BLE113-A-SWCC Equivalent & Substitute Parts

Part Overview

The BLE113-A-SWCC is a Bluetooth v4.0 transceiver module manufactured by Silicon Labs, designed for RF transmission and reception in surface mount applications. This module integrates a CC2541 IC with 128kB Flash and 8kB SRAM memory, operating across a supply voltage range of 2V to 3.6V. The product is classified as Obsolete, necessitating identification of active alternative components that maintain functional compatibility for new designs or production transitions.

Substiute Parts

BLE113-A-SWCC

Silicon LabsIn Stock: 970BLE113-A-SWCC Datasheet

Current PartRFQ

BGM220PC22WGA2

Silicon LabsIn Stock: 1000BGM220PC22WGA2 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the BLE113-A-SWCC is determined by the following critical parameters:

RF Compatibility: Both the main part and substitute must operate within the Bluetooth standard family. The BLE113-A-SWCC operates under Bluetooth v4.0 protocol. Substitute parts must support Bluetooth protocol standards with backward compatibility or equivalent functionality.

Electrical Characteristics: Supply voltage range, data rate, power output, and sensitivity define the electrical operating envelope. Substitute parts must accommodate the same or broader voltage supply range and maintain equivalent or superior sensitivity and power output specifications.

Physical Form Factor: Surface mount packaging and module dimensions determine PCB integration feasibility. The BLE113-A-SWCC uses a 36-SMD Module package. Substitute parts must use surface mount technology with compatible pinout and footprint considerations.

Compliance and Certification: RoHS3 compliance and MSL rating ensure environmental and manufacturing process compatibility. Substitute parts must maintain equivalent or superior compliance status.

Memory and Processing: Flash and SRAM capacity support firmware and runtime requirements. Substitute parts must provide sufficient memory resources for application code execution.

The BGM220PC22WGA2 qualifies as a substitute based on these parameters: it maintains Bluetooth protocol family compatibility (Bluetooth v5.2), operates within compatible voltage ranges (1.8V ~ 3.8V encompasses the original 2V ~ 3.6V), uses surface mount technology (31-SMD Module), maintains RoHS3 compliance, and provides enhanced memory capacity (352kB Flash, 32kB RAM).

Parameter Comparison

Engineering Selection Recommendations

Product Status Consideration: The BLE113-A-SWCC is classified as Obsolete, indicating discontinued manufacturing and limited availability for new production. The BGM220PC22WGA2 maintains Active product status, ensuring ongoing availability, manufacturing support, and compliance updates from Silicon Labs.

Compliance and Certification: Both components maintain ROHS3 compliance and identical MSL ratings (3, 168 Hours), ensuring equivalent environmental and manufacturing process compatibility. The BGM220PC22WGA2 includes REACH Unaffected status, providing additional regulatory clarity for European market applications.

Electrical Performance: The BGM220PC22WGA2 demonstrates superior electrical characteristics across multiple parameters. Sensitivity improves from -93dBm to -98.9dBm, power output increases from 0dBm to 8dBm, and current consumption decreases significantly (receiving current reduced from 21.9-27mA to 4.3-4.8mA; transmitting current reduced from 18.2-26.1mA to 4.8-10.8mA). These improvements support extended battery life and enhanced link reliability in power-constrained applications.

Protocol Evolution: Bluetooth v5.2 in the BGM220PC22WGA2 provides backward compatibility with Bluetooth v4.0 applications while enabling access to enhanced features and improved interoperability with modern Bluetooth devices.

Memory and Processing: The BGM220PC22WGA2 provides substantially increased memory resources (352kB Flash versus 128kB; 32kB RAM versus 8kB), supporting more complex firmware implementations and larger application code bases.

Package Transition: The BGM220PC22WGA2 uses a 31-SMD Module package compared to the 36-SMD Module of the BLE113-A-SWCC. PCB layout modifications are required to accommodate the different footprint and pin configuration.

Frequently Asked Questions (FAQ)

Q: Can the BGM220PC22WGA2 directly replace the BLE113-A-SWCC without design modifications?

A: Direct pin-for-pin replacement is not possible due to different package types (36-SMD versus 31-SMD Module). PCB layout redesign is required to accommodate the BGM220PC22WGA2 footprint and pinout. However, the Bluetooth protocol compatibility and electrical operating ranges support functional substitution with appropriate hardware redesign.

Q: What are the primary advantages of substituting to the BGM220PC22WGA2?

A: The BGM220PC22WGA2 offers three primary advantages: (1) Active product status with ongoing manufacturing support versus Obsolete status; (2) significantly reduced current consumption (approximately 80% reduction in receive current, 60% reduction in transmit current) enabling extended battery life; (3) enhanced memory capacity supporting more sophisticated firmware implementations.

Q: Is the BGM220PC22WGA2 backward compatible with Bluetooth v4.0 applications?

A: Bluetooth v5.2 maintains backward compatibility with Bluetooth v4.0 protocol specifications. Applications designed for Bluetooth v4.0 operate on the BGM220PC22WGA2 without firmware modification, though firmware updates may be required to access v5.2-specific features.

Q: What supply voltage considerations apply when substituting these components?

A: The BLE113-A-SWCC operates at 2V to 3.6V, while the BGM220PC22WGA2 operates at 1.8V to 3.8V. The BGM220PC22WGA2 supports lower minimum voltage (1.8V versus 2V) and higher maximum voltage (3.8V versus 3.6V). Existing power supply designs within the 2V to 3.6V range operate within the BGM220PC22WGA2 specification without modification.

Q: Are there serial interface differences between these components?

A: The BLE113-A-SWCC supports ISP, PWM, SPI, and UART interfaces. The BGM220PC22WGA2 supports ADC, I2C, I2S, PWM, SPI, IrDA, UART, and USART interfaces. The BGM220PC22WGA2 provides additional interface options while maintaining compatibility with the core SPI and UART interfaces used in most BLE113-A-SWCC applications.

Q: What packaging and moisture sensitivity considerations apply?

A: Both components maintain MSL rating 3 (168 Hours), indicating identical moisture sensitivity and storage requirements. The different package types (36-SMD versus 31-SMD Module) do not affect moisture sensitivity classification. Standard SMD handling and storage procedures apply to both components.

Q: Is firmware porting required when transitioning from BLE113-A-SWCC to BGM220PC22WGA2?

A: Firmware compatibility depends on application-specific code. The BGM220PC22WGA2 uses a different IC (EFR32BG22 versus CC2541) and development environment. Firmware review and potential porting are required, though the enhanced memory capacity of the BGM220PC22WGA2 typically accommodates existing application code without modification.