BAP55L,315 Equivalent & Substitute Parts

Part Overview

The BAP55L,315 is an RF Diode PIN - Single manufactured by NXP USA Inc., rated for 50V peak reverse voltage with 100 mA maximum current and 500 mW power dissipation in a DFN1006-2 package. This part is classified as Obsolete, making identification of suitable substitutes necessary for ongoing design support and procurement continuity. The BAP55L,315 operates across a temperature range of -65°C to 150°C and is ROHS3 compliant with unlimited moisture sensitivity level.

Substiute Parts

BAP55L,315

NXP USA Inc.In Stock: 1128BAP55L,315 Datasheet

Current PartRFQ

BAP55LX,315

NXP USA Inc.In Stock: 3263BAP55LX,315 Datasheet

DirectRFQ

BAR6302LE6327XTMA1

Infineon TechnologiesIn Stock: 15836BAR6302LE6327XTMA1 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the BAP55L,315 is determined by the following critical parameters:

• Diode Type: PIN - Single (required match)
• Voltage - Peak Reverse (Max): 50V (required match)
• Current - Max: 100 mA (required match)
• Package / Case: SOD-882 (required match for mechanical compatibility)
• Operating Temperature Range: Must support -65°C to 150°C minimum
• RoHS Status: ROHS3 Compliant (required for regulatory compliance)

Secondary parameters including capacitance, resistance, and power dissipation may vary within acceptable tolerances provided the primary electrical and mechanical specifications are met.

Parameter Comparison

Engineering Selection Recommendations

BAP55LX,315 (Direct Substitute - NXP USA Inc.)

The BAP55LX,315 is the direct manufacturer equivalent from NXP USA Inc. with Active product status. This part maintains identical electrical specifications for voltage, current, and capacitance. The primary difference is reduced power dissipation (135 mW versus 500 mW), which is acceptable for applications not requiring maximum power handling. Package configuration differs (2-XDFN versus DFN1006-2), requiring PCB layout verification. ROHS3 compliance and unlimited MSL rating are maintained.

BAR6302LE6327XTMA1 (MFR Recommended - Infineon Technologies)

The BAR6302LE6327XTMA1 is the manufacturer-recommended substitute from Infineon Technologies with Active product status. This part meets all critical electrical requirements (50V, 100 mA) and maintains SOD-882 package compatibility with the original BAP55L,315. Power dissipation is 250 mW, suitable for moderate power applications. Operating temperature specification lists 150°C maximum without lower bound specification. ROHS3 compliance and unlimited MSL rating are maintained. This option provides the closest mechanical compatibility.

Frequently Asked Questions (FAQ)

Q: Can BAP55LX,315 be used as a direct replacement for BAP55L,315?

A: BAP55LX,315 meets all critical electrical parameters (50V, 100 mA, 0.28pF capacitance) and maintains the same operating temperature range. However, the package differs (2-XDFN versus DFN1006-2), requiring PCB layout modification. Electrical performance is compatible for applications not requiring 500 mW power dissipation capability.

Q: What are the package compatibility considerations?

A: BAP55L,315 uses DFN1006-2 package. BAP55LX,315 uses 2-XDFN package, requiring different PCB footprints. BAR6302LE6327XTMA1 uses SOD-882 package, which is mechanically compatible with the original DFN1006-2 specification. Package selection depends on available PCB real estate and existing design constraints.

Q: Are all substitutes ROHS3 compliant?

A: Yes. BAP55LX,315 and BAR6302LE6327XTMA1 are both ROHS3 compliant, matching the original BAP55L,315 compliance status.

Q: What is the significance of product status differences?

A: BAP55L,315 is Obsolete, while both BAP55LX,315 and BAR6302LE6327XTMA1 are Active. Active status indicates ongoing manufacturing and availability, supporting long-term procurement continuity.

Q: How do power dissipation differences affect selection?

A: BAP55L,315 is rated 500 mW, BAP55LX,315 is 135 mW, and BAR6302LE6327XTMA1 is 250 mW. Selection depends on circuit power requirements. Lower-rated parts are suitable for applications with reduced power dissipation demands.