The product is currently classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support, design updates, and production continuity.

Substiute Parts

BLE113-A-V1C

Silicon LabsIn Stock: 865BLE113-A-V1C Datasheet

Current PartRFQ

BGM220PC22WGA2

Silicon LabsIn Stock: 1000BGM220PC22WGA2 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The BGM220PC22WGA2 qualifies as a manufacturer-recommended substitute based on the following alignment criteria:

Functional Equivalence: Both parts are RF transceiver modules manufactured by Silicon Labs with surface mount integration, designed for Bluetooth wireless communication applications.

Regulatory & Compliance Alignment: Both parts share identical ECCN (5A992C) and HTSUS (8517.62.0090) classifications, confirming equivalent regulatory treatment. The substitute maintains RoHS3 compliance, exceeding the original RoHS requirement.

Physical Integration: Both employ surface mount technology and module-level packaging, enabling direct integration into existing PCB designs with compatible footprints.

Environmental Specifications: Both parts specify MSL 3 (168 Hours), ensuring equivalent moisture handling and storage requirements.

Manufacturer Continuity: Silicon Labs manufactures both the original and substitute, ensuring consistent design philosophy, documentation standards, and technical support.

Parameter Comparison

Engineering Selection Recommendations

For Obsolescence Mitigation: The BLE113-A-V1C is classified as obsolete. The BGM220PC22WGA2 is an active product from the same manufacturer, providing assured long-term availability and continued technical support.

For Regulatory Compliance: Both parts maintain equivalent ECCN and HTSUS classifications. The substitute achieves ROHS3 compliance, meeting current and anticipated regulatory requirements.

For Environmental Specifications: Identical MSL ratings ensure equivalent moisture handling protocols and storage conditions are maintained across the substitution.

For Supply Chain Continuity: Current inventory of BGM220PC22WGA2 (922 Pcs) provides immediate availability compared to the obsolete status of the original part.

Frequently Asked Questions (FAQ)

Q: Can the BGM220PC22WGA2 directly replace the BLE113-A-V1C in existing designs?

A: Both parts are surface mount modules manufactured by Silicon Labs with identical regulatory classifications (ECCN, HTSUS) and environmental specifications (MSL). Physical footprint compatibility and electrical interface alignment must be verified against specific PCB design documentation and the detailed datasheets of both modules.

Q: What are the key differences between these two modules?

A: The primary differences are the integrated IC (CC2541 versus EFR32BG22), product status (obsolete versus active), and the availability of detailed electrical specifications for the substitute. The BGM220PC22WGA2 provides documented supply voltage range (1.8V ~ 3.8V), operating temperature range (-40°C ~ 85°C), and expanded serial interface options.

Q: Are there any compliance concerns with substituting the BGM220PC22WGA2?

A: No compliance concerns exist. Both parts share identical ECCN and HTSUS codes. The substitute achieves ROHS3 compliance, which exceeds the original RoHS requirement and aligns with current regulatory standards.

Q: What should be verified before implementing this substitution?

A: Verify PCB footprint compatibility, electrical interface requirements (voltage levels, signal timing), and firmware compatibility with the EFR32BG22 IC. Consult the detailed datasheets and application notes provided by Silicon Labs for both modules.

Q: Is the BGM220PC22WGA2 available in the same packaging format?

A: Both parts employ surface mount module packaging. The substitute is specified as a 31-SMD Module. Physical dimensions and pin configurations must be confirmed against design requirements and manufacturer documentation.