BFS17,235 RF Transistor NPN Equivalent & Substitute Parts

Part Overview

The BFS17,235 is an RF transistor NPN manufactured by NXP USA Inc., designed for RF applications operating at 1GHz transition frequency with 15V collector-emitter breakdown voltage and 300mW maximum power dissipation in a surface mount SOT-23 (TO-236AB) package. This part is classified as obsolete, necessitating identification of active equivalent and substitute components that maintain functional compatibility within specified electrical and mechanical parameters.

Substiute Parts

BFS17,235
NXP USA Inc.In Stock: 1045BFS17,235 Datasheet
BFS17,235
Current Part
BFU520AR
NXP USA Inc.In Stock: 10870BFU520AR Datasheet
BFU520AR
MFR Recommended
BFR193L3E6327XTMA1
Infineon TechnologiesIn Stock: 990BFR193L3E6327XTMA1 Datasheet
BFR193L3E6327XTMA1
Direct
BFP183WH6327XTSA1
Infineon TechnologiesIn Stock: 15329BFP183WH6327XTSA1 Datasheet
BFP183WH6327XTSA1
MFR Recommended
BFR340FH6327XTSA1
Infineon TechnologiesIn Stock: 6535BFR340FH6327XTSA1 Datasheet
BFR340FH6327XTSA1
MFR Recommended
BFS 17P E8211
Infineon TechnologiesIn Stock: 1257BFS 17P E8211 Datasheet
BFS 17P E8211
MFR Recommended
MMBT918LT1G
onsemiIn Stock: 60245MMBT918LT1G Datasheet
MMBT918LT1G
MFR Recommended

Key Parameters

Parameter Value Unit
Transistor Type NPN -
Voltage - Collector Emitter Breakdown (Max) 15V V
Frequency - Transition 1GHz GHz
Power - Max 300mW mW
Current - Collector (Ic) (Max) 25mA mA
DC Current Gain (hFE) (Min) @ Ic, Vce 25 @ 2mA, 1V -
Noise Figure (dB Typ @ f) 4.5dB @ 500MHz dB
Operating Temperature (Max) 150°C °C
Mounting Type Surface Mount -
Package / Case TO-236-3, SC-59, SOT-23-3 -
RoHS Status ROHS3 Compliant -
Moisture Sensitivity Level (MSL) 1 (Unlimited) -

Substitute Part Grouping Explanation

Substitution of the BFS17,235 is determined by the following critical parameters:

Primary Compatibility Criteria:

  • Transistor Type: NPN (mandatory match)
  • Voltage - Collector Emitter Breakdown (Max): 15V or higher (backward compatible)
  • Mounting Type: Surface Mount (mandatory match)
  • Package compatibility: SOT-23-3 (TO-236AB) or equivalent footprint

Secondary Performance Criteria:

  • Frequency - Transition: 1GHz or higher (backward compatible for RF applications)
  • Power - Max: 300mW or higher (backward compatible)
  • Current - Collector (Ic) (Max): 25mA or higher (backward compatible)
  • Operating Temperature: 150°C maximum junction temperature (mandatory match)

Compliance Requirements:

  • RoHS3 Compliant (mandatory match)
  • Moisture Sensitivity Level: 1 (Unlimited) (mandatory match)

Substitute parts are grouped into two categories:

Category A - Direct Package Compatibility (SOT-23-3): Parts maintaining identical or compatible SOT-23-3 package footprint with electrical parameters meeting or exceeding the BFS17,235 specifications.

Category B - Alternative Package Compatibility (SOT-343, TSLP-3-1, TSFP-3): Parts with superior electrical performance but different surface mount packages requiring PCB layout modification.

Parameter Comparison

Parameter BFS17,235 (Main) BFU520AR BFR193L3E6327XTMA1 BFP183WH6327XTSA1 BFR340FH6327XTSA1 BFS 17P E8211 MMBT918LT1G
Manufacturer NXP USA Inc. NXP USA Inc. Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies onsemi
Product Status Obsolete Active Active Active Active Active Active
Transistor Type NPN NPN NPN NPN NPN NPN NPN
Voltage - Collector Emitter Breakdown (Max) 15V 12V 12V 12V 9V 15V 15V
Frequency - Transition 1GHz 10GHz 8GHz 8.5GHz 14GHz 1.4GHz 600MHz
Noise Figure (dB Typ @ f) 4.5dB @ 500MHz 0.7dB @ 900MHz 1dB ~ 1.6dB @ 900MHz ~ 1.8GHz 0.9dB ~ 1.4dB @ 900MHz ~ 1.8GHz 0.9dB ~ 1.2dB @ 100MHz ~ 2.4GHz 3.5dB @ 800MHz 6dB @ 60MHz
Power - Max 300mW 450mW 580mW 450mW 75mW 280mW 225mW
DC Current Gain (hFE) (Min) @ Ic, Vce 25 @ 2mA, 1V 60 @ 5mA, 8V 70 @ 30mA, 8V 70 @ 15mA, 8V 90 @ 5mA, 3V 40 @ 2mA, 1V 20 @ 3mA, 1V
Current - Collector (Ic) (Max) 25mA 30mA 80mA 65mA 20mA 25mA 50mA
Operating Temperature (Max) 150°C 150°C 150°C 150°C 150°C 150°C 150°C
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3 TO-236-3, SC-59, SOT-23-3 SC-101, SOT-883 SC-82A, SOT-343 SOT-723 TO-236-3, SC-59, SOT-23-3 TO-236-3, SC-59, SOT-23-3
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

Direct Replacement (No PCB Modification Required):

BFS 17P E8211 (Infineon Technologies) - Recommended for direct substitution. This part maintains identical SOT-23-3 package footprint, matching 15V collector-emitter breakdown voltage, and equivalent 25mA maximum collector current. Transition frequency of 1.4GHz exceeds the 1GHz specification. Product status is active with full RoHS3 compliance and MSL 1 rating. Operating temperature maximum of 150°C matches the original specification.

MMBT918LT1G (onsemi) - Alternative direct replacement with SOT-23-3 package compatibility. Maintains 15V collector-emitter breakdown voltage and 25mA maximum collector current. Transition frequency of 600MHz is lower than the original 1GHz specification, limiting application to lower frequency RF circuits. Product status is active with full RoHS3 compliance and MSL 1 rating. Extended operating temperature range of -55°C to 150°C provides additional thermal margin.

Enhanced Performance Substitutes (PCB Layout Modification Required):

BFU520AR (NXP USA Inc.) - Manufacturer-recommended substitute offering superior RF performance. Provides 10GHz transition frequency with 450mW power dissipation. Collector-emitter breakdown voltage of 12V is lower than the original 15V specification. Requires SOT-23-3 package footprint compatibility verification. Includes AEC-Q101 automotive qualification. Product status is active with full RoHS3 compliance.

BFR193L3E6327XTMA1 (Infineon Technologies) - High-performance alternative with 8GHz transition frequency and 580mW power dissipation. Collector-emitter breakdown voltage of 12V is lower than the original 15V specification. Package is PG-TSLP-3-1 (SOT-883), requiring PCB layout modification. Maximum collector current of 80mA exceeds original specification. Product status is active with full RoHS3 compliance.

BFP183WH6327XTSA1 (Infineon Technologies) - High-performance alternative with 8.5GHz transition frequency and 450mW power dissipation. Collector-emitter breakdown voltage of 12V is lower than the original 15V specification. Package is PG-SOT343-3D (SOT-343), requiring PCB layout modification. Maximum collector current of 65mA exceeds original specification. Product status is active with full RoHS3 compliance.

BFR340FH6327XTSA1 (Infineon Technologies) - Ultra-high-frequency alternative with 14GHz transition frequency. Collector-emitter breakdown voltage of 9V is significantly lower than the original 15V specification, limiting application to lower voltage circuits. Power dissipation of 75mW is substantially lower than the original 300mW specification. Package is PG-TSFP-3 (SOT-723), requiring PCB layout modification. Maximum collector current of 20mA is lower than original specification. Product status is active with full RoHS3 compliance.

Frequently Asked Questions (FAQ)

Q1: Can BFS 17P E8211 be used as a direct drop-in replacement for BFS17,235?

A: Yes. BFS 17P E8211 maintains identical SOT-23-3 package footprint, matching 15V collector-emitter breakdown voltage, and equivalent 25mA maximum collector current. No PCB layout modification is required. The 1.4GHz transition frequency exceeds the original 1GHz specification, providing enhanced RF performance capability.

Q2: What is the primary difference between direct replacement options and enhanced performance substitutes?

A: Direct replacement options (BFS 17P E8211 and MMBT918LT1G) maintain the SOT-23-3 package footprint, allowing component substitution without PCB modification. Enhanced performance substitutes (BFU520AR, BFR193L3E6327XTMA1, BFP183WH6327XTSA1, BFR340FH6327XTSA1) offer superior RF performance characteristics but require alternative package footprints (SOT-343, SOT-883, SOT-723), necessitating PCB layout redesign.

Q3: Why does BFR340FH6327XTSA1 have lower power dissipation than the original BFS17,235?

A: BFR340FH6327XTSA1 is optimized for ultra-high-frequency operation (14GHz) in miniaturized applications. The 75mW power rating reflects design optimization for lower power RF circuits. This part is suitable only for applications where the lower power dissipation and reduced collector current (20mA maximum) are compatible with circuit requirements.

Q4: Can parts with 12V collector-emitter breakdown voltage replace the 15V BFS17,235 in all applications?

A: No. Parts with 12V collector-emitter breakdown voltage (BFU520AR, BFR193L3E6327XTMA1, BFP183WH6327XTSA1) are suitable only for circuits operating at 12V or lower. Applications requiring 15V operation must use BFS 17P E8211 or MMBT918LT1G, which maintain the original 15V specification.

Q5: What compliance certifications are maintained across all substitute parts?

A: All substitute parts maintain RoHS3 compliance and Moisture Sensitivity Level 1 (Unlimited) rating, matching the original BFS17,235 specifications. BFU520AR includes additional AEC-Q101 automotive qualification. All parts are REACH unaffected and classified as EAR99 for export control purposes.

Q6: Is MMBT918LT1G suitable for 1GHz RF applications?

A: MMBT918LT1G has a transition frequency of 600MHz, which is lower than the 1GHz specification of the original BFS17,235. This part is suitable for RF applications operating at frequencies below 600MHz. For applications requiring 1GHz or higher frequency operation, BFS 17P E8211 or enhanced performance substitutes are required.

Q7: What PCB layout considerations apply when substituting with alternative package options?

A: Alternative package options require PCB footprint redesign. BFR193L3E6327XTMA1 uses PG-TSLP-3-1 (SOT-883) package; BFP183WH6327XTSA1 uses PG-SOT343-3D (SOT-343) package; BFR340FH6327XTSA1 uses PG-TSFP-3 (SOT-723) package. Each package has different pin spacing, lead geometry, and thermal characteristics requiring circuit board redesign and re-qualification.

Q8: Are all substitute parts currently in active production status?

A: Yes. All substitute parts listed are classified as active products. The original BFS17,235 is classified as obsolete, making identification of active alternatives necessary for new designs and production continuity.

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