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ATXMEGA256A3B-AU Equivalent & Substitute Parts
Part Overview
The ATXMEGA256A3B-AU is an AVR XMEGA A3B microcontroller manufactured by Microchip Technology, featuring 8/16-bit processing at 32MHz with 256KB FLASH memory. This device is classified as obsolete, making identification of compatible substitute parts essential for ongoing design support and production continuity. The ATXMEGA256A3B-AU operates across a supply voltage range of 1.6V to 3.6V and integrates comprehensive peripheral support including I2C, IrDA, SPI, and UART/USART connectivity.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | ATXMEGA256A3B-AU |
| Manufacturer | Microchip Technology |
| Core Processor | AVR |
| Core Size | 8/16-Bit |
| Speed | 32MHz |
| Program Memory Size | 256KB (128K x 16) |
| Program Memory Type | FLASH |
| EEPROM Size | 4K x 8 |
| RAM Size | 16K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.6V ~ 3.6V |
| Data Converters | A/D 16x12b; D/A 2x12b |
| Number of I/O | 49 |
| Connectivity | I2C, IrDA, SPI, UART/USART |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package / Case | 64-TQFP (14x14) |
| Mounting Type | Surface Mount |
| Product Status | Obsolete |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution of the ATXMEGA256A3B-AU is determined by strict alignment of the following electrical and mechanical parameters:
Core Electrical Parameters (Must Match):
- Core Processor: AVR
- Core Size: 8/16-Bit
- Speed: 32MHz
- Program Memory Size: 256KB (128K x 16)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.6V ~ 3.6V
- Data Converters: A/D 16x12b; D/A 2x12b
- Operating Temperature: -40°C ~ 85°C (TA)
Mechanical Parameters (Allowable Variation):
- Package / Case: Different package types permitted (TQFP vs. QFN) provided pin count and functionality remain compatible
- Mounting Type: Surface Mount (consistent across all candidates)
Connectivity & Peripherals (Allowable Enhancement):
- Substitute parts may include additional connectivity options (such as USB) beyond the original specification
- Peripheral feature sets must include all features present in the main part
The ATXMEGA256A3U-MH qualifies as a direct substitute based on matching all core electrical parameters while offering an alternative package form factor (64-QFN vs. 64-TQFP) and enhanced connectivity (addition of USB support).
Parameter Comparison
| Parameter | ATXMEGA256A3B-AU | ATXMEGA256A3U-MH |
|---|---|---|
| Manufacturer | Microchip Technology | Microchip Technology |
| Core Processor | AVR | AVR |
| Core Size | 8/16-Bit | 8/16-Bit |
| Speed | 32MHz | 32MHz |
| Program Memory Size | 256KB (128K x 16) | 256KB (128K x 16) |
| Program Memory Type | FLASH | FLASH |
| EEPROM Size | 4K x 8 | 4K x 8 |
| RAM Size | 16K x 8 | 16K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.6V ~ 3.6V | 1.6V ~ 3.6V |
| Data Converters | A/D 16x12b; D/A 2x12b | A/D 16x12b; D/A 2x12b |
| Number of I/O | 49 | 50 |
| Connectivity | I2C, IrDA, SPI, UART/USART | I2C, IrDA, SPI, UART/USART, USB |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Package / Case | 64-TQFP (14x14) | 64-VFQFN Exposed Pad (9x9) |
| Mounting Type | Surface Mount | Surface Mount |
| Product Status | Obsolete | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
Engineering Selection Recommendations
The ATXMEGA256A3U-MH is a qualified substitute for the obsolete ATXMEGA256A3B-AU based on electrical equivalence across all core parameters. Both devices maintain identical processor architecture, memory configuration, supply voltage range, and data converter specifications.
The primary distinction is package form factor: the ATXMEGA256A3B-AU uses a 64-TQFP (14x14mm) package, while the ATXMEGA256A3U-MH employs a 64-VFQFN (9x9mm) package with exposed pad. This represents a reduction in board footprint and thermal profile. The ATXMEGA256A3U-MH provides one additional I/O pin (50 vs. 49) and includes USB connectivity as an enhancement.
Both parts maintain ROHS3 compliance and identical moisture sensitivity specifications. The ATXMEGA256A3U-MH carries active product status, ensuring ongoing availability and manufacturing support compared to the obsolete status of the original part.
Frequently Asked Questions (FAQ)
Q: Are the ATXMEGA256A3B-AU and ATXMEGA256A3U-MH pin-compatible?
A: Both devices feature 64-pin packages with identical electrical specifications. However, physical pin layout differs due to package geometry differences (TQFP vs. VFQFN). PCB redesign is required to accommodate the different package footprint.
Q: What is the primary advantage of the ATXMEGA256A3U-MH package?
A: The 64-VFQFN package reduces board area by approximately 60% compared to the 64-TQFP package. The exposed pad provides improved thermal dissipation characteristics.
Q: Does the ATXMEGA256A3U-MH provide additional functionality?
A: The ATXMEGA256A3U-MH includes USB connectivity in addition to the I2C, IrDA, SPI, and UART/USART interfaces present in the ATXMEGA256A3B-AU. All other electrical and peripheral specifications remain identical.
Q: Are both parts compliant with current regulatory standards?
A: Both the ATXMEGA256A3B-AU and ATXMEGA256A3U-MH are ROHS3 compliant and REACH unaffected. Moisture sensitivity level is identical at MSL 3 (168 Hours).
Q: What is the impact of the one additional I/O pin in the ATXMEGA256A3U-MH?
A: The ATXMEGA256A3U-MH provides 50 I/O pins versus 49 in the ATXMEGA256A3B-AU. This additional pin is available for application-specific use and does not affect compatibility with designs utilizing the original 49-pin configuration.
Q: Is the ATXMEGA256A3U-MH suitable for new designs?
A: The ATXMEGA256A3U-MH carries active product status, making it the appropriate choice for new designs. The ATXMEGA256A3B-AU is obsolete and should not be selected for new applications.
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