BAP70AM,135 Equivalent & Substitute Parts

Part Overview

The BAP70AM,135 is an RF PIN diode manufactured by NXP USA Inc., designed for radio frequency applications requiring precise switching and attenuation control. This component is a 2-pair series PIN diode with a peak reverse voltage rating of 50V and maximum power dissipation of 300 mW, housed in a 6-TSSOP package. The part is classified as obsolete, making identification of compatible substitute components essential for ongoing design support and production continuity.

Substiute Parts

BAP70AM,135

NXP USA Inc.In Stock: 772BAP70AM,135 Datasheet

Current PartRFQ

BAP70AM,115

NXP USA Inc.In Stock: 3779BAP70AM,115 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution for the BAP70AM,135 is determined by strict equivalence across the following critical parameters:

• Diode type classification (PIN - 2 Pair Series)
• Electrical ratings: 50V peak reverse voltage, 100 mA maximum current, 300 mW power dissipation
• Frequency-dependent characteristics: 0.25pF capacitance at 20V/1MHz and 1.9Ohm resistance at 100mA/100MHz
• Package compatibility: 6-TSSOP form factor
• Regulatory compliance: ROHS3 certification and MSL Level 1 rating
• Manufacturer: NXP USA Inc.

The BAP70AM,115 meets all these criteria as a parametric equivalent, differing only in packaging format (Cut Tape versus the original specification).

Parameter Comparison

Engineering Selection Recommendations

The BAP70AM,115 is a direct parametric equivalent to the BAP70AM,135. Both components share identical electrical specifications, thermal ratings, and regulatory compliance certifications. The sole distinction is packaging format: BAP70AM,135 uses standard packaging while BAP70AM,115 is supplied in Cut Tape format. Both maintain ROHS3 compliance and MSL Level 1 rating, ensuring compatibility with modern manufacturing processes and environmental standards. Selection between these variants depends on procurement and assembly requirements rather than functional performance.

Frequently Asked Questions (FAQ)

Q: Can BAP70AM,115 be used as a direct replacement for BAP70AM,135?

A: Yes. Both parts are parametrically identical across all electrical, thermal, and mechanical specifications. The difference is packaging format only.

Q: What does the packaging designation mean?

A: BAP70AM,135 and BAP70AM,115 refer to different supply formats from NXP. The numerical suffix indicates packaging configuration. Both are housed in 6-TSSOP form factor suitable for surface-mount assembly.

Q: Are there any compliance differences between these parts?

A: No. Both parts carry identical ROHS3 compliance and MSL Level 1 ratings, meeting the same regulatory and environmental standards.

Q: Why is the BAP70AM,135 marked as obsolete?

A: Obsolete status indicates the part is no longer in active production. The BAP70AM,115 variant remains available as a functional equivalent for design continuity.

Q: What are the critical parameters for RF PIN diode substitution?

A: Peak reverse voltage (50V), maximum current (100 mA), power dissipation (300 mW), capacitance characteristics (0.25pF @ 20V, 1MHz), and resistance profile (1.9Ohm @ 100mA, 100MHz) must match exactly. Package type and diode configuration (2-pair series) must also be identical.

Q: Can these parts be used interchangeably in PCB assembly?

A: Yes, provided the PCB layout accommodates the 6-TSSOP package footprint. Both parts use the same pinout and mechanical dimensions.