ATXMEGA256D3-MN Equivalent & Substitute Parts

Part Overview

The ATXMEGA256D3-MN is an AVR XMEGA D3 microcontroller manufactured by Microchip Technology, designed for embedded applications requiring 8/16-bit processing at 32MHz with 256KB flash memory. This device is actively produced and widely used in industrial control, IoT, and consumer electronics applications. Finding equivalent or substitute parts becomes necessary when managing supply chain continuity, optimizing inventory costs, or accommodating packaging and delivery requirements from different distribution channels.

Substiute Parts

ATXMEGA256D3-MN

Microchip TechnologyIn Stock: 820ATXMEGA256D3-MN Datasheet

Current PartRFQ

ATXMEGA256D3-MH

Microchip TechnologyIn Stock: 4650ATXMEGA256D3-MH Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The ATXMEGA256D3-MN has one manufacturer-recommended substitute: ATXMEGA256D3-MH. Both parts share identical core electrical and functional specifications, including processor architecture, memory configuration, clock speed, I/O count, connectivity interfaces, and peripheral features. The substitution is valid based on the following matching parameters:

• Core Processor: AVR (identical)
• Core Size: 8/16-Bit (identical)
• Speed: 32MHz (identical)
• Program Memory: 256KB FLASH (identical)
• EEPROM: 4K x 8 (identical)
• RAM: 16K x 8 (identical)
• Voltage Supply: 1.6V ~ 3.6V (identical)
• Data Converters: A/D 16x12b (identical)
• Number of I/O: 50 (identical)
• Connectivity: I2C, IrDA, SPI, UART/USART (identical)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT (identical)
• Package / Case: 64-VFQFN Exposed Pad (identical)
• Supplier Device Package: 64-QFN (9x9) (identical)

The primary difference between these parts is the packaging format (tape and reel versus tray) and the operating temperature range specification.

Parameter Comparison

Engineering Selection Recommendations

Both ATXMEGA256D3-MN and ATXMEGA256D3-MH are active products from Microchip Technology with identical electrical specifications and functional capabilities. Selection between these parts should be based on the following factors:

Packaging Format: The ATXMEGA256D3-MN is supplied in tape and reel format, while the ATXMEGA256D3-MH is supplied in tray format. Choose based on your assembly process requirements and volume needs.

Operating Temperature Range: The ATXMEGA256D3-MN supports an operating temperature range of -40°C to 105°C, while the ATXMEGA256D3-MH supports -40°C to 85°C. For applications requiring operation above 85°C, the ATXMEGA256D3-MN is the appropriate choice.

Compliance: Both parts are ROHS3 compliant, REACH unaffected, and carry identical moisture sensitivity ratings (MSL 3, 168 hours). Both are suitable for regulated and industrial applications.

Inventory Availability: Current inventory levels differ between the two variants. Verify availability with your supplier based on your procurement timeline.

Frequently Asked Questions (FAQ)

Q: Can ATXMEGA256D3-MH be used as a direct replacement for ATXMEGA256D3-MN in all applications?

A: ATXMEGA256D3-MH can be used as a direct replacement in applications where the operating temperature does not exceed 85°C. If your application requires operation at temperatures between 85°C and 105°C, ATXMEGA256D3-MN must be used.

Q: What is the difference between the -MN and -MH packaging designations?

A: The -MN designation indicates tape and reel packaging, while -MH indicates tray packaging. Both contain identical die and electrical specifications. The packaging difference affects handling, storage, and assembly processes.

Q: Are both parts pin-compatible?

A: Yes. Both ATXMEGA256D3-MN and ATXMEGA256D3-MH use the 64-VFQFN Exposed Pad package with 64-QFN (9x9) dimensions. Pin assignments and PCB footprints are identical.

Q: Do both parts require the same firmware and software?

A: Yes. The AVR processor core, memory configuration, and peripheral set are identical between both parts. Firmware compiled for one part will execute identically on the other.

Q: What is the moisture sensitivity level, and how does it affect handling?

A: Both parts carry MSL 3 rating with a 168-hour floor life. This means the component can be exposed to ambient conditions (typically 30°C/60% RH) for up to 168 hours after moisture barrier bag opening before soldering. Proper storage in dry conditions is required to maintain this rating.

Q: Are there any compliance or certification differences between the two parts?

A: No. Both parts carry identical RoHS3 compliance, REACH unaffected status, and regulatory classifications (ECCN and HTSUS codes differ slightly but reflect packaging format differences, not functional differences).