BLE112-N-V1 Equivalent & Substitute Parts

Part Overview

The BLE112-N-V1 is a Bluetooth v4.0 transceiver module manufactured by Silicon Labs, designed for surface mount applications with integrated RF transmission and reception capabilities. This module operates across a supply voltage range of 2V to 3.6V and delivers a maximum output power of 3dBm with a receiver sensitivity of -91dBm. The BLE112-N-V1 is classified as an obsolete product, necessitating identification of functionally equivalent alternatives for new designs and ongoing production requirements. The module utilizes the CC2540 integrated circuit and provides serial communication through SPI, UART, and USB interfaces.

Substiute Parts

BLE112-N-V1
Silicon LabsIn Stock: 1042BLE112-N-V1 Datasheet
BLE112-N-V1
Current Part
BGM220PC22WGA2R
Silicon LabsIn Stock: 1030BGM220PC22WGA2R Datasheet
BGM220PC22WGA2R
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number BLE112-N-V1
Manufacturer Silicon Labs
RF Family/Standard Bluetooth
Protocol Bluetooth v4.0
Data Rate 2Mbps
Power Output 3dBm
Receiver Sensitivity -91dBm
Serial Interfaces SPI, UART, USB
Antenna Type Antenna Not Included
Memory (Flash/RAM) 256kB Flash, 8kB SRAM
Voltage Supply Range 2V ~ 3.6V
Current Receiving 25mA
Current Transmitting 28mA ~ 36mA
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C
Package/Case 32-SMD Module
Product Status Obsolete
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the BLE112-N-V1 is determined by the following critical parameters:

RF Communication Standard: Both the main part and substitute must operate within the Bluetooth protocol family to maintain system-level compatibility.

Data Rate Compatibility: The substitute must support a minimum data rate of 2Mbps to ensure functional equivalence in serial communication throughput.

Serial Interface Support: The substitute must provide at least SPI and UART interfaces to maintain compatibility with existing host controller designs.

Voltage Supply Range: The substitute supply voltage range must encompass or overlap with the original 2V to 3.6V specification to ensure operation within the same power delivery architecture.

Mounting Type: Surface mount packaging is required to maintain PCB assembly compatibility.

Operating Temperature Range: The substitute must support the full -40°C to 85°C operating temperature range.

Regulatory Compliance: RoHS3 compliance and equivalent ECCN/HTSUS classifications ensure regulatory and export control alignment.

The BGM220PC22WGA2R meets these substitution criteria through its Bluetooth v5.2 protocol support, enhanced data rate capability, expanded serial interface set, compatible voltage supply range, surface mount packaging, and maintained operating temperature specification.

Parameter Comparison

Parameter BLE112-N-V1 BGM220PC22WGA2R
Manufacturer Silicon Labs Silicon Labs
RF Family/Standard Bluetooth Bluetooth
Protocol Bluetooth v4.0 Bluetooth v5.2
Data Rate 2Mbps 2Mbps
Power Output 3dBm 8dBm
Receiver Sensitivity -91dBm -98.9dBm
Serial Interfaces SPI, UART, USB ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART
Antenna Type Antenna Not Included Integrated, Chip
Memory Flash 256kB 352kB
Memory RAM 8kB SRAM 32kB RAM
Voltage Supply Range 2V ~ 3.6V 1.8V ~ 3.8V
Current Receiving 25mA 4.3mA ~ 4.8mA
Current Transmitting 28mA ~ 36mA 4.8mA ~ 10.8mA
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C (TA)
Package/Case 32-SMD Module 31-SMD Module
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours)
ECCN 5A992C 5A992C
HTSUS 8517.62.0090 8517.62.0090

Engineering Selection Recommendations

The BGM220PC22WGA2R is the designated substitute for the obsolete BLE112-N-V1 based on the following engineering criteria:

Product Status Alignment: The BGM220PC22WGA2R maintains active product status with ongoing manufacturer support, ensuring long-term availability and supply chain continuity compared to the obsolete BLE112-N-V1.

Regulatory Compliance: Both modules maintain ROHS3 compliance and identical ECCN and HTSUS classifications, ensuring regulatory equivalence for export control and environmental compliance requirements.

Protocol Advancement: The BGM220PC22WGA2R implements Bluetooth v5.2, which maintains backward compatibility with Bluetooth v4.0 protocol specifications while providing enhanced performance characteristics.

Power Efficiency: The BGM220PC22WGA2R demonstrates significantly reduced current consumption in both receiving (4.3mA ~ 4.8mA versus 25mA) and transmitting (4.8mA ~ 10.8mA versus 28mA ~ 36mA) modes, resulting in improved power delivery efficiency.

Enhanced Receiver Sensitivity: The BGM220PC22WGA2R achieves -98.9dBm sensitivity compared to -91dBm, enabling improved link budget and range performance.

Integrated Antenna: The BGM220PC22WGA2R incorporates an integrated chip antenna, eliminating the requirement for external antenna components specified in the BLE112-N-V1.

Expanded Serial Interface Support: The BGM220PC22WGA2R provides additional serial communication interfaces including I2C, I2S, PWM, and USART, enabling broader system integration flexibility.

Memory Expansion: The BGM220PC22WGA2R provides 352kB Flash and 32kB RAM compared to 256kB Flash and 8kB SRAM, supporting more complex firmware implementations.

Voltage Supply Compatibility: The BGM220PC22WGA2R voltage range of 1.8V to 3.8V encompasses the original 2V to 3.6V specification, ensuring compatibility with existing power delivery designs.

Frequently Asked Questions (FAQ)

Q: Can the BGM220PC22WGA2R directly replace the BLE112-N-V1 in existing designs?

A: The BGM220PC22WGA2R is functionally equivalent for Bluetooth RF transceiver applications. However, physical package differences exist: the BLE112-N-V1 uses a 32-SMD Module package while the BGM220PC22WGA2R uses a 31-SMD Module package. PCB layout modifications may be required to accommodate the different pin configuration and module dimensions.

Q: What are the key advantages of substituting to the BGM220PC22WGA2R?

A: The BGM220PC22WGA2R provides improved power efficiency with significantly lower current consumption, enhanced receiver sensitivity of -98.9dBm versus -91dBm, integrated antenna capability, expanded serial interface options, and active product status with ongoing manufacturer support.

Q: Is the BGM220PC22WGA2R backward compatible with Bluetooth v4.0 applications?

A: Yes. The BGM220PC22WGA2R implements Bluetooth v5.2, which maintains full backward compatibility with Bluetooth v4.0 protocol specifications. Existing firmware and host controller designs require validation but do not require fundamental protocol changes.

Q: What is the impact of the integrated antenna on the BGM220PC22WGA2R compared to the external antenna requirement of the BLE112-N-V1?

A: The integrated chip antenna on the BGM220PC22WGA2R eliminates the need for external antenna components, reducing PCB complexity and component count. This integration may affect RF performance characteristics and PCB layout requirements compared to designs using external antennas.

Q: Are there any supply voltage considerations when substituting the BGM220PC22WGA2R?

A: The BGM220PC22WGA2R operates across 1.8V to 3.8V, which encompasses the original BLE112-N-V1 range of 2V to 3.6V. Existing power delivery designs operating within the original range remain compatible without modification.

Q: What serial interface changes should be considered during substitution?

A: The BGM220PC22WGA2R provides SPI and UART interfaces required by the BLE112-N-V1, plus additional interfaces including I2C, I2S, PWM, IrDA, and USART. Existing SPI and UART implementations remain compatible. Additional interfaces are optional and do not require implementation.

Q: How do the memory specifications compare between the two modules?

A: The BGM220PC22WGA2R provides 352kB Flash and 32kB RAM compared to the BLE112-N-V1 specifications of 256kB Flash and 8kB SRAM. The increased memory capacity supports more complex firmware implementations and does not create compatibility constraints for existing applications.

Q: What is the significance of the different package designations (32-SMD versus 31-SMD)?

A: The package designation change indicates different physical module dimensions and pin configurations. PCB layout redesign is required to accommodate the BGM220PC22WGA2R, including footprint modification and potential trace routing adjustments.

Q: Are there any regulatory or compliance differences between the two modules?

A: Both modules maintain ROHS3 compliance and identical ECCN (5A992C) and HTSUS (8517.62.0090) classifications. No regulatory or export control differences exist between the two parts.

Q: What is the operating temperature range compatibility?

A: Both modules support the full -40°C to 85°C operating temperature range. No temperature-related constraints exist for substitution.

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