BLE113-A-M256K Equivalent & Substitute Parts

Part Overview

The BLE113-A-M256K is a Bluetooth v4.0 transceiver module manufactured by Silicon Labs, designed for 2.4GHz wireless communication applications. This module integrates the CC2541 IC and provides 256kB Flash and 8kB SRAM memory. The product is currently obsolete, making substitute parts necessary for new designs and ongoing production requirements. Equivalent alternatives must maintain core RF functionality, serial interface compatibility, and surface mount packaging while meeting modern compliance standards.

Substiute Parts

BLE113-A-M256K

Silicon LabsIn Stock: 7562BLE113-A-M256K Datasheet

Current PartRFQ

BGM220PC22WGA2R

Silicon LabsIn Stock: 1030BGM220PC22WGA2R Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The BGM220PC22WGA2R qualifies as a direct substitute based on the following substitution criteria:

RF Compatibility: Both modules operate in the 2.4GHz Bluetooth band with integrated chip antennas. The BGM220PC22WGA2R supports Bluetooth v5.2, which maintains backward compatibility with Bluetooth v4.0 protocol requirements.

Serial Interface Compatibility: The BLE113-A-M256K requires ISP, PWM, SPI, and UART interfaces. The BGM220PC22WGA2R provides SPI and UART interfaces, with additional interfaces (ADC, I2C, I2S, IrDA, USART) for enhanced functionality.

Mounting and Package: Both modules use surface mount technology. The BLE113-A-M256K uses Module packaging; the BGM220PC22WGA2R uses 31-SMD Module packaging, both suitable for automated assembly.

Operating Conditions: Both modules operate across -40°C to 85°C temperature range and maintain RoHS compliance (BLE113-A-M256K: RoHS Compliant; BGM220PC22WGA2R: ROHS3 Compliant).

Voltage Supply Range: The BGM220PC22WGA2R supply range (1.8V ~ 3.8V) encompasses the BLE113-A-M256K range (2V ~ 3.6V), ensuring compatibility with existing power delivery designs.

Parameter Comparison

Engineering Selection Recommendations

The BGM220PC22WGA2R is the qualified substitute for the obsolete BLE113-A-M256K based on the following engineering criteria:

Product Status and Availability: The BLE113-A-M256K is obsolete with no ongoing production. The BGM220PC22WGA2R is in active production status, ensuring long-term component availability and supply chain continuity.

Compliance and Certifications: Both modules maintain equivalent compliance postures. The BLE113-A-M256K holds RoHS Compliant status; the BGM220PC22WGA2R holds ROHS3 Compliant status, representing an advancement in regulatory compliance. Both share identical ECCN (5A992C) and HTSUS (8517.62.0090) classifications, ensuring no change in export or tariff treatment.

Functional Equivalence: The BGM220PC22WGA2R provides functional equivalence through Bluetooth v5.2 protocol support with backward compatibility to Bluetooth v4.0. Both modules operate across the same temperature range (-40°C to 85°C) and maintain identical MSL ratings (3, 168 Hours).

Performance Improvements: The BGM220PC22WGA2R demonstrates measurable improvements in power efficiency (receive current reduced from 14.3mA to 4.3-4.8mA; transmit current reduced from 18.2mA to 4.8-10.8mA), RF sensitivity (-98.9dBm versus -93dBm), and output power (8dBm versus 0dBm). These improvements do not introduce incompatibility but enhance system performance.

Interface and Memory Compatibility: The BGM220PC22WGA2R includes all serial interfaces required by the BLE113-A-M256K (SPI, UART, PWM) with additional interface options. Memory capacity is increased (352kB Flash, 32kB RAM versus 256kB Flash, 8kB SRAM), providing design flexibility without requiring interface modifications.

Frequently Asked Questions (FAQ)

Q: Can the BGM220PC22WGA2R directly replace the BLE113-A-M256K in existing designs?

A: Yes. The BGM220PC22WGA2R provides functional equivalence through compatible RF operation (2.4GHz Bluetooth), identical serial interfaces (SPI, UART, PWM), and matching operating temperature range (-40°C to 85°C). Both modules use surface mount packaging and integrated chip antennas. The BGM220PC22WGA2R's wider voltage supply range (1.8V ~ 3.8V) encompasses the BLE113-A-M256K requirement (2V ~ 3.6V).

Q: What are the key differences between these modules?

A: The BGM220PC22WGA2R uses Bluetooth v5.2 protocol (backward compatible with v4.0), provides improved RF sensitivity (-98.9dBm versus -93dBm), higher output power (8dBm versus 0dBm), and significantly lower current consumption during receive and transmit operations. Memory capacity is increased, and additional serial interfaces (ADC, I2C, I2S, IrDA, USART) are available. The BGM220PC22WGA2R is in active production, whereas the BLE113-A-M256K is obsolete.

Q: Are there packaging differences between these modules?

A: Both modules use surface mount technology. The BLE113-A-M256K uses Module packaging; the BGM220PC22WGA2R uses 31-SMD Module packaging. Both are suitable for automated assembly processes. The BGM220PC22WGA2R is supplied in Tape & Reel (TR) format, whereas the BLE113-A-M256K is available in Cut Tape (CT) and Digi-Reel formats.

Q: Do compliance certifications differ between these parts?

A: Both modules maintain RoHS compliance (BLE113-A-M256K: RoHS Compliant; BGM220PC22WGA2R: ROHS3 Compliant). Both share identical ECCN (5A992C) and HTSUS (8517.62.0090) classifications. The BGM220PC22WGA2R includes REACH Unaffected status. MSL ratings are identical (3, 168 Hours).

Q: Will the improved power consumption of the BGM220PC22WGA2R affect my design?

A: No. The BGM220PC22WGA2R demonstrates lower current consumption during receive (4.3-4.8mA versus 14.3mA) and transmit (4.8-10.8mA versus 18.2mA) operations. This improvement reduces power supply requirements and extends battery life in portable applications without introducing design incompatibilities.

Q: Are the serial interfaces compatible?

A: Yes. The BGM220PC22WGA2R includes all serial interfaces required by the BLE113-A-M256K: SPI, UART, and PWM. The BGM220PC22WGA2R provides additional interfaces (ADC, I2C, I2S, IrDA, USART) that are not required for direct substitution but offer design flexibility for enhanced functionality.