AX7DBF3-500.0000C Equivalent & Substitute Parts

Part Overview

The AX7DBF3-500.0000C is a 500 MHz XO (Standard) LVDS oscillator manufactured by Abracon LLC, part of the ClearClock™ AX7 series. This component operates at 2.5V with Enable/Disable functionality and is housed in an 8-SMD, No Lead package. The part is discontinued at DiGi Electronics, making identification of equivalent substitutes necessary for ongoing design support and procurement.

Substiute Parts

AX7DBF3-500.0000C

Abracon LLCIn Stock: 957AX7DBF3-500.0000C Datasheet

Current PartRFQ

590FB500M000DG

Skyworks Solutions Inc.In Stock: 774590FB500M000DG Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The 590FB500M000DG from Skyworks Solutions Inc. qualifies as a direct substitute based on the following critical parameters:

• Frequency: 500 MHz (exact match)
• Output Type: LVDS (exact match)
• Supply Voltage: 2.5V (exact match)
• Function: Enable/Disable (exact match)
• Frequency Stability: ±25ppm (exact match)
• Operating Temperature Range: -40°C ~ 85°C (exact match)
• Footprint Dimensions: 0.276" L x 0.197" W / 7.00mm x 5.00mm (exact match)
• Moisture Sensitivity Level: 1 (Unlimited) (exact match)
• ECCN: EAR99 (exact match)
• HTSUS: 8542.39.0001 (exact match)

The primary differences are package configuration (6-SMD vs. 8-SMD), maximum supply current (100mA vs. 70mA), and seated height (0.071" vs. 0.075"). These differences do not preclude substitution when the application can accommodate the alternate package pinout and current specifications.

Parameter Comparison

Engineering Selection Recommendations

The 590FB500M000DG is suitable as a substitute for the AX7DBF3-500.0000C based on electrical and environmental parameter equivalence. The Skyworks part maintains active product status, ensuring continued availability and supply chain stability. Both components meet ROHS3 compliance and REACH requirements, supporting regulatory continuity in applications requiring these certifications.

The package configuration difference (6-SMD vs. 8-SMD) requires PCB layout verification to confirm pinout compatibility and signal routing feasibility. The Skyworks part operates within a higher maximum supply current specification (100mA vs. 70mA), which is acceptable in applications where power delivery can accommodate this range. The marginal height difference (0.071" vs. 0.075") is negligible for most assembly processes.

Frequently Asked Questions (FAQ)

Q: Can the 590FB500M000DG directly replace the AX7DBF3-500.0000C without PCB modifications?

A: Electrical substitution is valid based on frequency, output type, supply voltage, and stability parameters. However, the package configuration differs (6-SMD vs. 8-SMD), requiring verification of pinout compatibility and PCB layout accommodation before implementation.

Q: What are the critical parameters that define substitution eligibility?

A: Frequency (500 MHz), output type (LVDS), supply voltage (2.5V), Enable/Disable function, frequency stability (±25ppm), and operating temperature range (-40°C ~ 85°C) must match exactly. Footprint dimensions (7.00mm x 5.00mm) are identical, but package lead count and pinout configuration differ.

Q: Does the higher maximum supply current of the Skyworks part affect compatibility?

A: The 590FB500M000DG specifies 100mA maximum supply current versus 70mA for the Abracon part. This is acceptable in applications where power delivery infrastructure can support the higher specification. The disable mode current (75mA vs. 65mA) is similarly higher but remains within typical power management tolerances.

Q: Are compliance certifications equivalent between the two parts?

A: Both parts are ROHS3 compliant and REACH unaffected, with identical ECCN (EAR99) and HTSUS (8542.39.0001) classifications. Regulatory and export compliance requirements are maintained with the Skyworks substitute.

Q: What is the significance of the package height difference?

A: The Skyworks part is 0.004" (0.10mm) shorter in seated height. This difference is negligible for standard assembly processes and does not impact clearance or thermal management in typical applications.