BD70HC5MEFJ-LBH2 Equivalent & Substitute Parts

Part Overview

The BD70HC5MEFJ-LBH2 is a linear voltage regulator IC from Rohm Semiconductor designed for positive fixed output regulation. This device delivers 1.5A output current at a fixed 7V output with a maximum dropout voltage of 1.2V at full load. The regulator features integrated protection including over-current, over-temperature, and soft-start functionality, with an enable control feature for power management applications.

The part is actively produced and stocked with 1049 units available. As an active product with established supply, equivalent alternatives exist within the same product family to support design flexibility and supply chain continuity.

Substiute Parts

BD70HC5MEFJ-LBH2
Rohm SemiconductorIn Stock: 1125BD70HC5MEFJ-LBH2 Datasheet
BD70HC5MEFJ-LBH2
Current Part
BD70HC5MEFJ-ME2
Rohm SemiconductorIn Stock: 1158BD70HC5MEFJ-ME2 Datasheet
BD70HC5MEFJ-ME2
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Rohm Semiconductor
Category Power Management (PMIC)
Output Configuration Positive
Output Type Fixed
Voltage - Output (Fixed) 7V
Voltage - Input (Max) 8V
Current - Output 1.5A
Voltage Dropout (Max) 1.2V @ 1.5A
Package / Case 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C
Protection Features Over Current, Over Temperature, Soft Start
Control Features Enable
RoHS Status ROHS3 Compliant
MSL Rating 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the BD70HC5MEFJ-LBH2 is determined by strict parametric matching across the following critical criteria:

Electrical Parameters (Must Match):

  • Output voltage: 7V fixed
  • Maximum output current: 1.5A
  • Maximum input voltage: 8V
  • Dropout voltage: 1.2V @ 1.5A
  • Output configuration: Positive
  • Control features: Enable function
  • Protection features: Over-current, over-temperature, soft-start

Mechanical Parameters (Must Match):

  • Package type: 8-SOIC with exposed pad
  • Mounting type: Surface mount
  • Physical dimensions: 0.154" width (3.90mm)

Compliance Parameters (Must Match):

  • RoHS3 compliance
  • MSL rating: 1 (Unlimited)
  • Manufacturer: Rohm Semiconductor
  • Base product number: BD70HC5

The BD70HC5MEFJ-ME2 meets all these criteria and qualifies as a parametric equivalent. Differences in supply current specifications or automotive qualification do not affect functional substitutability for standard applications.

Parameter Comparison

Parameter BD70HC5MEFJ-LBH2 BD70HC5MEFJ-ME2
Manufacturer Rohm Semiconductor Rohm Semiconductor
Category Power Management (PMIC) Power Management (PMIC)
Packaging Tape & Reel (TR) Tape & Reel (TR)
Output Configuration Positive Positive
Output Type Fixed Fixed
Voltage - Output (Fixed) 7V 7V
Voltage - Input (Max) 8V 8V
Current - Output 1.5A 1.5A
Voltage Dropout (Max) 1.2V @ 1.5A 1.2V @ 1.5A
Current - Supply (Max) 1.2 mA 1.2 mA
Control Features Enable Enable
Protection Features Over Current, Over Temperature, Soft Start Over Current, Over Temperature, Soft Start
Operating Temperature -40°C ~ 105°C -40°C ~ 105°C
Mounting Type Surface Mount Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width) Exposed Pad 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Supplier Device Package 8-HTSOP-J 8-HTSOP-J
Base Product Number BD70HC5 BD70HC5
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99
HTSUS Code 8542.39.0001 8542.39.0001
Product Status Active Active
Current Inventory 1049 Pcs 1076 Pcs

Engineering Selection Recommendations

Both the BD70HC5MEFJ-LBH2 and BD70HC5MEFJ-ME2 are active products from Rohm Semiconductor with identical electrical and mechanical specifications. Selection between these parts should be based on:

Availability: The BD70HC5MEFJ-ME2 currently has higher inventory (1076 units) compared to the BD70HC5MEFJ-LBH2 (1049 units), making it suitable for high-volume procurement scenarios.

Compliance Requirements: The BD70HC5MEFJ-ME2 carries AEC-Q100 automotive qualification, which provides additional assurance for applications requiring automotive-grade components. The BD70HC5MEFJ-LBH2 meets standard industrial compliance without automotive qualification.

Supply Chain Continuity: Both parts share identical parametric specifications and package configurations, ensuring direct interchangeability without circuit redesign or board layout modifications.

Frequently Asked Questions (FAQ)

Q: Can BD70HC5MEFJ-ME2 be used as a direct replacement for BD70HC5MEFJ-LBH2?

A: Yes. Both parts are parametrically identical across all electrical and mechanical specifications. They share the same output voltage (7V), output current (1.5A), dropout voltage (1.2V @ 1.5A), package type (8-SOIC with exposed pad), and protection features. No circuit modifications are required for substitution.

Q: What are the key differences between these two parts?

A: The primary differences are inventory levels and qualification status. The BD70HC5MEFJ-ME2 includes AEC-Q100 automotive qualification and has higher current stock. Both parts are ROHS3 compliant and carry identical electrical ratings.

Q: Are the package dimensions identical?

A: Yes. Both parts use the 8-SOIC package with 0.154" (3.90mm) width and exposed pad configuration. PCB footprints are identical, and no layout changes are necessary when substituting between these parts.

Q: Do these parts have the same thermal characteristics?

A: Both parts operate across the same temperature range (-40°C to 105°C) and include identical over-temperature protection. Thermal performance is equivalent.

Q: Which part should be selected for new designs?

A: Selection depends on application requirements. For automotive or safety-critical applications, the BD70HC5MEFJ-ME2 with AEC-Q100 qualification is appropriate. For standard industrial applications, either part meets requirements. Availability and lead time should also inform procurement decisions.

Q: Are there any compatibility issues with existing PCB designs?

A: No. Both parts use identical package specifications and pinouts. Existing designs require no modifications for either part.

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