BAS516,H3F Equivalent & Substitute Parts

Part Overview

The BAS516,H3F is a general-purpose fast recovery diode manufactured by Toshiba Semiconductor and Storage, rated for 100 V DC reverse voltage and 250 mA average rectified current. This surface mount component operates with a maximum forward voltage of 1.25 V at 150 mA and features a reverse recovery time of 3 ns, making it suitable for high-speed switching applications. The device is currently in active production status and is RoHS3 compliant with unlimited moisture sensitivity level (MSL 1). Substitute parts are identified when equivalent electrical performance and mechanical compatibility are required due to inventory constraints, supply chain considerations, or packaging format preferences.

Substiute Parts

BAS516,H3F
Toshiba Semiconductor and StorageIn Stock: 4559BAS516,H3F Datasheet
BAS516,H3F
Current Part
BAS516,L3F
Toshiba Semiconductor and StorageIn Stock: 71101BAS516,L3F Datasheet
BAS516,L3F
Parametric Equivalent

Key Parameters

Parameter Value Unit
Voltage - DC Reverse (Vr) (Max) 100 V
Current - Average Rectified (Io) 250 mA
Voltage - Forward (Vf) (Max) @ If 1.25 @ 150 mA V
Reverse Recovery Time (trr) 3 ns
Current - Reverse Leakage @ Vr 200 @ 80 V nA
Capacitance @ Vr, F 0.35 @ 0V, 1MHz pF
Operating Temperature - Junction (Max) 150 °C
Mounting Type Surface Mount
Package / Case SC-79, SOD-523
Technology Standard
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the BAS516,H3F is determined by strict equivalence across all critical electrical and mechanical parameters. The substitute part BAS516,L3F shares identical electrical specifications including reverse voltage rating, average rectified current, forward voltage characteristics, reverse recovery time, reverse leakage current, and junction capacitance. Both components utilize the same SC-79/SOD-523 surface mount package and are manufactured using standard diode technology. The primary distinction between these parts is the packaging format: BAS516,H3F is supplied in Tape & Reel (TR) configuration, while BAS516,L3F is supplied in Cut Tape (CT) & Digi-Reel® format. Both parts maintain identical product status (Active), RoHS3 compliance, and MSL 1 rating. Substitution is valid when packaging format compatibility with assembly equipment and supply chain requirements permits the interchange.

Parameter Comparison

Parameter BAS516,H3F BAS516,L3F Match
Voltage - DC Reverse (Vr) (Max) 100 V 100 V
Current - Average Rectified (Io) 250 mA 250 mA
Voltage - Forward (Vf) (Max) @ If 1.25 V @ 150 mA 1.25 V @ 150 mA
Speed Fast Recovery ≤ 500ns, > 200mA (Io) Fast Recovery ≤ 500ns, > 200mA (Io)
Reverse Recovery Time (trr) 3 ns 3 ns
Current - Reverse Leakage @ Vr 200 nA @ 80 V 200 nA @ 80 V
Capacitance @ Vr, F 0.35 pF @ 0V, 1MHz 0.35 pF @ 0V, 1MHz
Operating Temperature - Junction (Max) 150°C 150°C
Mounting Type Surface Mount Surface Mount
Package / Case SC-79, SOD-523 SC-79, SOD-523
Technology Standard Standard
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)
Packaging Format Tape & Reel (TR) Cut Tape (CT) & Digi-Reel® Different

Engineering Selection Recommendations

The BAS516,L3F is a direct parametric equivalent to the BAS516,H3F and is suitable for substitution in applications where the electrical and thermal specifications are identical. Both components are manufactured by Toshiba Semiconductor and Storage, maintain active product status, and carry ROHS3 compliance certification. The selection between these parts should be based on assembly process requirements and packaging format compatibility. The BAS516,H3F in Tape & Reel format is optimized for high-volume automated pick-and-place assembly operations. The BAS516,L3F in Cut Tape & Digi-Reel® format accommodates alternative assembly workflows and lower-volume production runs. No electrical performance degradation occurs with either selection, as all critical parameters including reverse voltage, forward voltage, reverse recovery time, and leakage current are identical. Inventory availability and supply chain lead times may also influence part selection between these equivalent options.

Frequently Asked Questions (FAQ)

Q: Are BAS516,H3F and BAS516,L3F electrically interchangeable?

A: Yes. Both parts are parametrically equivalent across all electrical specifications including voltage ratings, current capacity, forward voltage drop, reverse recovery time, and leakage current. They utilize identical semiconductor technology and package geometry (SC-79/SOD-523).

Q: What is the difference between Tape & Reel and Cut Tape & Digi-Reel® packaging?

A: Tape & Reel (TR) packaging supplies components on continuous carrier tape wound on a reel, optimized for automated high-speed assembly equipment. Cut Tape (CT) & Digi-Reel® packaging provides components on cut tape segments or alternative reel formats, suitable for different assembly processes and lower-volume applications. Both formats contain identical components.

Q: Can I use BAS516,L3F as a direct replacement for BAS516,H3F in existing designs?

A: Yes, provided your assembly equipment is compatible with the Cut Tape & Digi-Reel® packaging format. The electrical performance, thermal characteristics, and physical package dimensions are identical, ensuring functional equivalence in the circuit.

Q: Are there any compliance or certification differences between these parts?

A: No. Both BAS516,H3F and BAS516,L3F carry identical RoHS3 compliance status, MSL 1 rating, and ECCN/HTSUS classifications. They are manufactured to the same quality and regulatory standards.

Q: What factors should determine which part number to select?

A: Selection should be based on assembly equipment compatibility with the packaging format (Tape & Reel versus Cut Tape & Digi-Reel®), inventory availability, supply chain lead times, and production volume requirements. Electrical performance and reliability are equivalent between both options.

Request Quote (Ships tomorrow)