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RF Duplexer B39212B8571P810 Equivalent & Substitute Parts
Part Overview
The B39212B8571P810 is an RF duplexer manufactured by Qualcomm, designed for RF front-end (RFFE) filtering applications. This component operates across dual frequency bands: 1.71GHz to 1.755GHz (low band) and 2.11GHz to 2.155GHz (high band). The device is packaged in a 9-SMD, No Lead surface mount configuration.
The B39212B8571P810 is classified as obsolete. Locating equivalent or substitute components is necessary for ongoing system support, maintenance, and new design implementations where this specific model is no longer available from primary distribution channels.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer | Qualcomm |
| Product Category | RF Front-End (RFFE) Filters |
| Component Type | Duplexer |
| Low Frequency Band | 1.71GHz – 1.755GHz |
| High Frequency Band | 2.11GHz – 2.155GHz |
| Low Band Attenuation (min/max) | 45.00dB / 63.00dB |
| High Band Attenuation (min/max) | 42.00dB / 46.00dB |
| Mounting Type | Surface Mount |
| Package Type | 9-SMD, No Lead |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | MSL 3 (168 Hours) |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution eligibility for the B39212B8571P810 is determined by the following critical parameters:
Frequency Band Compatibility: The substitute component must operate across the identical frequency bands: 1.71GHz to 1.755GHz (low band) and 2.11GHz to 2.155GHz (high band). This is a non-negotiable requirement for functional equivalence.
Attenuation Performance: The substitute must meet or exceed the specified attenuation ranges. Low band attenuation must fall within 45.00dB to 63.00dB; high band attenuation must fall within 42.00dB to 46.00dB.
Mounting and Packaging: The component must be surface mount technology (SMT) compatible. While package variations (9-SMD versus 8-SMD) may exist, both must be No Lead configurations suitable for automated assembly.
Compliance and Environmental Standards: The substitute must maintain ROHS3 compliance and equivalent moisture sensitivity ratings to ensure compatibility with existing manufacturing and storage protocols.
Manufacturer Consistency: Qualcomm RF duplexer components within the B-series maintain consistent electrical and mechanical design standards, supporting cross-series substitution within defined parameter boundaries.
Parameter Comparison
| Parameter | B39212B8571P810 (Main Part) | B39212B8524P810 (Substitute) |
|---|---|---|
| Manufacturer | Qualcomm | Qualcomm |
| Component Type | Duplexer | Duplexer |
| Low Frequency Band | 1.71GHz – 1.755GHz | 1.71GHz – 1.755GHz |
| High Frequency Band | 2.11GHz – 2.155GHz | 2.11GHz – 2.155GHz |
| Low Band Attenuation (min/max) | 45.00dB / 63.00dB | 45.00dB / 60.00dB |
| High Band Attenuation (min/max) | 42.00dB / 46.00dB | 42.00dB / 46.00dB |
| Mounting Type | Surface Mount | Surface Mount |
| Package Type | 9-SMD, No Lead | 8-SMD, No Lead |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | MSL 3 (168 Hours) | MSL 3 (168 Hours) |
| Product Status | Obsolete | Active |
Engineering Selection Recommendations
B39212B8524P810 as Primary Substitute
The B39212B8524P810 is the qualified substitute for the obsolete B39212B8571P810. Both components share identical frequency band specifications and equivalent attenuation performance across the operating ranges. The substitute maintains ROHS3 compliance and identical moisture sensitivity ratings, ensuring compatibility with existing manufacturing and storage requirements.
The B39212B8524P810 is currently in active production status with confirmed inventory availability (1550 pieces in stock), providing supply chain continuity for ongoing applications.
Package Consideration
The primary difference between the main part and substitute is the package configuration: the B39212B8571P810 uses a 9-SMD, No Lead package, while the B39212B8524P810 uses an 8-SMD, No Lead package. Both are surface mount, No Lead configurations. PCB layout and assembly process compatibility must be evaluated based on specific footprint requirements of the target application.
Attenuation Performance
The low band attenuation maximum specification for the B39212B8524P810 is 60.00dB, compared to 63.00dB for the B39212B8571P810. This represents a 3dB reduction in maximum attenuation. For applications where maximum attenuation performance is critical, this specification difference must be evaluated against system requirements.
Frequently Asked Questions (FAQ)
Q: Can the B39212B8524P810 directly replace the B39212B8571P810 in existing designs?
A: Functional substitution is supported based on matching frequency bands, attenuation ranges, and compliance standards. However, the package difference (9-SMD versus 8-SMD) requires PCB footprint verification. Physical layout compatibility must be confirmed before implementation.
Q: What is the significance of the product status difference (Obsolete versus Active)?
A: The B39212B8571P810 is obsolete and no longer manufactured. The B39212B8524P810 is in active production with confirmed inventory. For new designs or ongoing support, the active substitute provides supply chain reliability and manufacturing continuity.
Q: Are the frequency band specifications identical between these components?
A: Yes. Both components operate across the same frequency bands: 1.71GHz to 1.755GHz (low band) and 2.11GHz to 2.155GHz (high band). Frequency band compatibility is confirmed.
Q: What is the impact of the 3dB attenuation difference in the low band maximum specification?
A: The B39212B8524P810 specifies a maximum low band attenuation of 60.00dB versus 63.00dB for the B39212B8571P810. This difference must be evaluated against system filtering requirements. If the application requires attenuation exceeding 60.00dB in the low band, the substitute may not meet performance criteria.
Q: Are both components RoHS compliant?
A: Yes. Both the B39212B8571P810 and B39212B8524P810 are ROHS3 compliant and maintain identical moisture sensitivity levels (MSL 3, 168 Hours).
Q: What is the difference between the 9-SMD and 8-SMD package configurations?
A: Both are surface mount, No Lead packages. The primary difference is the number of solder pads and physical footprint dimensions. PCB design and assembly equipment compatibility must be verified for the specific package type before component selection.
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