BAS21QBZ Equivalent & Substitute Parts

Part Overview

The BAS21QBZ is a general-purpose rectifier diode manufactured by Nexperia USA Inc., rated for 200 V DC reverse voltage and 250 mA average rectified current. The device features fast recovery characteristics with a reverse recovery time of 50 ns and is housed in a 3-XDFN Exposed Pad surface mount package with wettable flank technology.

The BAS21QBZ is classified as obsolete. Equivalent and substitute parts are available in active product status, making them suitable for new designs and ongoing production requirements where the BAS21QBZ is no longer procurable.

Key Parameters

Parameter	Value
Voltage - DC Reverse (Vr) (Max)	200 V
Current - Average Rectified (Io)	250 mA
Voltage - Forward (Vf) (Max) @ If	1.25 V @ 200 mA
Reverse Recovery Time (trr)	50 ns
Current - Reverse Leakage @ Vr	100 nA @ 200 V
Capacitance @ Vr, F	5 pF @ 0 V, 1 MHz
Speed Classification	Fast Recovery ≤ 500 ns, > 200 mA (Io)
Operating Temperature - Junction	150°C
Mounting Type	Surface Mount, Wettable Flank
Package / Case	3-XDFN Exposed Pad
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the BAS21QBZ is determined by electrical and mechanical parameter equivalence within the BAS21 product family. The following criteria establish valid substitution:

Electrical Parameters (Must Match):

Voltage - DC Reverse (Vr) (Max): 200 V
Current - Average Rectified (Io): 250 mA
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA
Reverse Recovery Time (trr): 50 ns
Current - Reverse Leakage @ Vr: 100 nA @ 200 V
Capacitance @ Vr, F: 5 pF @ 0 V, 1 MHz
Speed Classification: Fast Recovery ≤ 500 ns, > 200 mA (Io)
Operating Temperature - Junction: 150°C

Mechanical Parameters (Must Match):

Mounting Type: Surface Mount, Wettable Flank
Package / Case: 3-XDFN Exposed Pad

Compliance Parameters (Must Match):

RoHS Status: ROHS3 Compliant
REACH Status: REACH Unaffected

The substitute parts BAS21QB-QZ and BAS21QC-QZ meet all electrical and mechanical requirements for direct substitution. Both parts are in active product status and carry automotive-grade qualification (AEC-Q100). The primary distinction between substitutes relates to supplier device package designation and moisture sensitivity level, which do not affect electrical performance or functional compatibility.

Parameter Comparison

Parameter	BAS21QBZ (Main)	BAS21QB-QZ (Substitute)	BAS21QC-QZ (Substitute)
Manufacturer	Nexperia USA Inc.	Nexperia USA Inc.	Nexperia USA Inc.
Product Status	Obsolete	Active	Active
Voltage - DC Reverse (Vr) (Max)	200 V	200 V	200 V
Current - Average Rectified (Io)	250 mA	250 mA	250 mA
Voltage - Forward (Vf) (Max) @ If	1.25 V @ 200 mA	1.25 V @ 200 mA	1.25 V @ 200 mA
Reverse Recovery Time (trr)	50 ns	50 ns	50 ns
Current - Reverse Leakage @ Vr	100 nA @ 200 V	100 nA @ 200 V	100 nA @ 200 V
Capacitance @ Vr, F	5 pF @ 0 V, 1 MHz	5 pF @ 0 V, 1 MHz	5 pF @ 0 V, 1 MHz
Speed Classification	Fast Recovery ≤ 500 ns, > 200 mA (Io)	Fast Recovery ≤ 500 ns, > 200 mA (Io)	Fast Recovery ≤ 500 ns, > 200 mA (Io)
Operating Temperature - Junction	150°C	150°C	150°C
Mounting Type	Surface Mount, Wettable Flank	Surface Mount, Wettable Flank	Surface Mount, Wettable Flank
Package / Case	3-XDFN Exposed Pad	3-XDFN Exposed Pad	3-XDFN Exposed Pad
Supplier Device Package	DFN1110D-3	DFN1110D-3	DFN1412D-3
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)	1 (Unlimited)	3 (168 Hours)
REACH Status	REACH Unaffected	REACH Unaffected	REACH Unaffected
Grade	Standard	Automotive	Automotive
Qualification	None Listed	AEC-Q100	AEC-Q100
Packaging Type	Not Specified	Tape & Reel (TR)	Tape & Reel (TR)

Engineering Selection Recommendations

BAS21QB-QZ is the primary recommended substitute for the obsolete BAS21QBZ. This part maintains identical electrical specifications, identical supplier device package designation (DFN1110D-3), and identical moisture sensitivity level (MSL 1 - Unlimited). The BAS21QB-QZ is in active product status with automotive-grade qualification (AEC-Q100) and is available in Tape & Reel packaging. This part is suitable for both new designs and replacement applications.

BAS21QC-QZ is a parametric equivalent substitute with identical electrical performance. The primary distinction is the supplier device package designation (DFN1412D-3) and moisture sensitivity level (MSL 3 - 168 Hours). The BAS21QC-QZ is in active product status with automotive-grade qualification (AEC-Q100) and is available in Tape & Reel packaging. This part is suitable for applications where the alternative package footprint is acceptable and moisture sensitivity requirements permit MSL 3 classification.

Both substitute parts are manufactured by Nexperia USA Inc., comply with ROHS3 and REACH requirements, and carry identical electrical and thermal specifications to the main part. Selection between BAS21QB-QZ and BAS21QC-QZ depends on specific package footprint requirements and moisture handling protocols during assembly and storage.

Frequently Asked Questions (FAQ)

Q: Can BAS21QB-QZ be used as a direct replacement for BAS21QBZ?

A: Yes. The BAS21QB-QZ meets all electrical, thermal, and mechanical specifications of the BAS21QBZ. Both parts feature identical reverse voltage (200 V), average rectified current (250 mA), forward voltage (1.25 V @ 200 mA), reverse recovery time (50 ns), and package configuration (DFN1110D-3). The BAS21QB-QZ is in active product status, making it suitable for new designs and production applications.

Q: What is the difference between BAS21QB-QZ and BAS21QC-QZ?

A: Both parts are parametric equivalents with identical electrical specifications. The primary differences are the supplier device package designation (DFN1110D-3 for BAS21QB-QZ versus DFN1412D-3 for BAS21QC-QZ) and moisture sensitivity level (MSL 1 for BAS21QB-QZ versus MSL 3 for BAS21QC-QZ). The package designation difference may affect PCB footprint and assembly considerations. The MSL difference affects moisture handling requirements during storage and assembly.

Q: Are the substitute parts automotive-qualified?

A: Yes. Both BAS21QB-QZ and BAS21QC-QZ carry automotive-grade qualification (AEC-Q100), making them suitable for automotive and high-reliability applications.

Q: What is the moisture sensitivity level (MSL) and why does it matter?

A: MSL indicates the maximum time a component can be exposed to moisture at specified temperature and humidity conditions before soldering. BAS21QB-QZ has MSL 1 (Unlimited), meaning no time restriction. BAS21QC-QZ has MSL 3 (168 Hours), requiring baking if the component is exposed to moisture for more than 168 hours before soldering. Selection depends on your assembly process and storage environment.

Q: Are both substitute parts available in the same packaging format?

A: Yes. Both BAS21QB-QZ and BAS21QC-QZ are available in Tape & Reel (TR) packaging, suitable for automated assembly processes.

Q: Do the substitute parts comply with environmental regulations?

A: Yes. Both BAS21QB-QZ and BAS21QC-QZ are ROHS3 Compliant and REACH Unaffected, meeting current environmental and regulatory requirements.

Q: Can I use BAS21QC-QZ if my design was originally specified for BAS21QBZ?

A: Electrical compatibility is confirmed. However, the different supplier device package designation (DFN1412D-3 versus DFN1110D-3) may result in different PCB footprints. Verify footprint compatibility with your PCB layout before implementation. Additionally, confirm that MSL 3 moisture sensitivity requirements are acceptable for your assembly and storage processes.

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