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BCR 142T E6327 Equivalent & Substitute Parts
Part Overview
The BCR 142T E6327 is a pre-biased NPN bipolar junction transistor (BJT) manufactured by Infineon Technologies in the SC-75 (SOT-416) surface mount package. This component is designed for general-purpose switching and amplification applications requiring a 50 V collector-emitter breakdown voltage and 100 mA maximum collector current. The device integrates internal base and emitter-base resistors (22 kOhms and 47 kOhms respectively) to simplify circuit design and reduce component count.
The BCR 142T E6327 is currently discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives. Active substitute parts are available from multiple manufacturers including Diodes Incorporated, Rohm Semiconductor, onsemi, and Nexperia USA Inc., offering equivalent electrical performance with improved availability and extended product lifecycle support.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Transistor Type | NPN - Pre-Biased | — |
| Current - Collector (Ic) (Max) | 100 | mA |
| Voltage - Collector Emitter Breakdown (Max) | 50 | V |
| Resistor - Base (R1) | 22 | kOhms |
| Resistor - Emitter Base (R2) | 47 | kOhms |
| DC Current Gain (hFE) (Min) @ Ic, Vce | 70 @ 5mA, 5V | — |
| Vce Saturation (Max) @ Ib, Ic | 300mV @ 500µA, 10mA | — |
| Current - Collector Cutoff (Max) | 100 | nA |
| Frequency - Transition | 150 | MHz |
| Power - Max | 250 | mW |
| Package / Case | SC-75, SOT-416 | — |
| Mounting Type | Surface Mount | — |
| RoHS Status | ROHS3 Compliant | — |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | — |
Substitute Part Grouping Explanation
Substitution of the BCR 142T E6327 is determined by strict alignment of electrical and mechanical parameters. The following criteria establish functional equivalence:
Primary Substitution Criteria:
- Transistor Type: NPN - Pre-Biased (mandatory)
- Voltage - Collector Emitter Breakdown (Max): 50 V (mandatory)
- Current - Collector (Ic) (Max): 100 mA (mandatory for full-current applications)
- Resistor - Base (R1): 22 kOhms (mandatory for bias network compatibility)
- Resistor - Emitter Base (R2): 47 kOhms (mandatory for bias network compatibility)
- Mounting Type: Surface Mount (mandatory)
- RoHS Status: ROHS3 Compliant (mandatory for regulatory compliance)
Secondary Compatibility Parameters:
- Package / Case: SC-75 (SOT-416) preferred; alternative packages (SOT-23-3, SOT-323, EMT3) acceptable if PCB layout permits
- DC Current Gain (hFE): Minimum 60 @ specified conditions (acceptable range for switching applications)
- Vce Saturation: 150 mV to 300 mV @ specified conditions (acceptable for saturation-mode switching)
- Frequency - Transition: 150 MHz minimum (acceptable for general-purpose switching)
- Power - Max: 150 mW to 250 mW (acceptable for typical switching loads)
Substitute parts are grouped into two categories: Direct Package Equivalents (SC-75 package) and Alternative Package Equivalents (SOT-23-3, SOT-323, EMT3 packages). Alternative package selections require PCB layout verification to confirm mechanical fit and thermal performance.
Parameter Comparison
| Manufacturer Part Number | Manufacturer | Ic (Max) mA | Vce(br) V | R1 kOhms | R2 kOhms | hFE (Min) | Vce Sat (Max) mV | Icbo (Max) nA | fT MHz | P (Max) mW | Package | Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCR 142T E6327 | Infineon Technologies | 100 | 50 | 22 | 47 | 70 @ 5mA, 5V | 300 @ 500µA, 10mA | 100 | 150 | 250 | SC-75 | Discontinued |
| DDTC124XCA-7-F | Diodes Incorporated | 100 | 50 | 22 | 47 | 68 @ 5mA, 5V | 300 @ 500µA, 10mA | 500 | 250 | 200 | SOT-23-3 | Active |
| DTC024EEBTL | Rohm Semiconductor | 30 | 50 | 22 | 22 | 60 @ 5mA, 10V | 150 @ 500µA, 5mA | — | 250 | 150 | EMT3F | Active |
| DTC024XEBTL | Rohm Semiconductor | 100 | 50 | 22 | 47 | 80 @ 5mA, 10V | 150 @ 500µA, 5mA | 500 | 250 | 150 | EMT3F | Active |
| DTC124EET1G | onsemi | 100 | 50 | 22 | 22 | 60 @ 5mA, 10V | 250 @ 300µA, 10mA | 500 | 200 | 200 | SC-75 | Active |
| DTC124XCAT116 | Rohm Semiconductor | 100 | 50 | 22 | 47 | 68 @ 5mA, 5V | 300 @ 500µA, 10mA | 500 | 250 | 200 | SOT-23-3 | Active |
| DTC124XETL | Rohm Semiconductor | 50 | 50 | 22 | 47 | 68 @ 5mA, 5V | 300 @ 500µA, 10mA | 500 | 250 | 150 | SC-75 | Active |
| DTC124XKAT146 | Rohm Semiconductor | 50 | 50 | 22 | 47 | 68 @ 5mA, 5V | 300 @ 500µA, 10mA | 500 | 250 | 200 | SOT-23-3 | Active |
| DTC143XETL | Rohm Semiconductor | 100 | 50 | 4.7 | 10 | 30 @ 10mA, 5V | 300 @ 500µA, 10mA | 500 | 250 | 150 | SC-75 | Active |
| PDTC124EU,115 | Nexperia USA Inc. | 100 | 50 | 22 | 22 | 60 @ 5mA, 5V | 150 @ 500µA, 10mA | 100 | 230 | 200 | SOT-323 | Active |
| PDTC124XT,215 | Nexperia USA Inc. | 100 | 50 | 22 | 47 | 80 @ 5mA, 5V | 150 @ 500µA, 10mA | 1000 | — | 250 | SOT-23-3 | Active |
Engineering Selection Recommendations
Tier 1 - Direct Package Equivalent (SC-75, SOT-416):
The DTC124EET1G (onsemi) provides the closest functional match to the BCR 142T E6327. Both devices share the SC-75 package, enabling direct PCB substitution without layout modification. The DTC124EET1G maintains 100 mA maximum collector current, 50 V breakdown voltage, and 22 kOhm base resistor. The emitter-base resistor differs (22 kOhms vs. 47 kOhms), resulting in higher DC current gain (60 vs. 70 @ specified conditions). This device is active with extended lifecycle support and ROHS3 compliance.
The DTC124XETL (Rohm Semiconductor) also uses the SC-75 package but supports only 50 mA maximum collector current, limiting its application to circuits requiring less than 50 mA. This device is suitable for reduced-current switching applications.
Tier 2 - Alternative Package Equivalents (SOT-23-3):
The DDTC124XCA-7-F (Diodes Incorporated) and DTC124XCAT116 (Rohm Semiconductor) provide full electrical equivalence (100 mA, 50 V, 22 kOhm base, 47 kOhm emitter-base resistor) in the SOT-23-3 package. These devices require PCB layout modification to accommodate the smaller package footprint. Both are active with ROHS3 compliance and high inventory availability.
The PDTC124XT,215 (Nexperia USA Inc.) offers automotive-grade qualification (AEC-Q100) in SOT-23-3 package with 100 mA capability and 22/47 kOhm resistor configuration. This device is suitable for automotive and high-reliability applications.
Tier 3 - Alternative Package Equivalents (SOT-323, EMT3F):
The PDTC124EU,115 (Nexperia USA Inc.) provides 100 mA capability in the compact SOT-323 package with 22 kOhm base and 22 kOhm emitter-base resistor. The different emitter-base resistor value (22 vs. 47 kOhms) affects bias network performance and requires circuit analysis.
The DTC024XEBTL (Rohm Semiconductor) supports 100 mA in the EMT3F package with matching 22/47 kOhm resistor configuration. This device is suitable for space-constrained applications.
Not Recommended:
The DTC024EEBTL (Rohm Semiconductor) and DTC143XETL (Rohm Semiconductor) are not recommended as direct substitutes. DTC024EEBTL limits collector current to 30 mA and uses 22 kOhm emitter-base resistor (vs. 47 kOhms). DTC143XETL uses 4.7 kOhm base and 10 kOhm emitter-base resistors, resulting in significantly different bias characteristics (30 @ 10mA vs. 70 @ 5mA hFE).
Frequently Asked Questions (FAQ)
Q: Can the DTC124EET1G directly replace the BCR 142T E6327 without PCB modification?
A: Yes. Both devices use the SC-75 (SOT-416) package with identical pin configuration and spacing. Direct PCB substitution is possible. The primary difference is the emitter-base resistor value (22 kOhms vs. 47 kOhms), which increases DC current gain. Circuit performance should be evaluated for applications sensitive to gain variation.
Q: What is the impact of different emitter-base resistor values on circuit operation?
A: The emitter-base resistor (R2) directly affects the DC current gain and bias point of the pre-biased transistor. A lower R2 value (22 kOhms vs. 47 kOhms) increases current gain, resulting in faster saturation and lower base current requirements. Applications requiring specific gain characteristics should be analyzed to confirm compatibility.
Q: Are SOT-23-3 package alternatives mechanically compatible with SC-75 PCB layouts?
A: No. SOT-23-3 and SC-75 packages have different footprints, pin spacing, and land patterns. PCB layout modification is required to accommodate SOT-23-3 devices. Consult package datasheets for precise dimensional specifications before layout redesign.
Q: Which substitute part offers the best availability and lifecycle support?
A: The DDTC124XCA-7-F (Diodes Incorporated) and DTC124XCAT116 (Rohm Semiconductor) offer the highest inventory levels (9,400 and 2,997 units respectively) and active product status. Both provide extended lifecycle support and ROHS3 compliance.
Q: Is the PDTC124XT,215 suitable for automotive applications?
A: Yes. The PDTC124XT,215 carries AEC-Q100 automotive qualification and is suitable for automotive and high-reliability applications. This device is recommended for applications requiring automotive-grade components.
Q: What is the significance of different transition frequencies (fT) among substitute parts?
A: Transition frequency (fT) indicates the maximum frequency at which the transistor maintains useful gain. The BCR 142T E6327 specifies 150 MHz. Substitute parts with higher fT values (200–250 MHz) provide additional frequency margin for high-speed switching applications. Lower fT values do not affect DC switching performance but may limit AC amplification bandwidth.
Q: Can the DTC143XETL be used as a substitute despite different resistor values?
A: No. The DTC143XETL uses 4.7 kOhm base and 10 kOhm emitter-base resistors, resulting in significantly different bias characteristics and DC current gain (30 @ 10mA vs. 70 @ 5mA). This device is not functionally equivalent and may cause circuit malfunction.
Q: What packaging considerations apply when selecting between SC-75 and alternative packages?
A: SC-75 (SOT-416) is a 3-pin package with 2.0 mm pitch. SOT-23-3 uses 1.9 mm pitch. SOT-323 uses 1.3 mm pitch. EMT3F uses 1.3 mm pitch. Smaller packages require higher PCB assembly precision and may impact thermal performance in high-power applications. Verify PCB assembly capabilities and thermal requirements before package selection.
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