ATXMEGA64D3-MN Equivalent & Substitute Parts

Part Overview

The ATXMEGA64D3-MN is an AVR XMEGA D3 series microcontroller manufactured by Microchip Technology, designed for embedded applications requiring 8/16-bit processing capability. This Surface Mount device operates at 32MHz with 64KB FLASH program memory and integrates multiple communication interfaces including I2C, IrDA, SPI, and UART/USART. The part maintains Active product status and is RoHS3 compliant. Identifying equivalent substitute parts is necessary when the primary packaging configuration is unavailable or when alternative supply chain options are required while maintaining identical electrical and mechanical specifications.

Key Parameters

Parameter	Value
Core Processor	AVR
Core Size	8/16-Bit
Speed	32MHz
Program Memory Size	64KB (32K x 16)
Program Memory Type	FLASH
EEPROM Size	2K x 8
RAM Size	4K x 8
Voltage Supply (Vcc/Vdd)	1.6V ~ 3.6V
Data Converters	A/D 16x12b
Number of I/O	50
Connectivity	I2C, IrDA, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT
Mounting Type	Surface Mount
Package	64-VFQFN Exposed Pad (9x9)
Operating Temperature	-40°C ~ 105°C (TA)
RoHS Status	ROHS3 Compliant
MSL Rating	3 (168 Hours)

Substitute Part Grouping Explanation

The ATXMEGA64D3-MH qualifies as a direct substitute for the ATXMEGA64D3-MN based on the following substitution criteria:

Identical Electrical Parameters:

Core Processor: AVR
Core Size: 8/16-Bit
Speed: 32MHz
Program Memory: 64KB (32K x 16) FLASH
EEPROM: 2K x 8
RAM: 4K x 8
Voltage Supply: 1.6V ~ 3.6V
Data Converters: A/D 16x12b
I/O Count: 50
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT

Identical Mechanical Parameters:

Mounting Type: Surface Mount
Package: 64-VFQFN Exposed Pad (9x9)
MSL Rating: 3 (168 Hours)

Compliance Match:

RoHS3 Compliant
REACH Unaffected

The primary difference between these parts is packaging configuration (Tube vs. Tray) and operating temperature range specification. Both parts share the same base product number ATXMEGA64 and are manufactured by Microchip Technology with Active product status.

Parameter Comparison

Parameter	ATXMEGA64D3-MN	ATXMEGA64D3-MH	Match
Manufacturer	Microchip Technology	Microchip Technology	✓
Series	AVR® XMEGA® D3	AVR® XMEGA® D3	✓
Core Processor	AVR	AVR	✓
Core Size	8/16-Bit	8/16-Bit	✓
Speed	32MHz	32MHz	✓
Program Memory Size	64KB (32K x 16)	64KB (32K x 16)	✓
Program Memory Type	FLASH	FLASH	✓
EEPROM Size	2K x 8	2K x 8	✓
RAM Size	4K x 8	4K x 8	✓
Voltage Supply (Vcc/Vdd)	1.6V ~ 3.6V	1.6V ~ 3.6V	✓
Data Converters	A/D 16x12b	A/D 16x12b	✓
Number of I/O	50	50	✓
Connectivity	I2C, IrDA, SPI, UART/USART	I2C, IrDA, SPI, UART/USART	✓
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT	✓
Mounting Type	Surface Mount	Surface Mount	✓
Package / Case	64-VFQFN Exposed Pad	64-VFQFN Exposed Pad	✓
Supplier Device Package	64-QFN (9x9)	64-QFN (9x9)	✓
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 85°C (TA)	Partial
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	✓
MSL Rating	3 (168 Hours)	3 (168 Hours)	✓
Product Status	Active	Active	✓
Packaging Configuration	Tube	Tray	Different

Engineering Selection Recommendations

Both ATXMEGA64D3-MN and ATXMEGA64D3-MH are Active products manufactured by Microchip Technology with identical RoHS3 compliance and REACH status. The ATXMEGA64D3-MH is designated as the manufacturer-recommended substitute and maintains all critical electrical and mechanical specifications required for direct component substitution.

The operating temperature range difference (-40°C ~ 105°C for ATXMEGA64D3-MN versus -40°C ~ 85°C for ATXMEGA64D3-MH) must be evaluated against specific application requirements. Applications operating within the -40°C ~ 85°C range can use either part interchangeably. Applications requiring operation above 85°C must use the ATXMEGA64D3-MN.

The packaging configuration difference (Tube versus Tray) affects supply chain logistics and handling procedures but does not impact electrical or mechanical compatibility. Selection between these parts should be based on application temperature requirements and packaging availability.

Frequently Asked Questions (FAQ)

Q: Can ATXMEGA64D3-MH replace ATXMEGA64D3-MN in all applications?

A: ATXMEGA64D3-MH can replace ATXMEGA64D3-MN in applications where the operating temperature does not exceed 85°C. Applications requiring operation between 85°C and 105°C must use ATXMEGA64D3-MN. All other electrical and mechanical specifications are identical.

Q: What is the difference between Tube and Tray packaging?

A: Tube and Tray are packaging configurations that affect component handling, storage, and automated assembly processes. Both configurations contain the same die and are electrically identical. Selection depends on manufacturing process requirements and supply chain logistics.

Q: Are both parts RoHS3 compliant?

A: Yes, both ATXMEGA64D3-MN and ATXMEGA64D3-MH are RoHS3 compliant and REACH unaffected.

Q: Do these parts have identical pin configurations?

A: Yes, both parts use the 64-VFQFN Exposed Pad package in 9x9mm format with 50 I/O pins. Pin configuration and functionality are identical.

Q: What is the MSL rating and why does it matter?

A: Both parts have MSL rating 3 (168 Hours), indicating moisture sensitivity level. This specifies the maximum time the component can be exposed to moisture at specified temperature and humidity conditions before soldering. Proper storage and handling procedures must be followed to maintain component reliability.

Q: Are there any differences in connectivity or peripheral features?

A: No, both parts provide identical connectivity (I2C, IrDA, SPI, UART/USART) and peripheral features (Brown-out Detect/Reset, POR, PWM, WDT).

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