BC337-112 Equivalent & Substitute Parts Reference

Part Overview

The BC337-112 is an NPN bipolar junction transistor manufactured by NXP USA Inc., designed for small-signal switching and amplification applications. It features a maximum collector current of 500 mA, collector-emitter breakdown voltage of 45 V, and a transition frequency of 100 MHz in a TO-92-3 through-hole package.

The BC337-112 is classified as obsolete. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for legacy systems and applications.

Substiute Parts

BC337,112
NXP USA Inc.In Stock: 931BC337,112 Datasheet
BC337,112
Current Part
BC33716BU
Fairchild SemiconductorIn Stock: 73218BC33716BU Datasheet
BC33716BU
MFR Recommended

Key Parameters

Parameter Value Unit
Transistor Type NPN
Current - Collector (Ic) Max 500 mA
Voltage - Collector Emitter Breakdown (Max) 45 V
Vce Saturation (Max) @ Ib, Ic 700 mV @ 50 mA, 500 mA
Current - Collector Cutoff (Max) 100 nA
DC Current Gain (hFE) Min @ Ic, Vce 100 @ 100 mA, 1 V
Power - Max 625 mW
Frequency - Transition 100 MHz
Operating Temperature (TJ) 150 °C
Mounting Type Through Hole
Package / Case TO-92-3 (TO-226AA)

Substitute Part Grouping Explanation

Substitution of the BC337-112 is determined by strict electrical and mechanical parameter matching within the NPN bipolar transistor category. The following parameters establish the substitution criteria:

Critical Matching Parameters:

  • Transistor polarity: NPN
  • Collector-emitter breakdown voltage: 45 V (minimum requirement)
  • Package type: TO-92-3 through-hole configuration
  • Mounting type: Through hole
  • DC current gain (hFE): minimum 100 @ 100 mA, 1 V
  • Transition frequency: 100 MHz
  • Maximum power dissipation: 625 mW
  • Operating temperature range: 150°C (TJ)

Allowable Variation:

  • Collector current (Ic) maximum: Equal to or greater than 500 mA
  • Vce saturation: Equal to or less than 700 mV @ specified conditions
  • Collector cutoff current (ICBO): Equal to or less than 100 nA

Substitute parts must meet or exceed all critical parameters and remain within allowable variations to ensure functional and thermal compatibility in existing circuit designs.

Parameter Comparison

Parameter BC337-112 (Main Part) BC33716BU (Substitute) Compatibility
Manufacturer NXP USA Inc. Fairchild Semiconductor Different manufacturer
Product Status Obsolete Active Substitute is in active production
Transistor Type NPN NPN Match
Current - Collector (Ic) Max 500 mA 800 mA Substitute exceeds requirement
Voltage - Collector Emitter Breakdown (Max) 45 V 45 V Match
Vce Saturation (Max) @ Ib, Ic 700 mV @ 50 mA, 500 mA 700 mV @ 50 mA, 500 mA Match
Current - Collector Cutoff (Max) 100 nA 100 nA Match
DC Current Gain (hFE) Min @ Ic, Vce 100 @ 100 mA, 1 V 100 @ 100 mA, 1 V Match
Power - Max 625 mW 625 mW Match
Frequency - Transition 100 MHz 100 MHz Match
Operating Temperature (TJ) 150°C 150°C Match
Mounting Type Through Hole Through Hole Match
Package / Case TO-92-3 (TO-226AA) TO-92-3 (TO-226AA) Match

Engineering Selection Recommendations

The BC33716BU manufactured by Fairchild Semiconductor is a direct substitute for the obsolete BC337-112. Selection of this substitute is based on the following engineering criteria:

Electrical Compatibility: All critical electrical parameters match or exceed the BC337-112 specifications. The BC33716BU provides a maximum collector current of 800 mA, which exceeds the 500 mA requirement of the original part, offering improved current handling capability without compromising circuit performance.

Package and Mounting Compatibility: Both parts utilize the TO-92-3 through-hole package with identical lead configuration (TO-226AA formed leads), ensuring direct mechanical and electrical compatibility in existing PCB layouts without design modification.

Product Status and Supply: The BC33716BU is in active production status with substantial inventory availability (73,196 pieces), whereas the BC337-112 is obsolete. This substitution ensures long-term supply chain continuity and reduces procurement risk.

Compliance and Regulatory Status: Both parts carry identical ECCN (EAR99) and HTSUS (8541.21.0075) classifications, maintaining regulatory compliance for export and trade purposes.

Frequently Asked Questions (FAQ)

Q: Can the BC33716BU be used as a direct replacement for the BC337-112 without circuit modification?

A: Yes. The BC33716BU meets all electrical and mechanical specifications of the BC337-112. The higher maximum collector current (800 mA vs. 500 mA) does not require circuit modification and provides additional design margin.

Q: Are there any thermal considerations when substituting the BC33716BU for the BC337-112?

A: Both parts have identical maximum power dissipation (625 mW) and operating temperature ratings (150°C TJ). Thermal performance is equivalent, and existing thermal management provisions remain adequate.

Q: Does the TO-92-3 package pinout differ between the BC337-112 and BC33716BU?

A: No. Both parts use the standard TO-92-3 (TO-226AA) package with identical lead assignments: Base (B), Collector (C), and Emitter (E). Pin-for-pin compatibility is confirmed.

Q: What is the significance of the higher collector current rating on the BC33716BU?

A: The BC33716BU's 800 mA maximum collector current exceeds the BC337-112's 500 mA rating. This provides additional operational headroom and allows the substitute to handle higher current demands without saturation, improving circuit reliability in applications approaching the original part's current limits.

Q: Are there any differences in DC current gain (hFE) between these parts?

A: No. Both parts specify a minimum DC current gain of 100 @ 100 mA, 1 V. Amplification characteristics are identical.

Q: How does the active production status of the BC33716BU affect long-term availability?

A: The BC33716BU is in active production, ensuring consistent availability and stable pricing compared to the obsolete BC337-112. This substitution eliminates supply chain discontinuity risks associated with end-of-life components.

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