BAP142LX,315 Equivalent & Substitute Parts

Part Overview

The BAP142LX,315 is an RF Diode PIN - Single device manufactured by NXP USA Inc., rated for 50V peak reverse voltage with 100 mA maximum current and 130 mW power dissipation in SOD-882 packaging. This component is classified as obsolete, making substitute parts necessary for new designs and ongoing production requirements. The device operates across the temperature range of -65°C to 150°C (TJ) and is ROHS3 compliant with unlimited moisture sensitivity level (MSL 1).

Substiute Parts

BAP142LX,315

NXP USA Inc.In Stock: 1076BAP142LX,315 Datasheet

Current PartRFQ

BAP55LX,315

NXP USA Inc.In Stock: 3263BAP55LX,315 Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the BAP142LX,315 is determined by the following critical parameters:

• Diode Type: PIN - Single (functional equivalence)
• Voltage - Peak Reverse (Max): 50V (electrical rating match)
• Current - Max: 100 mA (current handling capability)
• Operating Temperature Range: -65°C ~ 150°C (TJ) (thermal compatibility)
• RoHS Status: ROHS3 Compliant (regulatory compliance)
• REACH Status: REACH Unaffected (regulatory compliance)

The BAP55LX,315 qualifies as a direct substitute based on matching electrical specifications across voltage, current, and temperature ratings. While packaging differs (DFN1006D-2 versus SOD-882), the electrical performance parameters remain equivalent within the allowed tolerances for RF PIN diode applications.

Parameter Comparison

Engineering Selection Recommendations

The BAP55LX,315 is the qualified substitute for the obsolete BAP142LX,315. Both components maintain identical electrical ratings for voltage, current, and temperature operation. The BAP55LX,315 offers the advantage of active product status, ensuring continued availability and manufacturing support from NXP USA Inc.

Both parts satisfy ROHS3 compliance and REACH unaffected status, meeting current regulatory requirements. The primary design consideration is the package transition from SOD-882 to 2-XDFN (DFN1006D-2), which requires PCB layout modification. The electrical performance parameters remain within acceptable tolerances for RF PIN diode applications.

Frequently Asked Questions (FAQ)

Q: Can BAP55LX,315 directly replace BAP142LX,315 in existing designs?

A: Electrical substitution is valid based on matching voltage, current, and temperature ratings. PCB layout redesign is required due to package differences (SOD-882 to 2-XDFN).

Q: What are the key differences between these parts?

A: The BAP55LX,315 features lower forward resistance (800mOhm versus 1.3Ohm at 100mA, 100MHz) and slightly higher power dissipation capability (135 mW versus 130 mW). Package form factor differs between SOD-882 and 2-XDFN.

Q: Are both parts compliant with current regulations?

A: Yes. Both BAP142LX,315 and BAP55LX,315 are ROHS3 compliant and REACH unaffected.

Q: Why is BAP142LX,315 obsolete?

A: Product status reflects NXP USA Inc. discontinuation. The BAP55LX,315 represents the active alternative for new designs.

Q: Does packaging affect electrical performance?

A: Packaging does not alter the electrical specifications. Package selection is determined by PCB design requirements and thermal management considerations.