ATXMEGA192D3-ANR Equivalent & Substitute Parts

Part Overview

The ATXMEGA192D3-ANR is an AVR® XMEGA® D3 series microcontroller manufactured by Microchip Technology. This 8/16-bit embedded processor operates at 32MHz with 192KB FLASH memory and is housed in a 64-TQFP surface mount package. The device is classified as Active product status and is ROHS3 compliant. Substitute parts are identified to provide alternative sourcing options when the primary part number is unavailable or when packaging requirements differ.

Substiute Parts

ATXMEGA192D3-ANR

Microchip TechnologyIn Stock: 765ATXMEGA192D3-ANR Datasheet

Current PartRFQ

ATXMEGA192D3-AUR

Microchip TechnologyIn Stock: 2067ATXMEGA192D3-AUR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the ATXMEGA192D3-ANR is determined by the following critical parameters:

• Core processor architecture (AVR)
• Series designation (AVR® XMEGA® D3)
• Core size (8/16-Bit)
• Operating speed (32MHz)
• Program memory capacity (192KB FLASH)
• EEPROM and RAM specifications (2K x 8 and 16K x 8 respectively)
• Voltage supply range (1.6V ~ 3.6V)
• Data converter specifications (A/D 16x12b)
• I/O count (50 pins)
• Connectivity interfaces (I2C, IrDA, SPI, UART/USART)
• Package type (64-TQFP)
• Compliance certifications (ROHS3, REACH Unaffected)

The ATXMEGA192D3-AUR qualifies as a direct substitute based on identical electrical specifications and package footprint. The primary distinction is packaging format: the main part uses standard packaging while the substitute is supplied in Tape & Reel format.

Parameter Comparison

Engineering Selection Recommendations

Both ATXMEGA192D3-ANR and ATXMEGA192D3-AUR are Active status products from Microchip Technology with identical electrical and functional specifications. Selection between these parts should be based on the following criteria:

ATXMEGA192D3-ANR is suitable for applications requiring the extended operating temperature range of -40°C to 105°C and standard packaging format.

ATXMEGA192D3-AUR is suitable for high-volume production environments where Tape & Reel packaging is preferred for automated assembly processes. This part operates within the -40°C to 85°C temperature range.

Both parts maintain ROHS3 compliance and REACH Unaffected status. Selection should account for assembly methodology, temperature requirements, and supply chain availability.

Frequently Asked Questions (FAQ)

Q: Are ATXMEGA192D3-ANR and ATXMEGA192D3-AUR electrically identical?

A: Yes. Both parts share identical core processor architecture, memory configuration, operating speed, voltage specifications, and peripheral interfaces. The primary difference is packaging format and maximum operating temperature specification.

Q: What is the difference between standard packaging and Tape & Reel format?

A: Standard packaging typically refers to individual unit packaging suitable for manual handling and small-quantity orders. Tape & Reel format supplies components on continuous carrier tape wound on reels, optimized for automated pick-and-place assembly equipment in high-volume manufacturing.

Q: Can ATXMEGA192D3-AUR be used in applications requiring operation above 85°C?

A: No. The ATXMEGA192D3-AUR is specified for operation up to 85°C. Applications requiring operation to 105°C must use ATXMEGA192D3-ANR.

Q: Are both parts suitable for the same PCB footprint?

A: Yes. Both parts use the 64-TQFP (14x14) package with identical pin configuration and footprint. PCB design compatibility is maintained between the two parts.

Q: What is the MSL rating and why is it relevant?

A: Both parts carry MSL 3 rating with 168-hour floor life. This indicates moisture sensitivity level and the maximum time the component can be exposed to ambient conditions (30°C, 60% RH) after moisture barrier bag opening before soldering. Proper storage and handling procedures must be followed to maintain component reliability.