BA12003B Equivalent & Substitute Parts

Part Overview

The BA12003B is a 7/0 Darlington Array interface IC manufactured by Rohm Semiconductor in a 16-DIP through-hole package. This component is classified as obsolete, making equivalent and substitute parts necessary for ongoing system support and new design considerations. The BA12003B serves as a high-current driver array suitable for relay, solenoid, and lamp applications requiring low-side switching configurations.

Substiute Parts

BA12003B

Rohm SemiconductorIn Stock: 21675BA12003B Datasheet

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BA12003DF-ZE2

Rohm SemiconductorIn Stock: 2901BA12003DF-ZE2 Datasheet

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TBD62003APG

Toshiba Semiconductor and StorageIn Stock: 63468TBD62003APG Datasheet

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ULN2003AN

Texas InstrumentsIn Stock: 55198ULN2003AN Datasheet

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ULN2004AD16-U

Diodes IncorporatedIn Stock: 2332ULN2004AD16-U Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution for the BA12003B is determined by the following critical parameters:

• Output Configuration: Low-side switching with 7 independent outputs
• Package Type: 16-DIP through-hole form factor for direct PCB compatibility
• Output Current Rating: 500mA maximum per channel
• Load Voltage: 50V maximum rating
• Input/Output Ratio: 1:1 configuration
• Interface Type: Parallel inverting logic
• Compliance: ROHS3 compliance and EAR99 classification

Substitute parts must maintain compatibility across these parameters to ensure functional equivalence in existing designs. The BA12003DF-ZE2 represents a direct Rohm equivalent with surface-mount packaging. The TBD62003APG (Toshiba), ULN2003AN (Texas Instruments), and ULN2004AD16-U (Diodes Incorporated) provide functional alternatives with identical electrical specifications and through-hole packaging.

Parameter Comparison

Engineering Selection Recommendations

For Direct PCB Replacement (Through-Hole 16-DIP):

The TBD62003APG (Toshiba) is the primary recommendation for new designs requiring through-hole mounting. This part maintains active product status, supports the full -40°C to 85°C operating range, and provides identical electrical specifications to the BA12003B. The ULN2003AN (Texas Instruments) offers equivalent functionality with active status and established supply chain availability, though with a narrower operating temperature range (-40°C to 70°C).

For Surface-Mount Migration:

The BA12003DF-ZE2 provides a direct Rohm equivalent in 16-SOIC surface-mount packaging. This part extends the operating temperature range to -40°C to 85°C and maintains ROHS3 compliance. Surface-mount conversion requires PCB redesign but offers improved thermal performance and reduced board space.

For Extended Temperature Applications:

The ULN2004AD16-U supports the widest operating temperature range (-40°C to 105°C) among available substitutes, though it carries obsolete product status. This part is suitable for legacy system maintenance where temperature extremes are a design requirement.

All substitute parts maintain ROHS3 compliance and EAR99 export classification consistent with the original BA12003B specification.

Frequently Asked Questions (FAQ)

Q: Can the BA12003DF-ZE2 replace the BA12003B directly on existing PCBs?

A: No. The BA12003DF-ZE2 uses 16-SOIC surface-mount packaging while the BA12003B uses 16-DIP through-hole packaging. PCB redesign is required for this substitution. For direct PCB replacement, use TBD62003APG or ULN2003AN in 16-DIP through-hole packages.

Q: What are the key electrical parameters that determine substitution compatibility?

A: Substitution compatibility is determined by: 7 independent low-side outputs, 1:1 input-to-output ratio, 500mA maximum output current per channel, 50V maximum load voltage rating, and parallel inverting logic interface. All listed substitutes meet these specifications.

Q: Are there temperature range limitations when substituting the BA12003B?

A: The BA12003B operates from -25°C to 75°C. Most substitutes extend this range to -40°C to 85°C or wider. If the original design operates within the BA12003B temperature range, all substitutes are compatible. For applications requiring the original -25°C to 75°C range specifically, verify the substitute's lower temperature limit does not exceed -25°C.

Q: Which substitute is recommended for new designs?

A: The TBD62003APG (Toshiba) is recommended for new designs. It maintains active product status, provides through-hole 16-DIP packaging for direct compatibility with legacy designs, and supports the extended -40°C to 85°C operating range with ROHS3 compliance.

Q: Do all substitutes maintain the same pin configuration?

A: All through-hole 16-DIP substitutes (TBD62003APG, ULN2003AN, ULN2004AD16-U) maintain identical pin configurations and are direct drop-in replacements. The BA12003DF-ZE2 uses a different 16-SOIC surface-mount package and requires PCB redesign.

Q: What is the difference between Darlington and NPN output types in these substitutes?

A: Darlington output types (BA12003B, BA12003DF-ZE2, ULN2003AN) use compound transistor structures for higher current gain. NPN output types (ULN2004AD16-U) use single transistors. Both configurations support identical 500mA output current ratings and 50V load voltage specifications. Selection depends on application-specific switching speed and saturation voltage requirements not specified in the provided parameters.