BAS85-GS18 Equivalent & Substitute Parts

Part Overview

The BAS85-GS18 is a 30 V, 200 mA Schottky diode manufactured by Vishay General Semiconductor - Diodes Division in SOD-80 MiniMELF surface mount packaging. This component is classified as Active product status and is qualified to AEC-Q101 automotive standards. The BAS85-GS18 is supplied in Tape & Reel packaging with 10,400 pieces currently in stock.

Equivalent and substitute parts are identified when design requirements necessitate alternative sourcing due to inventory constraints, supply chain considerations, or specific packaging format requirements while maintaining electrical and mechanical compatibility within the defined parameter specifications.

Key Parameters

Parameter	Value	Unit
Technology	Schottky	—
Voltage - DC Reverse (Vr) (Max)	30	V
Current - Average Rectified (Io)	200	mA
Voltage - Forward (Vf) (Max) @ If	800 mV @ 100 mA	mV @ mA
Speed Classification	Small Signal ≤ 200mA (Io), Any Speed	—
Reverse Recovery Time (trr)	5	ns
Current - Reverse Leakage @ Vr	2	µA @ 25 V
Capacitance @ Vr, F	10	pF @ 1V, 1MHz
Operating Temperature - Junction (Max)	125	°C
Package / Case	DO-213AC, MINI-MELF, SOD-80	—
Mounting Type	Surface Mount	—
RoHS Status	ROHS3 Compliant	—
Moisture Sensitivity Level (MSL)	1 (Unlimited)	—

Substitute Part Grouping Explanation

Substitute parts for the BAS85-GS18 are qualified based on the following electrical and mechanical parameters:

Critical Matching Parameters:

Voltage - DC Reverse (Vr) (Max): 30 V
Current - Average Rectified (Io): 200 mA
Technology: Schottky
Mounting Type: Surface Mount
Package / Case: DO-213AC, MINI-MELF, SOD-80 or equivalent MiniMELF format
Speed Classification: Small Signal ≤ 200mA (Io), Any Speed

Acceptable Variation Parameters:

Voltage - Forward (Vf) (Max) @ If: Within small signal diode specifications
Current - Reverse Leakage @ Vr: Within acceptable leakage limits for Schottky technology
Capacitance @ Vr, F: Within acceptable range for small signal applications
Reverse Recovery Time (trr): Within small signal specifications
Operating Temperature - Junction: Minimum 125°C or higher

Packaging Compatibility: Substitutes are available in Tape & Reel (TR) or Cut Tape (CT) & Digi-Reel® formats. Both packaging types are compatible for component selection, with differences limited to supply and handling format.

Parameter Comparison

Parameter	BAS85-GS18 (Vishay)	BAS85,115 (Nexperia)	BAS85,135 (Nexperia)	TMMBAT42FILM (STMicroelectronics)	TMMBAT43FILM (STMicroelectronics)
Manufacturer	Vishay General Semiconductor	Nexperia USA Inc.	Nexperia USA Inc.	STMicroelectronics	STMicroelectronics
Technology	Schottky	Schottky	Schottky	Schottky	Schottky
Voltage - DC Reverse (Vr) (Max)	30 V	30 V	30 V	30 V	30 V
Current - Average Rectified (Io)	200 mA	200 mA	200 mA	200 mA	200 mA
Voltage - Forward (Vf) (Max) @ If	800 mV @ 100 mA	800 mV @ 100 mA	800 mV @ 100 mA	1 V @ 200 mA	1 V @ 200 mA
Speed Classification	Small Signal ≤ 200mA (Io), Any Speed	Small Signal ≤ 200mA (Io), Any Speed	Small Signal ≤ 200mA (Io), Any Speed	Small Signal ≤ 200mA (Io), Any Speed	Small Signal ≤ 200mA (Io), Any Speed
Reverse Recovery Time (trr)	5 ns	Not specified	Not specified	5 ns	5 ns
Current - Reverse Leakage @ Vr	2 µA @ 25 V	2.3 µA @ 25 V	2.3 µA @ 25 V	500 nA @ 25 V	500 nA @ 25 V
Capacitance @ Vr, F	10 pF @ 1V, 1MHz	10 pF @ 1V, 1MHz	10 pF @ 1V, 1MHz	7 pF @ 1V, 1MHz	7 pF @ 1V, 1MHz
Operating Temperature - Junction	125°C (Max)	125°C (Max)	125°C (Max)	-65°C ~ 125°C	-65°C ~ 125°C
Package / Case	DO-213AC, MINI-MELF, SOD-80	DO-213AC, MINI-MELF, SOD-80	DO-213AC, MINI-MELF, SOD-80	DO-213AA (Glass)	DO-213AA (Glass)
Supplier Device Package	SOD-80 MiniMELF	LLDS; MiniMelf	LLDS; MiniMelf	Mini MELF	Mini MELF
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)
Product Status	Active	Active	Active	Active	Active
Inventory (Pcs)	10,400	235,100	4,390	42,700	23,600

Engineering Selection Recommendations

BAS85,115 (Nexperia USA Inc.) - Cut Tape & Digi-Reel® Packaging

The BAS85,115 is a direct electrical equivalent to the BAS85-GS18 with identical voltage, current, and forward voltage specifications. Both components share the same base product number (BAS85) and are qualified to ROHS3 compliance with MSL 1 rating. The BAS85,115 differs only in packaging format (Cut Tape & Digi-Reel® versus Tape & Reel) and is available in significantly higher inventory (235,100 pieces). This substitute is suitable for applications where packaging format flexibility is acceptable.

BAS85,135 (Nexperia USA Inc.) - Tape & Reel Packaging

The BAS85,135 provides identical electrical specifications to the BAS85-GS18 and maintains the same Tape & Reel packaging format. Both components share the BAS85 base product number and are ROHS3 compliant with MSL 1 rating. The BAS85,135 is a direct substitute when Tape & Reel packaging is required and serves as an alternative sourcing option with 4,390 pieces in inventory.

TMMBAT42FILM (STMicroelectronics) - Cut Tape & Digi-Reel® Packaging

The TMMBAT42FILM meets all critical electrical parameters: 30 V reverse voltage, 200 mA average rectified current, and small signal Schottky technology. This component features improved reverse leakage characteristics (500 nA versus 2 µA) and lower capacitance (7 pF versus 10 pF), with identical 5 ns reverse recovery time. Operating temperature range extends to -65°C minimum. Package format is DO-213AA (Glass) Mini MELF, which is mechanically compatible with MiniMELF applications. ROHS3 compliance and MSL 1 rating are maintained. Inventory availability is 42,700 pieces.

TMMBAT43FILM (STMicroelectronics) - Cut Tape & Digi-Reel® Packaging

The TMMBAT43FILM satisfies all critical electrical requirements with 30 V reverse voltage, 200 mA average rectified current, and Schottky technology classification. This component exhibits superior reverse leakage performance (500 nA versus 2 µA) and reduced capacitance (7 pF versus 10 pF), with matching 5 ns reverse recovery time. Operating temperature range extends to -65°C minimum. Package format is DO-213AA (Glass) Mini MELF, mechanically compatible with MiniMELF specifications. ROHS3 compliance and MSL 1 rating are maintained. Inventory availability is 23,600 pieces.

All substitute parts maintain Active product status and full compliance with environmental and regulatory requirements applicable to the BAS85-GS18.

Frequently Asked Questions (FAQ)

Q: Can BAS85,115 replace BAS85-GS18 in production applications?

A: Yes. The BAS85,115 is electrically identical to the BAS85-GS18 with matching 30 V reverse voltage, 200 mA current rating, and 800 mV forward voltage specification. Both components share the BAS85 base product number and are ROHS3 compliant with MSL 1 rating. The only difference is packaging format: BAS85,115 is supplied in Cut Tape & Digi-Reel® format while BAS85-GS18 is Tape & Reel. Packaging format compatibility depends on assembly equipment specifications.

Q: What is the difference between BAS85,115 and BAS85,135?

A: Both parts are electrically identical with 30 V reverse voltage, 200 mA current rating, and 800 mV forward voltage. The difference is packaging format: BAS85,115 is supplied in Cut Tape & Digi-Reel® format with 235,100 pieces in inventory, while BAS85,135 is Tape & Reel format with 4,390 pieces in inventory. Selection depends on assembly line requirements and available inventory.

Q: Are TMMBAT42FILM and TMMBAT43FILM suitable substitutes for BAS85-GS18?

A: Yes. Both TMMBAT42FILM and TMMBAT43FILM meet the critical electrical parameters: 30 V reverse voltage, 200 mA average rectified current, and Schottky technology. Both components feature 5 ns reverse recovery time matching the BAS85-GS18. Differences include improved reverse leakage (500 nA versus 2 µA) and lower capacitance (7 pF versus 10 pF). Package format is DO-213AA (Glass) Mini MELF, which is mechanically compatible with MiniMELF applications. Operating temperature range extends to -65°C minimum, exceeding the BAS85-GS18 specification.

Q: What are the key parameters that determine substitution compatibility?

A: Substitution compatibility is determined by: (1) Voltage - DC Reverse (Vr) (Max) of 30 V, (2) Current - Average Rectified (Io) of 200 mA, (3) Schottky technology classification, (4) Surface Mount mounting type, (5) MiniMELF package format compatibility, and (6) Small Signal speed classification. All substitute parts meet these criteria. Secondary parameters including forward voltage, reverse leakage, and capacitance may vary within acceptable ranges for small signal Schottky diode applications.

Q: Can I use TMMBAT42FILM or TMMBAT43FILM in automotive applications requiring AEC-Q101 qualification?

A: The provided specifications do not include AEC-Q101 qualification status for TMMBAT42FILM or TMMBAT43FILM. The BAS85-GS18 is explicitly qualified to AEC-Q101 automotive standards. For automotive applications requiring AEC-Q101 qualification, use BAS85,115 or BAS85,135, which maintain the same qualification status as the BAS85-GS18.

Q: What is the difference in reverse leakage between substitute parts?

A: BAS85-GS18, BAS85,115, and BAS85,135 specify 2 µA reverse leakage at 25 V. TMMBAT42FILM and TMMBAT43FILM specify 500 nA reverse leakage at 25 V, representing a 4-fold improvement. Lower reverse leakage may provide performance benefits in low-power or precision applications but does not affect basic substitution compatibility.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All substitute parts (BAS85,115, BAS85,135, TMMBAT42FILM, and TMMBAT43FILM) are ROHS3 compliant with MSL 1 (Unlimited) moisture sensitivity rating, matching the BAS85-GS18 environmental compliance status.

Q: What packaging formats are available for substitutes?

A: BAS85-GS18 is supplied in Tape & Reel (TR) format. Substitute options include: BAS85,115 in Cut Tape (CT) & Digi-Reel® format, BAS85,135 in Tape & Reel (TR) format, TMMBAT42FILM in Cut Tape (CT) & Digi-Reel® format, and TMMBAT43FILM in Cut Tape (CT) & Digi-Reel® format. Selection depends on assembly equipment compatibility and supply chain requirements.

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