BFP182WE6327HTSA1 Equivalent & Substitute Parts

Part Overview

The BFP182WE6327HTSA1 is an RF transistor manufactured by Infineon Technologies, classified as an NPN bipolar junction transistor (BJT) designed for RF applications. This device operates at frequencies up to 8GHz with a maximum power dissipation of 250mW and is housed in a surface mount SC-82A/SOT-343 package.

The BFP182WE6327HTSA1 is currently listed as obsolete. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications utilizing this RF transistor.

Substiute Parts

BFP182WE6327HTSA1

Infineon TechnologiesIn Stock: 698BFP182WE6327HTSA1 Datasheet

Current PartRFQ

2SC5065-Y(TE85L,F)

Toshiba Semiconductor and StorageIn Stock: 19972SC5065-Y(TE85L,F) Datasheet

MFR RecommendedRFQ

MRF455

MACOM Technology SolutionsIn Stock: 1824MRF455 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the BFP182WE6327HTSA1 is determined by the following critical parameters:

Primary Substitution Criteria:

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 12V minimum
• Frequency - Transition: 8GHz or higher
• Power - Max: 250mW or higher
• Current - Collector (Ic) (Max): 35mA or higher
• Mounting Type: Surface Mount
• Package compatibility: SOT-343 or equivalent surface mount packages

Substitute Parts Identified:

The 2SC5065-Y(TE85L,F) from Toshiba Semiconductor and Storage meets the core electrical requirements with matching 12V breakdown voltage and surface mount configuration. This part operates at 7GHz transition frequency with reduced power dissipation (100mW) and lower maximum collector current (30mA), making it suitable for applications with less demanding power and current requirements.

The MRF455 from MACOM Technology Solutions represents a different substitution category. This part operates at 18V breakdown voltage with significantly higher power handling (60W) and collector current (15A), but features chassis mount packaging rather than surface mount. This part is suitable only for applications where package type and power requirements can be accommodated.

Parameter Comparison

Engineering Selection Recommendations

For 2SC5065-Y(TE85L,F) Substitution:

The 2SC5065-Y(TE85L,F) is classified as Active product status, ensuring ongoing availability and supply chain support. This part maintains the 12V breakdown voltage specification and surface mount configuration of the original BFP182WE6327HTSA1. The 7GHz transition frequency is lower than the original 8GHz specification. The maximum power dissipation (100mW) and collector current (30mA) are reduced compared to the original part. This substitute is suitable for applications where the reduced frequency, power, and current specifications are acceptable within the circuit design margins. The part is RoHS3 compliant and carries EAR99 export classification.

For MRF455 Substitution:

The MRF455 is classified as Active product status. This part operates at 18V breakdown voltage, exceeding the original 12V specification. The power handling capability (60W) and collector current (15A) are substantially higher than the original part. The mounting type is Chassis Mount, fundamentally different from the surface mount configuration of the BFP182WE6327HTSA1. This substitute is suitable only for applications where the package type change can be accommodated in the circuit design and where the higher voltage and power ratings are either required or acceptable. The part is RoHS3 compliant and carries EAR99 export classification.

Frequently Asked Questions (FAQ)

Q: Can the 2SC5065-Y(TE85L,F) be used as a direct replacement for the BFP182WE6327HTSA1?

A: The 2SC5065-Y(TE85L,F) shares the same transistor type (NPN), breakdown voltage (12V), and surface mount configuration. However, the transition frequency is 7GHz versus 8GHz, and power/current ratings are reduced. Substitution is possible only if the circuit design can accommodate these parameter differences.

Q: What are the package compatibility considerations?

A: The BFP182WE6327HTSA1 uses SC-82A/SOT-343 surface mount packaging. The 2SC5065-Y(TE85L,F) uses SC-70/SOT-323 surface mount packaging. While both are surface mount, the physical dimensions and pin configurations differ. PCB layout modifications may be required. The MRF455 uses 211-07 Chassis Mount packaging, which is not compatible with surface mount applications.

Q: Why is the BFP182WE6327HTSA1 listed as obsolete?

A: Obsolete status indicates the part is no longer manufactured by Infineon Technologies. Existing inventory may be available through authorized distributors, but long-term supply cannot be guaranteed. Identifying active substitute parts ensures design continuity and production sustainability.

Q: Are there compliance differences between the main part and substitutes?

A: All three parts carry EAR99 export classification and MSL 1 (Unlimited) moisture sensitivity rating. The 2SC5065-Y(TE85L,F) is RoHS3 compliant. The BFP182WE6327HTSA1 lists REACH Unaffected status. The MRF455 is RoHS3 compliant. Compliance verification should be performed based on specific application requirements and regional regulations.

Q: What is the impact of the lower operating temperature maximum on the 2SC5065-Y(TE85L,F)?

A: The 2SC5065-Y(TE85L,F) has a maximum operating temperature of 125°C compared to 150°C for the BFP182WE6327HTSA1. Applications operating near thermal limits may require thermal management adjustments or design verification to ensure the substitute part operates within specified temperature ranges.

Q: Can the MRF455 be used in a surface mount application?

A: No. The MRF455 is a Chassis Mount device with 211-07 package configuration. It is not suitable for surface mount PCB applications. This part is applicable only to applications using through-hole or chassis-mounted component designs.