ATXMEGA256A3B-AU Equivalent & Substitute Parts

Part Overview

The ATXMEGA256A3B-AU is an AVR XMEGA A3B microcontroller manufactured by Microchip Technology, featuring 8/16-bit processing at 32MHz with 256KB FLASH memory. This device is classified as obsolete, making identification of compatible substitute parts essential for ongoing design support and production continuity. The ATXMEGA256A3B-AU operates across a supply voltage range of 1.6V to 3.6V and integrates comprehensive peripheral support including I2C, IrDA, SPI, and UART/USART connectivity.

Substiute Parts

ATXMEGA256A3B-AU
Microchip TechnologyIn Stock: 874ATXMEGA256A3B-AU Datasheet
ATXMEGA256A3B-AU
Current Part
ATXMEGA256A3U-MH
Microchip TechnologyIn Stock: 2542ATXMEGA256A3U-MH Datasheet
ATXMEGA256A3U-MH
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number ATXMEGA256A3B-AU
Manufacturer Microchip Technology
Core Processor AVR
Core Size 8/16-Bit
Speed 32MHz
Program Memory Size 256KB (128K x 16)
Program Memory Type FLASH
EEPROM Size 4K x 8
RAM Size 16K x 8
Voltage - Supply (Vcc/Vdd) 1.6V ~ 3.6V
Data Converters A/D 16x12b; D/A 2x12b
Number of I/O 49
Connectivity I2C, IrDA, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 64-TQFP (14x14)
Mounting Type Surface Mount
Product Status Obsolete
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the ATXMEGA256A3B-AU is determined by strict alignment of the following electrical and mechanical parameters:

Core Electrical Parameters (Must Match):

  • Core Processor: AVR
  • Core Size: 8/16-Bit
  • Speed: 32MHz
  • Program Memory Size: 256KB (128K x 16)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 1.6V ~ 3.6V
  • Data Converters: A/D 16x12b; D/A 2x12b
  • Operating Temperature: -40°C ~ 85°C (TA)

Mechanical Parameters (Allowable Variation):

  • Package / Case: Different package types permitted (TQFP vs. QFN) provided pin count and functionality remain compatible
  • Mounting Type: Surface Mount (consistent across all candidates)

Connectivity & Peripherals (Allowable Enhancement):

  • Substitute parts may include additional connectivity options (such as USB) beyond the original specification
  • Peripheral feature sets must include all features present in the main part

The ATXMEGA256A3U-MH qualifies as a direct substitute based on matching all core electrical parameters while offering an alternative package form factor (64-QFN vs. 64-TQFP) and enhanced connectivity (addition of USB support).

Parameter Comparison

Parameter ATXMEGA256A3B-AU ATXMEGA256A3U-MH
Manufacturer Microchip Technology Microchip Technology
Core Processor AVR AVR
Core Size 8/16-Bit 8/16-Bit
Speed 32MHz 32MHz
Program Memory Size 256KB (128K x 16) 256KB (128K x 16)
Program Memory Type FLASH FLASH
EEPROM Size 4K x 8 4K x 8
RAM Size 16K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 1.6V ~ 3.6V 1.6V ~ 3.6V
Data Converters A/D 16x12b; D/A 2x12b A/D 16x12b; D/A 2x12b
Number of I/O 49 50
Connectivity I2C, IrDA, SPI, UART/USART I2C, IrDA, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT Brown-out Detect/Reset, DMA, POR, PWM, WDT
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Package / Case 64-TQFP (14x14) 64-VFQFN Exposed Pad (9x9)
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)

Engineering Selection Recommendations

The ATXMEGA256A3U-MH is a qualified substitute for the obsolete ATXMEGA256A3B-AU based on electrical equivalence across all core parameters. Both devices maintain identical processor architecture, memory configuration, supply voltage range, and data converter specifications.

The primary distinction is package form factor: the ATXMEGA256A3B-AU uses a 64-TQFP (14x14mm) package, while the ATXMEGA256A3U-MH employs a 64-VFQFN (9x9mm) package with exposed pad. This represents a reduction in board footprint and thermal profile. The ATXMEGA256A3U-MH provides one additional I/O pin (50 vs. 49) and includes USB connectivity as an enhancement.

Both parts maintain ROHS3 compliance and identical moisture sensitivity specifications. The ATXMEGA256A3U-MH carries active product status, ensuring ongoing availability and manufacturing support compared to the obsolete status of the original part.

Frequently Asked Questions (FAQ)

Q: Are the ATXMEGA256A3B-AU and ATXMEGA256A3U-MH pin-compatible?

A: Both devices feature 64-pin packages with identical electrical specifications. However, physical pin layout differs due to package geometry differences (TQFP vs. VFQFN). PCB redesign is required to accommodate the different package footprint.

Q: What is the primary advantage of the ATXMEGA256A3U-MH package?

A: The 64-VFQFN package reduces board area by approximately 60% compared to the 64-TQFP package. The exposed pad provides improved thermal dissipation characteristics.

Q: Does the ATXMEGA256A3U-MH provide additional functionality?

A: The ATXMEGA256A3U-MH includes USB connectivity in addition to the I2C, IrDA, SPI, and UART/USART interfaces present in the ATXMEGA256A3B-AU. All other electrical and peripheral specifications remain identical.

Q: Are both parts compliant with current regulatory standards?

A: Both the ATXMEGA256A3B-AU and ATXMEGA256A3U-MH are ROHS3 compliant and REACH unaffected. Moisture sensitivity level is identical at MSL 3 (168 Hours).

Q: What is the impact of the one additional I/O pin in the ATXMEGA256A3U-MH?

A: The ATXMEGA256A3U-MH provides 50 I/O pins versus 49 in the ATXMEGA256A3B-AU. This additional pin is available for application-specific use and does not affect compatibility with designs utilizing the original 49-pin configuration.

Q: Is the ATXMEGA256A3U-MH suitable for new designs?

A: The ATXMEGA256A3U-MH carries active product status, making it the appropriate choice for new designs. The ATXMEGA256A3B-AU is obsolete and should not be selected for new applications.

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