BC857AW-TP Equivalent & Substitute Parts

Part Overview

The BC857AW-TP is an active PNP bipolar junction transistor manufactured by Micro Commercial Co, designed for interface applications requiring surface mount packaging. This component operates at a maximum collector current of 100 mA with a collector-emitter breakdown voltage of 45 V and a transition frequency of 100 MHz. The device is housed in an SOT-323 (SC-70) package and dissipates a maximum power of 150 mW.

Substitute parts are identified when equivalent electrical characteristics and mechanical compatibility are maintained across the specified parameter range. The BC857AW-TP has documented substitute availability to support procurement flexibility and supply chain continuity.

Key Parameters

Parameter	Value	Unit
Transistor Type	PNP	—
Current - Collector (Ic) (Max)	100	mA
Voltage - Collector Emitter Breakdown (Max)	45	V
Vce Saturation (Max) @ Ib, Ic	650 mV @ 5 mA, 100 mA	—
Current - Collector Cutoff (Max)	15	nA
DC Current Gain (hFE) (Min) @ Ic, Vce	125 @ 2 mA, 5 V	—
Power - Max	150	mW
Frequency - Transition	100	MHz
Operating Temperature Range	-65 to 150	°C
Mounting Type	Surface Mount	—
Package / Case	SC-70, SOT-323	—

Substitute Part Grouping Explanation

Substitution of the BC857AW-TP is determined by strict equivalence across the following critical parameters:

Electrical Equivalence Criteria:

Transistor type must be PNP
Maximum collector current (Ic) must be 100 mA or greater
Collector-emitter breakdown voltage (VCEO) must be 45 V or greater
Vce saturation must not exceed 650 mV at specified bias conditions
Collector cutoff current (ICBO) must not exceed 15 nA
Transition frequency must be 100 MHz or greater
Maximum power dissipation must be 150 mW or greater
DC current gain (hFE) minimum must be 125 or greater at specified conditions

Mechanical Equivalence Criteria:

Package type must be SC-70 or SOT-323 (equivalent designations)
Surface mount mounting type required
Pin configuration must be compatible with SOT-323 footprint

Compliance Considerations:

Product status must be Active
REACH compliance status must be equivalent or compliant

The BC857BWT1G meets all electrical and mechanical substitution criteria for the BC857AW-TP.

Parameter Comparison

Parameter	BC857AW-TP (Micro Commercial Co)	BC857BWT1G (onsemi)	Compatibility
Transistor Type	PNP	PNP	Equivalent
Current - Collector (Ic) (Max)	100 mA	100 mA	Equivalent
Voltage - Collector Emitter Breakdown (Max)	45 V	45 V	Equivalent
Vce Saturation (Max) @ Ib, Ic	650 mV @ 5 mA, 100 mA	650 mV @ 5 mA, 100 mA	Equivalent
Current - Collector Cutoff (Max)	15 nA	15 nA	Equivalent
DC Current Gain (hFE) (Min) @ Ic, Vce	125 @ 2 mA, 5 V	220 @ 2 mA, 5 V	Compatible (higher gain)
Power - Max	150 mW	150 mW	Equivalent
Frequency - Transition	100 MHz	100 MHz	Equivalent
Operating Temperature Range	-65 to 150 °C	-55 to 150 °C	Compatible (narrower range)
Mounting Type	Surface Mount	Surface Mount	Equivalent
Package / Case	SC-70, SOT-323	SC-70, SOT-323	Equivalent
Product Status	Active	Active	Equivalent
REACH Status	REACH Unaffected	REACH Unaffected	Equivalent

Engineering Selection Recommendations

The BC857BWT1G manufactured by onsemi is a direct substitute for the BC857AW-TP. Both components share identical electrical specifications across all critical parameters including collector current, breakdown voltage, saturation voltage, and transition frequency. Both devices maintain Active product status and REACH compliance.

The BC857BWT1G exhibits a higher DC current gain (hFE minimum of 220 versus 125), which represents improved performance within the same functional envelope. This higher gain does not create incompatibility and may provide enhanced circuit efficiency in applications sensitive to base drive requirements.

The operating temperature range of the BC857BWT1G extends from -55°C to 150°C, which is narrower than the BC857AW-TP range of -65°C to 150°C. Applications requiring operation below -55°C must retain the BC857AW-TP. For applications within the -55°C to 150°C window, the BC857BWT1G is fully compatible.

Both components are packaged in SC-70/SOT-323 surface mount configuration with identical pin assignments, enabling direct footprint compatibility on printed circuit boards.

Frequently Asked Questions (FAQ)

Q: Can the BC857BWT1G replace the BC857AW-TP in all applications?

A: The BC857BWT1G is electrically and mechanically compatible with the BC857AW-TP for applications operating within the temperature range of -55°C to 150°C. Applications requiring operation below -55°C must use the BC857AW-TP due to its extended lower temperature limit of -65°C.

Q: What is the significance of the higher DC current gain in the BC857BWT1G?

A: The BC857BWT1G specifies a minimum DC current gain (hFE) of 220 at 2 mA and 5 V, compared to 125 for the BC857AW-TP. This higher gain indicates improved transistor efficiency and may reduce base drive current requirements in circuit designs. Both values exceed the minimum specification, and the higher gain does not create functional incompatibility.

Q: Are the package dimensions identical between these two parts?

A: Both the BC857AW-TP and BC857BWT1G use the SC-70/SOT-323 surface mount package with identical pin configuration and footprint dimensions. Direct board-level substitution is supported without layout modifications.

Q: What is the difference between the packaging formats listed?

A: The BC857AW-TP is supplied in Bulk packaging, while the BC857BWT1G is supplied in Cut Tape (CT) and Digi-Reel® formats. These differences relate to order quantity and handling methods but do not affect component electrical or mechanical specifications.

Q: Are there compliance differences between these substitutes?

A: Both components maintain REACH Unaffected status. The BC857BWT1G additionally specifies RoHS3 Compliance and Moisture Sensitivity Level (MSL) 1 (Unlimited). These certifications indicate equivalent or enhanced compliance posture for regulated applications.

Q: Can these parts be used interchangeably on the same printed circuit board?

A: Yes. Both components share identical SC-70/SOT-323 package geometry and pin assignments. No circuit board layout modifications are required for substitution. Component selection can be made based on availability, temperature range requirements, and packaging format preferences.

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