B58195XP-TP Equivalent & Substitute Parts

Part Overview

The B58195XP-TP is a Schottky diode manufactured by Micro Commercial Co, rated for 40V DC reverse voltage and 1.5A average rectified current in a surface mount 0603 (1608 Metric) package. This component is classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing design requirements and procurement needs. Substitute parts must maintain electrical performance across voltage, current, and thermal specifications while accommodating package and mounting variations.

Substiute Parts

B58195XP-TP

Micro Commercial CoIn Stock: 897B58195XP-TP Datasheet

Current PartRFQ

PMEG4015EPK,315

Nexperia USA Inc.In Stock: 75014PMEG4015EPK,315 Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the B58195XP-TP are identified based on strict electrical and mechanical parameter matching within the Schottky diode category. The substitution criteria are:

Primary Matching Parameters:

• Voltage - DC Reverse (Vr) (Max): 40V minimum
• Current - Average Rectified (Io): 1.5A minimum
• Technology: Schottky
• Mounting Type: Surface Mount
• Speed Classification: Fast Recovery ≤ 500ns, > 200mA (Io)

Secondary Compatibility Parameters:

• Forward voltage (Vf) within acceptable operating range
• Reverse leakage current performance
• RoHS3 compliance
• MSL rating of 1 or equivalent

The PMEG4015EPK,315 meets all primary and secondary criteria, with enhanced specifications in reverse leakage current and operating temperature range. Package form factor differs (DFN1608D-2 versus FBP-02L), but both are surface mount configurations suitable for PCB integration.

Parameter Comparison

Engineering Selection Recommendations

The PMEG4015EPK,315 is a direct functional substitute for the obsolete B58195XP-TP. Both components share identical voltage and current ratings (40V, 1.5A) and fast recovery Schottky technology. The substitute part offers measurable improvements in reverse leakage current (5 µA versus 50 µA) and higher maximum junction temperature (150°C versus 125°C), providing enhanced thermal margin and reduced leakage performance.

The PMEG4015EPK,315 carries active product status from Nexperia USA Inc., ensuring long-term availability and supply chain continuity. Both parts maintain ROHS3 compliance and MSL 1 ratings, satisfying environmental and moisture handling requirements.

Package differences exist between the original FBP-02L and substitute DFN1608D-2 configurations. Both are surface mount packages suitable for automated PCB assembly. Design verification of PCB footprint compatibility is required prior to implementation, as physical dimensions and pad layouts differ between package types.

The PMEG4015EPK,315 includes automotive-grade qualification (AEC-Q100), providing additional reliability assurance for applications requiring automotive standards compliance.

Frequently Asked Questions (FAQ)

Q: Can the PMEG4015EPK,315 directly replace the B58195XP-TP without circuit modification?

A: Electrical substitution is valid based on matching voltage (40V), current (1.5A), and Schottky technology specifications. PCB layout modification is required due to package differences (FBP-02L versus DFN1608D-2). Footprint redesign and revalidation are necessary before production implementation.

Q: What are the key electrical differences between these parts?

A: Forward voltage differs by 30 mV at rated current (580 mV versus 610 mV @ 1.5A). Reverse leakage current is significantly lower in the substitute (5 µA versus 50 µA @ 40V). Maximum junction temperature is 25°C higher (150°C versus 125°C). These differences favor the substitute part in thermal and leakage performance.

Q: Are both parts RoHS compliant?

A: Yes. Both B58195XP-TP and PMEG4015EPK,315 are ROHS3 compliant with MSL 1 (Unlimited) moisture sensitivity ratings.

Q: What is the significance of the automotive qualification on the substitute part?

A: The PMEG4015EPK,315 carries AEC-Q100 automotive qualification, indicating compliance with automotive reliability and testing standards. This qualification is not specified for the original B58195XP-TP. Applications requiring automotive-grade components benefit from this additional certification.

Q: How do the package differences affect component selection?

A: The original uses FBP-02L package (0603 metric equivalent), while the substitute uses DFN1608D-2 (2-XDFN). Both are surface mount configurations, but physical dimensions, pad layouts, and PCB footprints differ. Design teams must verify footprint compatibility and update assembly documentation accordingly.

Q: Is the PMEG4015EPK,315 available in the same packaging format?

A: No. The substitute is supplied in Tape & Reel (TR) format, while original packaging information is not specified. Verify packaging and reel specifications with supplier documentation to confirm compatibility with automated assembly equipment.

Q: What is the reverse recovery time specification, and why does it matter?

A: The PMEG4015EPK,315 specifies reverse recovery time (trr) of 4 ns. This parameter is not provided for the original part. Reverse recovery time affects switching speed and is relevant for high-frequency applications. The specified value confirms fast recovery Schottky performance.