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BH28MA3WHFV-TR Equivalent & Substitute Parts
Part Overview
The BH28MA3WHFV-TR is a linear voltage regulator IC manufactured by ROHM Semiconductor, designed for positive fixed output regulation at 2.8V with 300mA output current capacity. This Active product operates across the -40°C to 85°C temperature range and is packaged in 6-HVSOF surface mount configuration. Substitute parts are identified when design requirements necessitate alternative packaging formats, different output current ratings, or when primary inventory availability is constrained.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | BH28MA3WHFV-TR |
| Manufacturer | ROHM Semiconductor |
| Category | Power Management (PMIC) |
| Output Voltage (Fixed) | 2.8V |
| Output Current | 300mA |
| Input Voltage (Max) | 5.5V |
| Dropout Voltage (Max) | 0.09V @ 100mA |
| Quiescent Current | 95 µA |
| PSRR | 60dB (1kHz) |
| Package / Case | 6-SMD, Flat Lead Exposed Pad (6-HVSOF) |
| Operating Temperature | -40°C ~ 85°C |
| Product Status | Active |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitute parts for the BH28MA3WHFV-TR are classified based on the following substitution criteria:
Parametric Equivalent (Direct Substitution): BH28M0AWHFV-TR maintains identical electrical specifications including 2.8V fixed output, 300mA output current, 5.5V maximum input voltage, 0.09V dropout voltage, and 6-HVSOF packaging. This part is functionally interchangeable with the main part number.
Similar Substitute (Functional Alternative): BU28TD2WNVX-TL provides 2.8V fixed output regulation with reduced output current capacity (200mA versus 300mA) and operates with 6V maximum input voltage. The package format differs (4-UDFN Exposed Pad versus 6-HVSOF), requiring PCB layout modification. This substitute is applicable when output current requirements do not exceed 200mA and board space constraints favor smaller packaging.
Substitution eligibility is determined by matching output voltage (2.8V fixed), output configuration (positive), control features (enable function), and protection features (over current and over temperature). Differences in output current, dropout voltage, quiescent current, and package format must be evaluated against specific application requirements.
Parameter Comparison
| Parameter | BH28MA3WHFV-TR (Main) | BH28M0AWHFV-TR (Parametric Equivalent) | BU28TD2WNVX-TL (Similar Substitute) |
|---|---|---|---|
| Manufacturer | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor |
| Output Voltage (Fixed) | 2.8V | 2.8V | 2.8V |
| Output Current | 300mA | 300mA | 200mA |
| Input Voltage (Max) | 5.5V | 5.5V | 6V |
| Dropout Voltage (Max) | 0.09V @ 100mA | 0.09V @ 100mA | 0.5V @ 200mA |
| Quiescent Current | 95 µA | 95 µA | 60 µA |
| PSRR | 60dB (1kHz) | 60dB (1kHz) | 70dB (1kHz) |
| Package / Case | 6-SMD, Flat Lead Exposed Pad (6-HVSOF) | 6-SMD, Flat Lead Exposed Pad (6-HVSOF) | 4-UDFN Exposed Pad (SSON004X1010) |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C |
| Product Status | Active | Active | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
BH28M0AWHFV-TR is the primary parametric equivalent for direct substitution. All electrical and mechanical specifications align with the BH28MA3WHFV-TR, including identical package format (6-HVSOF), output current rating (300mA), and dropout voltage characteristics. Both parts maintain Active product status and ROHS3 compliance. Selection of this substitute requires no circuit redesign or PCB layout modification.
BU28TD2WNVX-TL is applicable as a functional alternative when application requirements permit reduced output current (200mA maximum) and when smaller package footprint (4-UDFN) is advantageous. The higher maximum input voltage (6V versus 5.5V) and improved PSRR (70dB versus 60dB) may benefit certain applications. PCB layout redesign is required due to package format change. This substitute is suitable only when output current demand does not exceed 200mA and thermal management requirements are compatible with the smaller package.
All substitute parts maintain Active product status, ROHS3 compliance, and MSL 1 rating, ensuring compatibility with standard manufacturing and storage conditions.
Frequently Asked Questions (FAQ)
Q: Can BH28M0AWHFV-TR be used as a direct replacement for BH28MA3WHFV-TR?
A: Yes. BH28M0AWHFV-TR is a parametric equivalent with identical output voltage (2.8V), output current (300mA), input voltage rating (5.5V), dropout voltage (0.09V @ 100mA), and package format (6-HVSOF). No circuit or PCB modifications are required.
Q: What are the limitations of BU28TD2WNVX-TL as a substitute?
A: BU28TD2WNVX-TL has reduced output current capacity (200mA versus 300mA) and uses a different package format (4-UDFN versus 6-HVSOF). Applications requiring output current above 200mA cannot use this substitute. PCB layout redesign is necessary due to package incompatibility.
Q: Are all substitute parts compliant with the same environmental and regulatory standards?
A: Yes. All listed parts are ROHS3 compliant, have MSL 1 rating (unlimited moisture sensitivity), and maintain Active product status. All operate across the -40°C to 85°C temperature range.
Q: What is the primary difference in electrical performance between the main part and BU28TD2WNVX-TL?
A: The primary differences are output current capacity (300mA versus 200mA), dropout voltage (0.09V @ 100mA versus 0.5V @ 200mA), and PSRR (60dB versus 70dB at 1kHz). The higher dropout voltage of BU28TD2WNVX-TL may impact efficiency in applications with tight input-to-output voltage margins.
Q: Can package format differences affect circuit performance?
A: Package format differences do not affect electrical performance but require PCB layout redesign. The 6-HVSOF package (main part and BH28M0AWHFV-TR) and 4-UDFN package (BU28TD2WNVX-TL) have different pin configurations and thermal characteristics. Thermal management and signal routing must be re-evaluated when changing package formats.
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